JPH0240687A - Led display unit - Google Patents
Led display unitInfo
- Publication number
- JPH0240687A JPH0240687A JP63192357A JP19235788A JPH0240687A JP H0240687 A JPH0240687 A JP H0240687A JP 63192357 A JP63192357 A JP 63192357A JP 19235788 A JP19235788 A JP 19235788A JP H0240687 A JPH0240687 A JP H0240687A
- Authority
- JP
- Japan
- Prior art keywords
- display unit
- led
- display
- surrounded
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 3
- 238000005192 partition Methods 0.000 claims description 3
- 239000011347 resin Substances 0.000 abstract description 16
- 229920005989 resin Polymers 0.000 abstract description 16
- 238000000465 moulding Methods 0.000 abstract description 5
- 239000011159 matrix material Substances 0.000 abstract description 4
- 239000000203 mixture Substances 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Led Device Packages (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、多数個のＬＥＤが基板上に規則的に配列して
搭載された構造を有し、個々のＬＥＤを選択的に点灯さ
せて文字等をドツトパターンにて表示するＬＥＤ表示ユ
ニットに関するものである。[Detailed Description of the Invention] <Industrial Application Field> The present invention has a structure in which a large number of LEDs are regularly arranged and mounted on a substrate, and each LED is selectively turned on. This invention relates to an LED display unit that displays characters and the like in a dot pattern.
〈従来の技術〉
第５図は従来のＬＥＤ表示ユニットの平面構造を示して
おり、第６図はそのＡ−Ａ’矢視断面構造を示している
。図中、１０２はマスク板、１０３は配線基板、１０４
は透孔、１０５はＬ’Ｅ Ｄ、１０６は樹脂モールド層
である。<Prior Art> FIG. 5 shows a planar structure of a conventional LED display unit, and FIG. 6 shows its cross-sectional structure taken along the line A-A'. In the figure, 102 is a mask board, 103 is a wiring board, 104
105 is a through hole, 105 is L'ED, and 106 is a resin mold layer.
マスク板１０２は、多数個の透孔１０４がマトリックス
状に配列して形成されている。このマスク板１０２と配
線基板１０３とは接着により一体化され、配線基板１０
３に搭載された多数個のＬＥＤチップ１０５はマスク板
１０２の透孔１０４内に各々配設される。マスク板１０
２の透孔１０４は、内部のＬＥＤチップ１０５を保護す
るために透光性樹脂によるモールド層１０６が形成され
ている。ＬＥＤチップ１０５を内蔵した透孔１０４の１
個が、表示単位を構成する。マスク板１０２によって隣
接するＬＥＤチップ１０５の間が遮蔽され、個々のＬＥ
Ｄチップ１０５の発光が発光面近くで混じり合うことは
なく、表示単位の点灯、非点灯の区別の認識を確実にす
る。The mask plate 102 is formed with a large number of through holes 104 arranged in a matrix. The mask plate 102 and the wiring board 103 are integrated by adhesive, and the wiring board 103
A large number of LED chips 105 mounted on the mask plate 102 are respectively disposed within the through holes 104 of the mask plate 102. Mask board 10
A mold layer 106 made of a translucent resin is formed in the through hole 104 of No. 2 to protect the LED chip 105 inside. 1 of the through holes 104 with built-in LED chips 105
The units constitute the display unit. Adjacent LED chips 105 are shielded by mask plate 102, and individual LED chips 105 are shielded from each other.
The light emitted from the D-chip 105 is not mixed near the light emitting surface, and the distinction between lighting and non-lighting of each display unit is ensured.
上記のような構成のＬＥＤ表示ユニットを多数個同一面
上に並設することにより、電光表示板などの大型表示装
置が形成される。A large display device such as an electronic display board is formed by arranging a large number of LED display units having the above configuration in parallel on the same surface.
〈発明が解決しようとする課題〉
上記従来のＬＥＤ表示ユニットにおいては、個々のＬＥ
Ｄ表示ユニットを縦横方向に多数個密着して並べること
により、大型表示装置が形成される。この種のＬＥＤ表
示装置において、高精細な表示を行うためには、表示単
位間のピッチを微細化する必要がある。また、多数個の
表示ユニットを密着させ、全体としてドツトピッチの均
一な表示を行うためには、第７図に示すように、マスク
板１０２の表面の透孔１０４間の幅ｄに対して表示ユニ
ットの端縁においては透孔１０４と端縁部１０７との間
の幅がｄ／２である必要がある。<Problem to be solved by the invention> In the conventional LED display unit described above, each LED
A large display device is formed by arranging a large number of D display units in close contact with each other in the vertical and horizontal directions. In this type of LED display device, in order to perform high-definition display, it is necessary to miniaturize the pitch between display units. In addition, in order to place a large number of display units in close contact with each other and to display a uniform dot pitch as a whole, as shown in FIG. The width between the through hole 104 and the end edge 107 must be d/2.
