JPH0241916U - - Google Patents
Info
- Publication number
- JPH0241916U JPH0241916U JP12185588U JP12185588U JPH0241916U JP H0241916 U JPH0241916 U JP H0241916U JP 12185588 U JP12185588 U JP 12185588U JP 12185588 U JP12185588 U JP 12185588U JP H0241916 U JPH0241916 U JP H0241916U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- guide pin
- tip
- pin
- transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001721 transfer moulding Methods 0.000 claims 1
- 239000003708 ampul Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12185588U JPH056097Y2 (it) | 1988-09-16 | 1988-09-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12185588U JPH056097Y2 (it) | 1988-09-16 | 1988-09-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0241916U true JPH0241916U (it) | 1990-03-22 |
| JPH056097Y2 JPH056097Y2 (it) | 1993-02-17 |
Family
ID=31369247
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12185588U Expired - Lifetime JPH056097Y2 (it) | 1988-09-16 | 1988-09-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH056097Y2 (it) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0479614U (it) * | 1990-11-22 | 1992-07-10 | ||
| JPH04123534U (ja) * | 1991-04-22 | 1992-11-09 | 鹿児島日本電気株式会社 | 半導体のモールド金型 |
| JP2015088733A (ja) * | 2013-09-26 | 2015-05-07 | セイコーインスツル株式会社 | 半導体製造装置 |
| JP2017199870A (ja) * | 2016-04-28 | 2017-11-02 | Ｔｏｗａ株式会社 | 樹脂封止装置および樹脂封止方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW446622B (en) * | 1999-05-10 | 2001-07-21 | Takara Co Ltd | Arm for an elastic doll, its molding method and forming mold |
-
1988
- 1988-09-16 JP JP12185588U patent/JPH056097Y2/ja not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0479614U (it) * | 1990-11-22 | 1992-07-10 | ||
| JPH04123534U (ja) * | 1991-04-22 | 1992-11-09 | 鹿児島日本電気株式会社 | 半導体のモールド金型 |
| JP2015088733A (ja) * | 2013-09-26 | 2015-05-07 | セイコーインスツル株式会社 | 半導体製造装置 |
| JP2017199870A (ja) * | 2016-04-28 | 2017-11-02 | Ｔｏｗａ株式会社 | 樹脂封止装置および樹脂封止方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH056097Y2 (it) | 1993-02-17 |