JPH0241844B2 - - Google Patents
Info
- Publication number
- JPH0241844B2 JPH0241844B2 JP619681A JP619681A JPH0241844B2 JP H0241844 B2 JPH0241844 B2 JP H0241844B2 JP 619681 A JP619681 A JP 619681A JP 619681 A JP619681 A JP 619681A JP H0241844 B2 JPH0241844 B2 JP H0241844B2
- Authority
- JP
- Japan
- Prior art keywords
- vinyl acetate
- polyethylene
- ethylene
- layer
- carbon black
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- -1 polyethylene Polymers 0.000 claims description 14
- 239000004698 Polyethylene Substances 0.000 claims description 13
- 229920000573 polyethylene Polymers 0.000 claims description 13
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 7
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 5
- 239000012212 insulator Substances 0.000 claims description 4
- 241000872198 Serjania polyphylla Species 0.000 claims 1
- 238000002156 mixing Methods 0.000 claims 1
- 229920006027 ternary co-polymer Polymers 0.000 claims 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 7
- 239000005977 Ethylene Substances 0.000 description 7
- 229920001897 terpolymer Polymers 0.000 description 7
- 239000004020 conductor Substances 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 5
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 3
- 239000006229 carbon black Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000003431 cross linking reagent Substances 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 238000007765 extrusion coating Methods 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 239000006057 Non-nutritive feed additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000010559 graft polymerization reaction Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Landscapes
- Conductive Materials (AREA)
Description
この発明はポリエチレン系電力ケーブルの改良
に係るポリエチレンおよびその共重合体はその絶
縁物としての優れた性質と加工性の容易さに加え
て、ケーブル製造技術の向上から、広く電力ケー
ブルとして利用されている。
このような電力ケーブルの代表的構造は導体上
に内部半導電層、ポリエチレン系絶縁層、外部半
導電層からなる絶縁構成を有しており、特に外部
半導電層は、半導電性組成物をポリエチレン系絶
縁層上に押出被覆するか、半導電性材料からなる
テープを絶縁層上にテープ巻することによつて得
られ、この半導電性テープとしては導電性カーボ
ンブラツクを配合した粘着剤を布テープに含浸し
たものが一般的に使用されていた。
このような従来の電力ケーブルの外部半導電層
は、半導電性テープ巻により構成した場合に、絶
縁層と半導電性テープ巻層の間に空隙を生じ易
く、これが電離現象の原因となることであり、ま
た半導電性組成物を押出被覆するものは、半導電
性テープ巻の場合に生ずるような空隙発生の問題
はないが、通常は絶縁体と同質もしくは近似質の
樹脂材料中に導電性カーボンブラツクを混在した
半導電性組成物であるために、ケーブルの絶縁層
とは密着し易い長所がある反面、ケーブル接続の
場合に半導電性をきれいに剥がすことが困難で、
ケーブルの接続作業が難しくなると云う欠点があ
る。このため酢酸ビニル含量15−55重量%のエチ
レン酢酸ビニル共重合体とエチレン・酢酸ビニル
塩化ビニル三元共重合体と架橋剤およびカーボン
ブラツクを配合した半導電性組成物ががポリエチ
レン電力ケーブルの外部半導電層として剥離強度
も低く好ましいとされていた(特公昭49−19907)
が、未だ不充分と見られ、エチレン・酢酸ビニル
共重合体に塩化ビニルをグラフト重合したポリマ
ーと、エチレン・酢酸ビニル共重合体をベースに
し、これにエチレン・酢酸ビニル共重合体とカー
ボンブラツクを配合した導電性組成物を外部半導
電層として使用するときは更に剥離強度を小さく
することができる(特公昭54−23436)とされて
いた。しかしこれによつても未だ剥離強度低下の
要請とコストの面から云えば満足することはでき
なかつた。
この発明者等は更に検討の結果、酢酸ビニル含
量60重量%以上のエチレン・酢酸ビニル・塩化ビ
ニル三元重合体と導電性カーボンブラツクを配合
した組成物が極めて簡単な組成であるにもかかわ
らず外部半導電層とした場合に剥離強度が小さ
く、コストも安く好ましいものであることを見出
した。
即ち、特公昭49−19907はエチレン・酢酸ビニ
ル・塩化ビニル三元重合体を使用しているにもか