しかしながら、樹脂成形により微細なピッチで多数個の
透孔が規則的に配列ししかもその端縁部においてより微
細な寸法精度を必要とするマスク板を作成することは困
難であり、たとえできたとしても製品が極めて高価にな
るといった問題があった。However, it is difficult to create a mask plate with a large number of through holes regularly arranged at a fine pitch using resin molding, and which requires even finer dimensional accuracy at the edges. However, the problem was that the products were extremely expensive.
本発明は上記事情に鑑みてなされたものであり、その目
的は、表示単位のピッチを微細化ししかも隣接した表示
単位間の混光を少なくしたＬＥＤ表示ユニットを提供す
ることである。The present invention has been made in view of the above circumstances, and an object thereof is to provide an LED display unit in which the pitch of display units is made finer and light mixing between adjacent display units is reduced.
く課題を解決するための手段〉
上記目的を達成するために、本発明によるＬＥＤ表示ユ
ニットにおいては、ＬＥＤを包囲して配線基板上をモー
ルドした樹脂にＬＥＤを囲む溝が表示面に対して垂直方
向に形成されている。Means for Solving the Problems> In order to achieve the above object, in the LED display unit according to the present invention, a groove surrounding the LED is perpendicular to the display surface in a resin molded on a wiring board surrounding the LED. It is formed in the direction.
〈作用〉
本発明のＬＥＤ表示ユニットは、配線基板の表面のモー
ルド樹脂に形成された溝の壁面により、個々のＬＥＤの
発光は反射し、隣接した表示単位の発光が互いに混合す
ることがない。<Function> In the LED display unit of the present invention, the light emitted from each LED is reflected by the wall surface of the groove formed in the molded resin on the surface of the wiring board, and the light emitted from adjacent display units does not mix with each other.
〈実施例〉
第１図は本実施例のＬＥＤ表示ユニットの平面構造を示
しており、第２図はそのＡ−Ａ’矢視断面構造を示して
いる。図中、１はＬＥＤ表示ユニット、２は樹脂モール
ド層、３は配線基板、４は溝、５はＬＥＤチップである
。<Example> FIG. 1 shows a planar structure of an LED display unit of this example, and FIG. 2 shows a cross-sectional structure taken along the line A-A'. In the figure, 1 is an LED display unit, 2 is a resin mold layer, 3 is a wiring board, 4 is a groove, and 5 is an LED chip.
配線基板３には、各々赤色と緑色の発光を行う２個で一
組のＬＥＤチップ５がマトリックス状に配列して搭載さ
れている。樹脂モールド層２は、透光性樹脂からなり、
配線基板３上の多数個のＬＥＤチップ５を包囲し配線基
板３のほぼ全面を覆って形成されている。A set of two LED chips 5, each of which emits red and green light, is mounted on the wiring board 3 and arranged in a matrix. The resin mold layer 2 is made of a translucent resin,
It is formed to surround a large number of LED chips 5 on the wiring board 3 and to cover almost the entire surface of the wiring board 3.
溝４は、この表示ユニットの表示面すなわちモールド樹
脂２の表面に対して垂直方向に且つ一組（７）ＬＥＤチ
ップ５を囲むようにモールド樹脂２上に縦横に格子状に
形成されている。したがって、ＬＥＤチップ５は、個々
に四方の溝４によって囲まれ、隣り合ったＬＥＤチップ
５の間は溝４によって仕切られている。この溝４によっ
て囲まれた１個の領域は、表示単位を構成する。溝４の
幅は、溝４を例えばグイシングツ−を用いて形成した場
合、３５μ程度である。The grooves 4 are formed in a lattice pattern vertically and horizontally on the mold resin 2 in a direction perpendicular to the display surface of the display unit, that is, the surface of the mold resin 2, and surrounding one set (7) of LED chips 5. Therefore, the LED chips 5 are individually surrounded by the grooves 4 on all sides, and adjacent LED chips 5 are partitioned by the grooves 4. One area surrounded by this groove 4 constitutes a display unit. The width of the groove 4 is approximately 35 μm when the groove 4 is formed using, for example, a guising tool.
