JPH0242429U - - Google Patents

Info

Publication number
JPH0242429U
JPH0242429U JP12228788U JP12228788U JPH0242429U JP H0242429 U JPH0242429 U JP H0242429U JP 12228788 U JP12228788 U JP 12228788U JP 12228788 U JP12228788 U JP 12228788U JP H0242429 U JPH0242429 U JP H0242429U
Authority
JP
Japan
Prior art keywords
adhesive
application
die bonding
chip
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12228788U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12228788U priority Critical patent/JPH0242429U/ja
Publication of JPH0242429U publication Critical patent/JPH0242429U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図はこの考案の一実施例によるダイボンデ
イング装置のワークへの接着剤塗布及び塗布ツー
ル乾燥状態を示すダイボンデイングステージ付近
の側面図、第２図は接着剤が塗布してあるワーク
上にチツプをマウントするとともに、塗布ツール
の相対位置を切換え、一方に接着剤付着、他方を
洗浄している状態を示す側面図、第３図は塗布ツ
ールの相対位置は切換えず第１図と同様の状態を
示す側面図、第４図は再び塗布ツールの相対位置
が切換えられた第２図と同様の状態を示す側面図
、第５図は従来のダイボンデイング装置の接着剤
塗布状態を示す側面図、第６図は同じく、チツプ
をワーク上にマウントした状態の側面図、第７図
は塗布ツール面に接着剤が均一に付着している状
態の側面図、第８図は残留接着剤が除去されない
まま、新たに接着剤が付着した状態の側面図、第
９図は第８図の状態の塗布ツールに塗布され飛沫
した接着剤を示す上面図である。 図において、１７は塗布ツール回転ロツド、１
８は洗浄槽、１９は洗浄液、２０は乾燥ガス噴出
ノズルである。なお、図中、同一符号は同一又は
相当部分を示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. ＩＣ等のチツプがマウントされる箇所にスタン
    プ等によつて予め接着剤が塗布され、その上にチ
    ツプをマウントするダイボンデイング装置におい
    て、接着剤の飛沫等によるワークへのダメージを
    無くする為、スタンプ等の接着剤塗布ツールを自
    動的に洗浄する洗浄槽と、洗浄後の塗布ツールを
    乾燥させるがガスを噴出させるガス噴出ノズルと
    、洗浄と接着剤塗布を並行に行なえる２連塗布ツ
    ールとを備えたことを特徴とするダイボンデイン
    グ装置。
JP12228788U 1988-09-19 1988-09-19 Pending JPH0242429U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12228788U JPH0242429U (ja) 1988-09-19 1988-09-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12228788U JPH0242429U (ja) 1988-09-19 1988-09-19

Publications (1)

Publication Number Publication Date
JPH0242429U true JPH0242429U (ja) 1990-03-23

Family

ID=31370078

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12228788U Pending JPH0242429U (ja) 1988-09-19 1988-09-19

Country Status (1)

Country Link
JP (1) JPH0242429U (ja)

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