JPH0241916U - - Google Patents
Info
- Publication number
- JPH0241916U JPH0241916U JP12185588U JP12185588U JPH0241916U JP H0241916 U JPH0241916 U JP H0241916U JP 12185588 U JP12185588 U JP 12185588U JP 12185588 U JP12185588 U JP 12185588U JP H0241916 U JPH0241916 U JP H0241916U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- guide pin
- tip
- pin
- transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001721 transfer moulding Methods 0.000 claims 1
- 239000003708 ampul Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第1図は金型チエイス部分の部分断面図、第2
図は下金型チエイスの部分平面図、第3図は第2
図の―断面図、第4図および第5図はリード
フレームのセツト状態を示す説明図である。
10……リードフレーム、11……ガイドホー
ル、20a……上金型チエイス、20b……下金
型チエイス、22a,22b……インサート、2
3……ピンブロツク、24A,24B……貫通孔
、26……ガイドピン、26a……膨大部、28
……調節ナツト、30,50……スプリング、3
6……押さえガイドピン、43……ピンブロツク
。
Figure 1 is a partial sectional view of the mold chase part, Figure 2
The figure is a partial plan view of the lower mold chase, and Figure 3 is the second
The sectional view, FIGS. 4 and 5 are explanatory diagrams showing the set state of the lead frame. 10...Lead frame, 11...Guide hole, 20a...Upper mold chase, 20b...Lower mold chase, 22a, 22b...Insert, 2
3...Pin block, 24A, 24B...Through hole, 26...Guide pin, 26a...Ampulla, 28
...Adjustment nut, 30, 50...Spring, 3
6... Holder guide pin, 43... Pin block.
Claims (1)
するトランスフアモールド金型において、 金型のパーテイング面と同一面となる面を有す
る取り外し可能なピンブロツクを設け、このピン
ブロツクに前記ガイドピンを突出して設けたこと
を特徴とするトランスフアモールド金型のガイド
ピンユニツト。 2 請求項1のガイドピンの先端を先細に形成す
るとともに、ピンブロツクのパーテイング面に一
致する面からガイドピンを弾性部材により付勢し
て先端を突出状態とし、型閉じの際にガイドピン
を没入可能としたことを特徴とするトランスフア
モールド金型のインサート物位置決め機構。 3 請求項2記載のガイドピンの先端に遊嵌する
、先端が筒状に形成された押さえガイドピンを、
前記ガイドピンを設けた金型と対になる金型に設
けるとともに、該金型のパーテイング面に対し押
さえガイドピンを突出入可能に設けたことを特徴
とするトランスフアモールド金型のインサート物
位置決め機構。[Claims for Utility Model Registration] 1. In a transfer molding mold having a guide pin for positioning an insert, a removable pin block having a surface flush with the parting surface of the mold is provided, and this pin block has the above-mentioned features. A guide pin unit for a transfer mold mold, characterized by a protruding guide pin. 2. The tip of the guide pin according to claim 1 is formed into a tapered shape, and the guide pin is urged by an elastic member from a surface corresponding to the parting surface of the pin block to make the tip protrude, and the guide pin is retracted when the mold is closed. An insert positioning mechanism for a transfer mold mold, which is characterized by the following: 3. A presser guide pin having a cylindrical tip that fits loosely into the tip of the guide pin according to claim 2,
Insert positioning for a transfer mold mold, characterized in that the guide pin is provided on a mold that is paired with the mold provided with the guide pin, and a presser guide pin is provided so as to be able to protrude in and out from the parting surface of the mold. mechanism.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12185588U JPH056097Y2 (en) | 1988-09-16 | 1988-09-16 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12185588U JPH056097Y2 (en) | 1988-09-16 | 1988-09-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0241916U true JPH0241916U (en) | 1990-03-22 |
JPH056097Y2 JPH056097Y2 (en) | 1993-02-17 |
Family
ID=31369247
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12185588U Expired - Lifetime JPH056097Y2 (en) | 1988-09-16 | 1988-09-16 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH056097Y2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0479614U (en) * | 1990-11-22 | 1992-07-10 | ||
JPH04123534U (en) * | 1991-04-22 | 1992-11-09 | 鹿児島日本電気株式会社 | semiconductor mold |
JP2015088733A (en) * | 2013-09-26 | 2015-05-07 | セイコーインスツル株式会社 | Semiconductor manufacturing device |
JP2017199870A (en) * | 2016-04-28 | 2017-11-02 | Towa株式会社 | Resin sealing device and resin sealing method |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW446622B (en) * | 1999-05-10 | 2001-07-21 | Takara Co Ltd | Arm for an elastic doll, its molding method and forming mold |
-
1988
- 1988-09-16 JP JP12185588U patent/JPH056097Y2/ja not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0479614U (en) * | 1990-11-22 | 1992-07-10 | ||
JPH04123534U (en) * | 1991-04-22 | 1992-11-09 | 鹿児島日本電気株式会社 | semiconductor mold |
JP2015088733A (en) * | 2013-09-26 | 2015-05-07 | セイコーインスツル株式会社 | Semiconductor manufacturing device |
JP2017199870A (en) * | 2016-04-28 | 2017-11-02 | Towa株式会社 | Resin sealing device and resin sealing method |
Also Published As
Publication number | Publication date |
---|---|
JPH056097Y2 (en) | 1993-02-17 |
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