かわらず、エチレン・酢酸ビニル共重合体を併用
しなければ引裂強度の低下の目的を達成し得ない
にかわらず、この発明ではエチレン・酢酸ビニル
共重合体を併用することなく、引裂強度の低下を
達成するものであるが、両者の最大の相違点は前
記三元重合体の酢酸ビニル成分の含量にある。
即ち前者は酢酸ビニル成分が55重量%以下であ
るのに対しこの発明では60重量%以上の三元重合
体を外部半導電層として使用することより、従来
より簡単に外部半導電層の引裂強度の小さいポリ
エチレン系電力ケーブル(ポリエチレン、エチレ
ン.プロピレン・ターポリマーなどのポリエチレ
ン系絶縁層を有する電力ケーブルで、必要により
架橋せしめてある。)を得ることに成功したもの
である。
ここに使用される導電性カーボンブラツクの量
は設計上要求される導電率に応じた量を選択すれ
ばよいが、通常の20〜60kV級のポリエチレンケ
ーブルの場合には、エチレン・酢酸ビニル・塩化
ビニル三元重合体100重量部に対し、導電性カー
ボンブラツクは10〜100重量部である。
過酸化物等の架橋剤及び老化防止剤、加工助剤
等は適誼配合され得ることは絶縁体の場合と同様
である。
この発明による外部半導電層を有するポリエチ
レンケーブルの一例を図に示す。1は導体、2は
内部半導電層、3はポリエチレン絶縁層で通常は
架橋されている。4は外部半導電層、5は保護被
覆である。
次に以下に実施例および比較例を示す。なお、
この試験に用いられた材料および試験方法は次の
通りである。
断面積250mm2の撚線導体上に通常の内部半導電
層を押出被覆し、さらにその上に次表に示した絶
縁層と外部半導電層を押出被覆し、10気圧の飽和
水蒸気中で架橋反応を完結させた。得られた電線
の表面に被覆されている外部半導電層に巾12.5mm
の切傷を付けて剥離試験を行なつた。
This invention relates to improvement of polyethylene-based power cables Polyethylene and its copolymers are widely used as power cables due to their excellent properties as insulators and ease of processing, as well as improvements in cable manufacturing technology. There is. A typical structure of such a power cable has an insulating structure consisting of an inner semiconducting layer, a polyethylene insulating layer, and an outer semiconducting layer on a conductor. In particular, the outer semiconducting layer is made of a semiconducting composition. It is obtained by extrusion coating on a polyethylene insulating layer or by wrapping a tape made of a semiconductive material on the insulating layer, and this semiconductive tape uses an adhesive containing conductive carbon black. Impregnated cloth tape was commonly used. When the external semiconducting layer of such conventional power cables is constructed by wrapping with semiconducting tape, gaps are likely to be formed between the insulating layer and the semiconducting tape wrapping layer, which can cause ionization phenomena. In addition, extrusion coatings with semiconductive compositions do not have the problem of void formation that occurs in the case of semiconductive tape, but they usually contain conductive material in a resin material that is the same or similar to the insulator. Because it is a semiconductive composition containing carbon black, it has the advantage of adhering easily to the insulation layer of the cable, but on the other hand, it is difficult to remove the semiconductivity cleanly when connecting cables.
The disadvantage is that the cable connection work becomes difficult. For this purpose, a semiconductive composition containing an ethylene-vinyl acetate copolymer with a vinyl acetate content of 15-55% by weight, an ethylene-vinyl acetate-vinyl chloride terpolymer, a crosslinking agent, and carbon black is used for the exterior of polyethylene power cables. It was considered to be preferable as a semiconducting layer due to its low peel strength (Special Publication Publication 19907-1979).
