JPH01127733U - - Google Patents
Info
- Publication number
- JPH01127733U JPH01127733U JP2200688U JP2200688U JPH01127733U JP H01127733 U JPH01127733 U JP H01127733U JP 2200688 U JP2200688 U JP 2200688U JP 2200688 U JP2200688 U JP 2200688U JP H01127733 U JPH01127733 U JP H01127733U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- spring
- movable
- pin
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000006260 foam Substances 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000001816 cooling Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Description
図面はこの考案金型装置の実施例を示すもので
あつて、第１図は縦断正面図、第２図は型開き時
の要部の拡大縦断面図、第３図は型締め時の要部
拡大縦断面図である。
１…固定金型、１ａ…通孔、２…可動金型、２
′…サポータ、３，４…マスターフレーム、５，
６…キヤビテイ、７…水冷ノズル、８…原料充填
フイーダ、９…エジエクター、１０…ばね受板、
１０ａ…通孔、１１…固定具、１２…ナツト、１
３…ピン、１４…座板、１５…コイルばね。
The drawings show an embodiment of this devised mold device, in which Fig. 1 is a vertical front view, Fig. 2 is an enlarged longitudinal sectional view of the main parts when the mold is opened, and Fig. 3 is the main parts when the mold is closed. FIG. 1...Fixed mold, 1a...Through hole, 2...Movable mold, 2
'...Supporter, 3, 4...Master frame, 5,
6... Cavity, 7... Water cooling nozzle, 8... Raw material filling feeder, 9... Ejector, 10... Spring receiving plate,
10a...Through hole, 11...Fixing tool, 12...Nut, 1
3...Pin, 14...Seat plate, 15...Coil spring.
Claims (1)
在のピンホール成形用ピン１３をばね１５を介装
して設け、可動金型２を可動して金型を閉じた際
に前記ピン１３先端がばね１５作用で可動金型２
内面に衝合するよう付勢されてなる樹脂発泡成形
金型装置。 A pinhole forming pin 13 penetrating through the through hole 1a at the bottom of the fixed mold 1 and movable back and forth is provided with a spring 15 interposed, and when the movable mold 2 is moved and the mold is closed, the pin 13 The tip is movable mold 2 due to the action of spring 15
A resin foam mold device that is biased to abut against the inner surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2200688U JPH01127733U (en) | 1988-02-22 | 1988-02-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2200688U JPH01127733U (en) | 1988-02-22 | 1988-02-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01127733U true JPH01127733U (en) | 1989-08-31 |
Family
ID=31239735
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2200688U Pending JPH01127733U (en) | 1988-02-22 | 1988-02-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01127733U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6134106U (en) * | 1984-07-31 | 1986-03-01 | 日立電線株式会社 | Optical connector for polarization maintaining fiber |
-
1988
- 1988-02-22 JP JP2200688U patent/JPH01127733U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6134106U (en) * | 1984-07-31 | 1986-03-01 | 日立電線株式会社 | Optical connector for polarization maintaining fiber |