この溝４を形成したことにより、樹脂モールドＮ２と溝
４の内部の空気層との境界面が形成され、第３図に示す
ように、ＬＥＤチップ５からの発光は溝４の内側の境界
面で反射するかあるいは内側の境界面を透過した光も外
側の境界面で反射することにより、溝４を透過して隣り
の表示単位へ入射する光は極く僅かとなる。したがって
、隣り合った表示単位間の発光の混合を無くし、表示単
位の点灯、不点灯の区別を確実に視認することができる
。また、この実施例のように、異なった色を発光する複
数個のＬＥＤチップを表示単位に搭載したものにおいて
は、溝４の壁面における反射により、混色の効果が高め
られる。By forming this groove 4, an interface between the resin mold N2 and the air layer inside the groove 4 is formed, and as shown in FIG. Since the light that is reflected by the groove 4 or transmitted through the inner boundary surface is also reflected by the outer boundary surface, the amount of light that passes through the groove 4 and enters the adjacent display unit becomes extremely small. Therefore, mixing of light emissions between adjacent display units is eliminated, and it is possible to reliably visually recognize whether the display units are lit or not. Further, in a device in which a plurality of LED chips emitting light of different colors are mounted in a display unit as in this embodiment, the effect of color mixing is enhanced by reflection on the wall surface of the groove 4.
溝４による反射効果を高めるため、溝４の内面に白色な
どの高反射率の着色を施すことが有効である。また、溝
４の内面に黒色などの吸収率の高い着色を施すことによ
っても、混光を防止できる。In order to enhance the reflection effect of the grooves 4, it is effective to color the inner surfaces of the grooves 4 with a high reflectance color such as white. Further, mixing of light can also be prevented by coloring the inner surface of the groove 4 with a color having a high absorption rate, such as black.
さらに、溝４の内部に遮光材からなる仕切板を挿入する
ことにより、隣り合った表示単位の発光の遮光効果はよ
りいっそう高められる。Furthermore, by inserting a partition plate made of a light-shielding material inside the groove 4, the light-shielding effect of light emitted from adjacent display units can be further enhanced.
第４図は他の実施例を示しており、樹脂モールド層に溝
４を一方向だけ設けたものである。溝４によって上下に
仕切られた横長の１個の領域が表示単位を構成し、各表
示単位には２個一組のＬＥＤチップ５が５組配設されて
いる。このように、本発明は、ドツトマトリックス型以
外のＬＥＤ表示器においても適用することができる。FIG. 4 shows another embodiment, in which grooves 4 are provided in only one direction in the resin mold layer. One horizontally long area partitioned vertically by the groove 4 constitutes a display unit, and five sets of two LED chips 5 are arranged in each display unit. In this way, the present invention can be applied to LED displays other than the dot matrix type.
〈発明の効果〉
以上説明したように、本発明においては、表示単位を仕
切る溝を設けたことにより、従来のマスク板を不要とし
、表示単位の配列を高密度化ししかも表示単位間の混光
を少なくすることができる。<Effects of the Invention> As explained above, in the present invention, by providing the grooves that partition the display units, the conventional mask plate is not required, the display units are arranged in a high density, and light mixing between the display units is reduced. can be reduced.
したがって、ＬＥＤ表示器の高精細表示と高コントラス
ト化を共に実現することができる。Therefore, both high-definition display and high contrast of the LED display can be achieved.
第１図と第４図は本発明実施例の平面構造を示す図、 第２図と第３図は本発明実施例の断面構造を示す図、 第５図は従来例の平面構造を示す図、 第６図と第７図は従来例の断面構造を示す図である。 １・・・ＬＥＤ表示ユニット 1 and 4 are diagrams showing the planar structure of the embodiment of the present invention, 2 and 3 are diagrams showing the cross-sectional structure of the embodiment of the present invention, FIG. 5 is a diagram showing the planar structure of the conventional example. FIGS. 6 and 7 are diagrams showing the cross-sectional structure of a conventional example. 1...LED display unit
Claims (3)
され、個々のＬＥＤを選択的に点灯させて文字等をドッ
トパターンにて表示するＬＥＤ表示ユニットにおいて、
ＬＥＤを包囲して上記基板上をモールドした樹脂にＬＥ
Ｄを囲む溝が表示面に対して垂直方向に形成されてなる
ＬＥＤ表示ユニット。(1) In an LED display unit in which a plurality of LEDs are mounted in a regular arrangement on a board and each LED is selectively turned on to display characters etc. in a dot pattern,
The LED is molded on the substrate surrounding the LED.