However, it is still considered to be insufficient, and a polymer based on a graft polymerization of vinyl chloride to an ethylene/vinyl acetate copolymer and an ethylene/vinyl acetate copolymer is used as a base, and ethylene/vinyl acetate copolymer and carbon black are added to this. When the blended conductive composition is used as an external semiconductive layer, the peel strength can be further reduced (Japanese Patent Publication No. 54-23436). However, even with this, it was still not possible to satisfy the requirements for lowering the peel strength and from the viewpoint of cost. As a result of further study, the inventors found that a composition containing an ethylene/vinyl acetate/vinyl chloride terpolymer with a vinyl acetate content of 60% or more by weight and conductive carbon black was extremely simple. It has been found that when used as an external semiconductive layer, the peel strength is low and the cost is low, which is preferable. In other words, although the Japanese Patent Publication No. 49-19907 uses a terpolymer of ethylene, vinyl acetate, and vinyl chloride, the objective of reducing tear strength cannot be achieved unless an ethylene-vinyl acetate copolymer is used in combination. Although this invention achieves a reduction in tear strength without using an ethylene/vinyl acetate copolymer, the biggest difference between the two is that the vinyl acetate component of the terpolymer The content of That is, in the former case, the vinyl acetate component is 55% by weight or less, whereas in this invention, the tear strength of the external semiconductive layer can be increased more easily than before by using a terpolymer with a vinyl acetate content of 60% by weight or more as the outer semiconductive layer. We succeeded in obtaining a polyethylene-based power cable (a power cable having a polyethylene-based insulating layer made of polyethylene, ethylene-propylene terpolymer, etc., and cross-linked if necessary) with a small diameter. The amount of conductive carbon black used here can be selected according to the conductivity required in the design, but in the case of ordinary 20 to 60 kV class polyethylene cables, ethylene, vinyl acetate, and chloride are used. The amount of conductive carbon black is 10 to 100 parts by weight per 100 parts by weight of the vinyl terpolymer. As in the case of insulators, crosslinking agents such as peroxides, anti-aging agents, processing aids, etc. can be added in appropriate amounts. An example of a polyethylene cable with an outer semiconducting layer according to the invention is shown in the figure. 1 is a conductor, 2 is an internal semiconducting layer, and 3 is a polyethylene insulating layer, which is usually crosslinked. 4 is an outer semiconducting layer, and 5 is a protective coating. Next, Examples and Comparative Examples are shown below. In addition,
The materials and test methods used in this test are as follows. A normal inner semiconducting layer is extruded onto a stranded conductor with a cross-sectional area of 250 mm 2 , and then an insulating layer and an outer semiconducting layer shown in the table below are extruded and cross-linked in saturated steam at 10 atm. The reaction was completed. The outer semiconducting layer coated on the surface of the obtained wire has a width of 12.5 mm.
A peel test was performed by making a cut.
【表】【table】
図はこの発明のポリエチレン系電力ケーブルの
一例を示す横断面図である。
1……導体、2……内部半導電層、3……絶縁
層、4……外部半導電層。
The figure is a cross-sectional view showing an example of the polyethylene power cable of the present invention. 1...Conductor, 2...Inner semiconducting layer, 3...Insulating layer, 4...Outer semiconducting layer.
Claims (1)
含量60%以上のエチレン−酢酸ビニル−塩化ビニ
ル三元共重合体に導電性カーボンブラツクを配合
した導電性組成物からなる外部半導電層を設けた
ことを特徴とするポリエチレン電力ケーブル。1. An external semiconductive layer made of a conductive composition prepared by blending conductive carbon black with an ethylene-vinyl acetate-vinyl chloride ternary copolymer with a vinyl acetate content of 60% or more is provided on the surface of the polyethylene insulator. A polyethylene power cable featuring:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP619681A JPS57119407A (en) | 1981-01-19 | 1981-01-19 | Polyethylene series power cable |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP619681A JPS57119407A (en) | 1981-01-19 | 1981-01-19 | Polyethylene series power cable |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57119407A JPS57119407A (en) | 1982-07-24 |
JPH0241844B2 true JPH0241844B2 (en) | 1990-09-19 |
Family
ID=11631785
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP619681A Granted JPS57119407A (en) | 1981-01-19 | 1981-01-19 | Polyethylene series power cable |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57119407A (en) |
-
1981
- 1981-01-19 JP JP619681A patent/JPS57119407A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS57119407A (en) | 1982-07-24 |
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