JPH0241452U - - Google Patents

Info

Publication number
JPH0241452U
JPH0241452U JP11898288U JP11898288U JPH0241452U JP H0241452 U JPH0241452 U JP H0241452U JP 11898288 U JP11898288 U JP 11898288U JP 11898288 U JP11898288 U JP 11898288U JP H0241452 U JPH0241452 U JP H0241452U
Authority
JP
Japan
Prior art keywords
lead
integrated circuit
leads
brazing material
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11898288U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11898288U priority Critical patent/JPH0241452U/ja
Publication of JPH0241452U publication Critical patent/JPH0241452U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP11898288U 1988-09-09 1988-09-09 Pending JPH0241452U (US07709020-20100504-C00032.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11898288U JPH0241452U (US07709020-20100504-C00032.png) 1988-09-09 1988-09-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11898288U JPH0241452U (US07709020-20100504-C00032.png) 1988-09-09 1988-09-09

Publications (1)

Publication Number Publication Date
JPH0241452U true JPH0241452U (US07709020-20100504-C00032.png) 1990-03-22

Family

ID=31363815

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11898288U Pending JPH0241452U (US07709020-20100504-C00032.png) 1988-09-09 1988-09-09

Country Status (1)

Country Link
JP (1) JPH0241452U (US07709020-20100504-C00032.png)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59141256A (ja) * 1983-02-02 1984-08-13 Hitachi Ltd リ−ドフレ−ムのろう付け方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59141256A (ja) * 1983-02-02 1984-08-13 Hitachi Ltd リ−ドフレ−ムのろう付け方法

Similar Documents

Publication Publication Date Title
JPS5972757A (ja) 半導体装置
JPH0241452U (US07709020-20100504-C00032.png)
JPH01121945U (US07709020-20100504-C00032.png)
JPH0446572U (US07709020-20100504-C00032.png)
JPH01220837A (ja) 半導体集積回路装置
JPH0397940U (US07709020-20100504-C00032.png)
JPH0645494A (ja) 半導体集積回路用パッケージ
JPS602873U (ja) 面実装トランジスタの半田付け構造
JPH0713226Y2 (ja) リードフレーム
JPH0427098Y2 (US07709020-20100504-C00032.png)
JPS6035539U (ja) 半導体チツプの接地構造
JPH01107153U (US07709020-20100504-C00032.png)
JPS6157542U (US07709020-20100504-C00032.png)
JPH04103680U (ja) 印刷配線板
JPS6120059U (ja) 半導体装置
JPS60124069U (ja) プリント基板
JPS61177458U (US07709020-20100504-C00032.png)
JPS6120079U (ja) 半導体装置実装用基板
JPS619857U (ja) 半導体装置
JPH0472646U (US07709020-20100504-C00032.png)
JPH0229557U (US07709020-20100504-C00032.png)
JPH01201946A (ja) 半導体装置
JPH01118437U (US07709020-20100504-C00032.png)
JPS6247171U (US07709020-20100504-C00032.png)
JPS62134247U (US07709020-20100504-C00032.png)