JPH024156B2 - - Google Patents
Info
- Publication number
- JPH024156B2 JPH024156B2 JP18713982A JP18713982A JPH024156B2 JP H024156 B2 JPH024156 B2 JP H024156B2 JP 18713982 A JP18713982 A JP 18713982A JP 18713982 A JP18713982 A JP 18713982A JP H024156 B2 JPH024156 B2 JP H024156B2
- Authority
- JP
- Japan
- Prior art keywords
- input
- circuit board
- case
- connectors
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 37
- 238000005259 measurement Methods 0.000 claims description 20
- 238000009434 installation Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 5
- 239000012212 insulator Substances 0.000 description 5
- 238000005452 bending Methods 0.000 description 3
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
- Casings For Electric Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18713982A JPS5975698A (ja) | 1982-10-25 | 1982-10-25 | 電子機器ケ−スの入力部の構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18713982A JPS5975698A (ja) | 1982-10-25 | 1982-10-25 | 電子機器ケ−スの入力部の構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5975698A JPS5975698A (ja) | 1984-04-28 |
| JPH024156B2 true JPH024156B2 (enrdf_load_stackoverflow) | 1990-01-26 |
Family
ID=16200803
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18713982A Granted JPS5975698A (ja) | 1982-10-25 | 1982-10-25 | 電子機器ケ−スの入力部の構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5975698A (enrdf_load_stackoverflow) |
-
1982
- 1982-10-25 JP JP18713982A patent/JPS5975698A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5975698A (ja) | 1984-04-28 |