JPH04123534U - semiconductor mold - Google Patents

Abstract

(57) [Summary] [Purpose] To prevent set position deviation due to lead frame floating that occurs in semiconductor molds. [Structure] By lowering the lead frame floating from the pilot pin 6 with the position correction pin 4 and clamping the lead frame 10 with a mold, it is possible to prevent the lead frame from galling due to positional deviation and from shifting the center of the package.

Description

[Detailed explanation of the idea]

0001

[Industrial application field]

This invention relates to semiconductor molds, especially when setting position misalignment of lead frames. This invention relates to a mechanism to prevent this.

0002

[Conventional technology]

As shown in Figure 4, the conventional molding die separates multiple lead frames to be supplied. The loading frame 9 to be loaded and the positioning frame inside the movable mold die 1 It has a pilot pin 6.

0003 In a mold set in a conventional automatic enclosing device, the automatically supplied lead Place the frame directly on the movable mold 1 and insert it into the pilot pin 6. It has a structure designed to do so.

0004 Next, the operation will be explained. Loading is performed on the heated movable mold die 1. Place the set lead frame on the programming frame 9, and attach the pilot pin 6 to it. Insert the entire lead frame into the fixed mold die 2 through the mold forming machine. Clamp.

[0005]

[Problem that the idea aims to solve]

In this conventional mold, the mold is used in a heated state, so It is easy to cause errors due to thermal expansion between the lead frame and the addition of Mt, Bd, etc. Because the lead frame goes through a heat process, warping occurs on the lead frame itself, causing damage to the positioning part. The lead frame tends to lift up from the pilot pin. Also, the lead frame If the lead is clamped in the mold with the lead floating above the pilot pin, Because the entire frame is fixed at the same time, the uneven parts on the surface of the mold The burr on the lead frame got caught and the position of the lead frame could not be corrected, causing the installation. There was a problem in that it caused errors.

[0006] The purpose of this invention is to prevent the set position of the lead frame from shifting during clamping. The purpose of the present invention is to provide a molding die for semiconductors that has a stable structure.

[0007]

[Means to solve the problem]

In order to achieve the above object, the semiconductor mold according to the present invention includes a pattern. It has a pilot pin and a position correction pin, and the lead frame is set in a heated mold. then clamp the lead frame through a molding machine and supply thermosetting resin. , In the mold that pressurizes and forms the package, The pilot pin fits into the lead frame and positions the lead frame in the mold. It is used to set The position correction pin is used to lower and fix the lead frame that has risen above the pilot pin. It is something that

[0008]

[Effect]

A position correction pin is installed on the fixed side mold, and a position correction pin is installed on the movable side mold. Fit the pilot pin of the mold and press down the lead frame with the position correction pin. This prevents setting errors due to lead frame floating.

[0009]

【Example】

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

0010 (Embodiment 1) FIG. 1 is a sectional view showing Embodiment 1 of the present invention.

[0011] In the figure, the semiconductor molding die according to this embodiment is a movable side molding die 1. and the fixed side mold die 2, and the fixed side mold die 2 can be Move the movable side mold die 1 to open and close the mold, and with the mold open, move the movable side mold. A lead frame 10 is set on a mold 1, and this is fixed using a mold forming machine. It is designed to be clamped to the fixed side mold die 2.

0012 Furthermore, the movable mold die 1 is provided with a lead frame 10 that is fitted into the lead frame 10. A pilot pin 6 for positioning the frame 10 is provided. On the other hand, the fixed side The mold die 2 has a center pin corresponding to the pilot pin 6 of the movable mold die 1. An empty guide block 3 is provided, and the guide block 3 is loaded with a spring 5. A position correction pin 4 which is biased is slidably supported. , a recess 4 that receives the pilot pin 6 that protrudes through the lead frame 10. A is provided at the opening edge of the recess 4a, and a lowering surface 4 for lowering the lead frame 10 is provided. b is formed.

[0013] In the embodiment, the lead frame 10 is set on the movable mold die 1, It is clamped to the stationary side mold 2 using a mold forming machine. At that time, the guide The lowering surface 4b of the position correction pin 4 guided by the block 3 allows the pilot pin to Press the lead frame 10 floating from 6 onto the movable mold die 1. , and with the tip of the pilot pin 6 received in the recess 4a of the position correction pin 4. Clamp. Also, by clamping the lead frame 10, the position can be corrected. Pin 4 is also pushed up at the same time.

[0014] When the clamp is released, the position correction pin 4 is also sprung together with the movable mold die 1. It is extruded onto the surface of the mold by the tool 5.

[0015] (Embodiment 2) FIG. 2 is a sectional view showing Embodiment 2 of the present invention.

[0016] In this embodiment, the lead frame 10 cannot be set on the pilot pin 6, but it is possible to When the movable side mold rises and starts clamping, the ring-shaped position correction pin 4 A setting error detection sensor 8 is activated via the position detection shaft 7 engaged with the recess 4c. It is activated to stop the movable mold from rising.

[0017] FIG. 3 is an operation timing chart of the second embodiment. Movable side mold die 1 The lead frame hits the position correction pin 4 when the high-speed ascent changes to the low-speed ascent, and the Furthermore, by rising at a low speed, the position correction pin 4 is pushed up, and the setting error detection sensor is activated. sensor 8 is activated. In addition, if the set error detection monitoring distance is passed, the set error detection will occur. The output sensor 8 becomes invalid.

[0018]

[Effect of the idea]

As explained above, the present invention has a position correction pin provided on the fixed side mold. This prevents the lead frame from floating when it is set in the movable mold. Prevents setting errors caused by lead frame jamming and package centers. This has the effect of preventing damage.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing a first embodiment of the present invention.

FIG. 2 is a sectional view showing a second embodiment of the present invention.

FIG. 3 is an operation timing chart in the second embodiment.

FIG. 4 is a side view showing a conventional example.

[Explanation of symbols]

1 Movable side mold 2 Fixed side mold 3 Guide block 4 Position correction pin 5 Spring 6 Pilot pin 7 Position detection shaft 8 Misset detection sensor 9 Loading frame

Claims (1)

[Scope of utility model registration request] Claim 1: A lead frame is equipped with a pilot pin and a position correction pin, a lead frame is set in a heated mold, the lead frame is clamped through a molding machine, and a thermosetting resin is supplied and pressurized to form a package. In the molding die for molding, the pilot pin is inserted into the lead frame to position and set the lead frame in the mold, and the position correction pin is used to lower and fix the lead frame that has risen above the pilot pin. A semiconductor mold that is characterized by: