JPH0241586B2 - - Google Patents

Info

Publication number
JPH0241586B2
JPH0241586B2 JP20462082A JP20462082A JPH0241586B2 JP H0241586 B2 JPH0241586 B2 JP H0241586B2 JP 20462082 A JP20462082 A JP 20462082A JP 20462082 A JP20462082 A JP 20462082A JP H0241586 B2 JPH0241586 B2 JP H0241586B2
Authority
JP
Japan
Prior art keywords
vacuum chamber
substrate
chamber
cylindrical anti
pressure adjustment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP20462082A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5996270A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP20462082A priority Critical patent/JPS5996270A/ja
Publication of JPS5996270A publication Critical patent/JPS5996270A/ja
Publication of JPH0241586B2 publication Critical patent/JPH0241586B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
JP20462082A 1982-11-24 1982-11-24 連続式スパツタ装置 Granted JPS5996270A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20462082A JPS5996270A (ja) 1982-11-24 1982-11-24 連続式スパツタ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20462082A JPS5996270A (ja) 1982-11-24 1982-11-24 連続式スパツタ装置

Publications (2)

Publication Number Publication Date
JPS5996270A JPS5996270A (ja) 1984-06-02
JPH0241586B2 true JPH0241586B2 (de) 1990-09-18

Family

ID=16493488

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20462082A Granted JPS5996270A (ja) 1982-11-24 1982-11-24 連続式スパツタ装置

Country Status (1)

Country Link
JP (1) JPS5996270A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0495001U (de) * 1991-01-10 1992-08-18

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2927567B2 (ja) * 1991-05-17 1999-07-28 シャープ株式会社 スパツタリング装置
CH691376A5 (de) * 1995-10-17 2001-07-13 Unaxis Balzers Ag Vakuumanlage zur Oberflächenbearbeitung von Werkstücken.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0495001U (de) * 1991-01-10 1992-08-18

Also Published As

Publication number Publication date
JPS5996270A (ja) 1984-06-02

Similar Documents

Publication Publication Date Title
JP7066626B2 (ja) 基板を処理するための方法および装置
US5108574A (en) Cylindrical magnetron shield structure
US6224718B1 (en) Target assembly for ion beam sputter deposition with multiple paddles each having targets on both sides
JPH08506855A (ja) 円筒形マグネトロンのシールド構造
US3756939A (en) Target mounting device for sequential sputtering
WO2003003417A2 (en) High throughput hybrid deposition system and method using the same
JP2001316797A (ja) 成膜装置および成膜装置に用いる防着部材
US20200013592A1 (en) Methods and apparatus for linear scan physical vapor deposition with reduced chamber footprint
JPH0241586B2 (de)
US6083364A (en) Magnetron sputtering apparatus for single substrate processing
US3859956A (en) Multiworkpiece condensation coating apparatus
JPH02251143A (ja) イオンビーム式スパッタリング装置
US6780294B1 (en) Shield assembly for substrate processing chamber
JPH02285069A (ja) スパッタ装置
JPH11302841A (ja) スパッタ装置
JPH04202769A (ja) 半導体処理装置
US5482604A (en) Off-axis radio frequency diode apparatus for sputter deposition of RLG mirrors
JPH0242900B2 (de)
JP3281926B2 (ja) 薄膜形成装置
US10597785B2 (en) Single oxide metal deposition chamber
JPS595666B2 (ja) スパツタリング装置
JPS6365754B2 (de)
US20120073963A1 (en) Sputtering apparatus having shielding device
JP2746292B2 (ja) スパッタリング装置
JPS63290271A (ja) スパッタ装置のタ−ゲット部シャッタ