An LED display unit in which a groove surrounding D is formed in a direction perpendicular to the display surface.
ＬＥＤ表示ユニット。(2) The LED display unit according to claim 1, wherein the inner surface of the groove is colored.
載のＬＥＤ表示ユニット。(3) The LED display unit according to claim 1, wherein a partition plate is inserted inside the groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63192357A JPH0240687A (en) | 1988-08-01 | 1988-08-01 | Led display unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63192357A JPH0240687A (en) | 1988-08-01 | 1988-08-01 | Led display unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0240687A true JPH0240687A (en) | 1990-02-09 |
Family
ID=16289934
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63192357A Pending JPH0240687A (en) | 1988-08-01 | 1988-08-01 | Led display unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0240687A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05333794A (en) * | 1992-06-02 | 1993-12-17 | Kokusai Electric Co Ltd | Dot matrix type display device with light emitting diode |
| WO1994015434A1 (en) * | 1992-12-24 | 1994-07-07 | Robert Michael | Pixel, video display screen and power delivery |
| EP2028634A1 (en) * | 2007-08-20 | 2009-02-25 | Cfg S.A. | Multi-diode display module |
| JP2011249455A (en) * | 2010-05-25 | 2011-12-08 | Citizen Holdings Co Ltd | Light emitting device and method of manufacturing the same |
| US8328391B2 (en) | 2005-12-07 | 2012-12-11 | Koninklijke Philips Electronics N.V. | Lighting module |
| CN110420776A (en) * | 2019-08-06 | 2019-11-08 | 京东方科技集团股份有限公司 | A kind of production method of mask assembly and Mini LED backlight mould group |
| JP2022031731A (en) * | 2018-08-06 | 2022-02-22 | 日亜化学工業株式会社 | Light-emitting device and manufacturing method of the same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS515555A (en) * | 1974-07-04 | 1976-01-17 | Tdk Electronics Co Ltd | KAHENJIKI KONDENSA |
| JPS591252U (en) * | 1982-06-24 | 1984-01-06 | トヨタ自動車株式会社 | vehicle antenna |
| JPS6310575B2 (en) * | 1983-01-07 | 1988-03-08 | Hitachi Condenser |
-
1988
- 1988-08-01 JP JP63192357A patent/JPH0240687A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS515555A (en) * | 1974-07-04 | 1976-01-17 | Tdk Electronics Co Ltd | KAHENJIKI KONDENSA |
| JPS591252U (en) * | 1982-06-24 | 1984-01-06 | トヨタ自動車株式会社 | vehicle antenna |
| JPS6310575B2 (en) * | 1983-01-07 | 1988-03-08 | Hitachi Condenser |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05333794A (en) * | 1992-06-02 | 1993-12-17 | Kokusai Electric Co Ltd | Dot matrix type display device with light emitting diode |
| WO1994015434A1 (en) * | 1992-12-24 | 1994-07-07 | Robert Michael | Pixel, video display screen and power delivery |
| US8328391B2 (en) | 2005-12-07 | 2012-12-11 | Koninklijke Philips Electronics N.V. | Lighting module |
| EP2028634A1 (en) * | 2007-08-20 | 2009-02-25 | Cfg S.A. | Multi-diode display module |
| JP2011249455A (en) * | 2010-05-25 | 2011-12-08 | Citizen Holdings Co Ltd | Light emitting device and method of manufacturing the same |
| JP2022031731A (en) * | 2018-08-06 | 2022-02-22 | 日亜化学工業株式会社 | Light-emitting device and manufacturing method of the same |
| CN110420776A (en) * | 2019-08-06 | 2019-11-08 | 京东方科技集团股份有限公司 | A kind of production method of mask assembly and Mini LED backlight mould group |
| CN110420776B (en) * | 2019-08-06 | 2021-03-02 | 京东方科技集团股份有限公司 | Mask assembly and method for manufacturing Mini LED backlight module |
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