CN110420776A - A kind of production method of mask assembly and Mini LED backlight mould group - Google Patents
A kind of production method of mask assembly and Mini LED backlight mould group Download PDFInfo
- Publication number
- CN110420776A CN110420776A CN201910720599.9A CN201910720599A CN110420776A CN 110420776 A CN110420776 A CN 110420776A CN 201910720599 A CN201910720599 A CN 201910720599A CN 110420776 A CN110420776 A CN 110420776A
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- China
- Prior art keywords
- luminescence chip
- mask plate
- mask
- led backlight
- mask assembly
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
- B05B12/16—Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling the spray area
- B05B12/20—Masking elements, i.e. elements defining uncoated areas on an object to be coated
- B05B12/28—Masking elements, i.e. elements defining uncoated areas on an object to be coated for defining uncoated areas that are not enclosed within coated areas or vice versa, e.g. for defining U-shaped border lines
Abstract
The invention discloses a kind of mask assembly and the production methods of Mini LED backlight mould group, after the complete luminescence chip of die bond, it is covered in above luminescence chip and make each masked areas and luminescence chip to correspond the mask assembly, second occlusion part of masked areas in this way covers luminescence chip, spraying portion is corresponding with the gap location of luminescence chip surrounding, then the material for being used to make catoptric arrangement is formed into catoptric arrangement by the gap location that the hollowed out area in spraying portion is sprayed into luminescence chip, due to can luminescence chip surrounding simultaneously spray production catoptric arrangement material, therefore process is simpler, it is time-consuming less, spray efficiency is higher, has production；And in spraying process, the second occlusion part blocks luminescence chip and sprayed on material is avoided to be sprayed on luminescence chip, so that biggish welding error will not be caused to subsequent Mini LED backlight mould group.
Description
Technical field
The present invention relates to field of display technology, in particular to the production side of a kind of mask assembly and Mini LED backlight mould group
Method.
Background technique
It is existing the study found that if by mix titanium dioxide made of reflectivity be up to 95% white silica gel be coated in Mini
Gap on LED backlight substrate between luminescence chip forms shape of the mouth as one speaks enclosure wall, and as shown in FIG. 1A and 1B, Figure 1A is Mini LED back
The overlooking structure diagram of light, Figure 1B is the schematic diagram of the section structure of Mini LED backlight shown in figure 1A, on underlay substrate 1
Gap between luminescence chip 2 forms shape of the mouth as one speaks enclosure wall 3 and is greatly improved 2 light efficiency of luminescence chip and then improves Mini LED backlight
Overall brightness, and by the height h of control shape of the mouth as one speaks enclosure wall 3, with the parameters such as 2 distance d of luminescence chip, can be to luminescence chip
2 luminous light type is regulated and controled.Therefore, find the silica gel coating method of formation shape of the mouth as one speaks enclosure wall for having production a kind of for
There is critically important realistic meaning and market value for Mini LED backlight.
Currently, theoretically realizing that the silica gel coating scheme of shape of the mouth as one speaks enclosure wall has dispensing and steel mesh to print two kinds.
1, dispensing mode is to control colloid coated weight by dispenser after completing die bond on Mini LED backlight substrate,
And shape of the mouth as one speaks enclosure wall is formed by the mobility of colloid itself.In actual production, shape of the mouth as one speaks enclosure wall is formed using dispensing mode and needs three
A process, as shown in Fig. 2, first between the length direction spraying colloid of Mini LED backlight substrate, every two rows luminescence chip 2
Gap spraying colloid twice, the colloid spacing sprayed twice is 0.9mm, and colloid interlamellar spacing is 0.8mm, speed 90mm/
s.Secondly, the width direction along Mini LED backlight substrate sprays colloid, sprayed using scribing line formula, every section of colloid wire length 0.9mm,
Colloid interlamellar spacing is 0.8mm, speed 90mm/s.Finally, enclosing it in Mini LED backlight substrate peripheral position spraying plating colloid
At a big rectangle, to form peripheral enclosure wall, colloid interlamellar spacing is 0.8mm, speed 90*120%mm/s.But it adopts
Very complicated programming need to be carried out to dispenser by forming this coating method of shape of the mouth as one speaks enclosure wall with dispensing mode, and along Mini LED backlight
Length, width and the peripheral colloid three parts of substrate can expend for a long time when individually spraying.With backlight substrate size for 6.5
It is very little, for the Mini LED backlight substrate of 2 and 8 72 subregions of string, spray shape of the mouth as one speaks enclosure wall on it according to dispensing mode, then every
The glue spraying time of Mini LED backlight substrate is 21 minutes, and backlight substrate size is bigger, and luminescence chip quantity is more thereon, institute
The glue spraying time of consuming is longer.Therefore, shape of the mouth as one speaks enclosure wall is coated using dispensing mode on Mini LED backlight substrate not have
Production.
2, steel mesh mode of printing is first to print export-oriented enclosure wall on Mini LED backlight substrate by steel mesh, toasted to make
Colloid solidification carries out die bond again.But existing traditional steel mesh mode of printing the shortcomings that can not overcoming there is two.Firstly, because of steel
The limitation of web frame, coating shape of the mouth as one speaks silica gel, which needs to cover Mini LED luminescence chip pad locations, before die bond makes it not by silica gel
Covering.Currently, still may be implemented to cover while coating shape of the mouth as one speaks silica gel on Mini LED backlight substrate without one kind again
The clear scheme that Mini LED luminescence chip pad locations cover it by silica gel.Secondly as coated shape of the mouth as one speaks silica gel
Gap location between luminescence chip pad on Mini LED backlight substrate, and need to carry out backlight substrate while printing
Heating is to make printed silica gel solidify, because of cured colloid shape and irregularly and with certain height, after this can give
The process of continuous Mini LED backlight substrate die bond causes biggish welding error.In addition, the silica gel being sprayed on steel mesh is with the shape of the mouth as one speaks
Silica gel solidifies together, and the number for causing steel mesh reusable is extremely low, can not even reuse.
In conclusion the silica gel for forming the shape of the mouth as one speaks enclosure wall around luminescence chip surrounding applies in existing Mini LED backlight
In coating method there is complex procedures, spray efficiency is low, does not have production etc. can not overcome the shortcomings that.
Summary of the invention
The embodiment of the present invention provides the production method of a kind of mask assembly and Mini LED backlight mould group, to solve existing
Have in Mini LED backlight, there is processes to answer in the silica gel coating method of the shape of the mouth as one speaks enclosure wall of luminescence chip surrounding for formation
Miscellaneous, can not overcome the problems, such as the shortcomings that such as spray efficiency is low, does not have production.
The embodiment of the invention provides a kind of mask assembly, the mask assembly surrounds Mini LED backlight mould for making
The catoptric arrangement of each luminescence chip surrounding in group；The mask assembly include the first mask plate, first mask plate have with
The luminescence chip multiple masked areas correspondingly, first mask plate is between the two neighboring masked areas
Region is the first occlusion part；First mask plate includes for blocking the luminescence chip in each masked areas
Two occlusion parts, and be used to spray the spraying portion for making the catoptric arrangement material requested around the second occlusion part surrounding；
The spraying portion has multiple hollowed out areas.
Optionally, in the specific implementation, in above-mentioned mask assembly provided in an embodiment of the present invention, second occlusion part
Area be greater than the luminescence chip area.
Optionally, in the specific implementation, in above-mentioned mask assembly provided in an embodiment of the present invention, the hollowed out area
Shape is hexagon.
Optionally, in the specific implementation, in above-mentioned mask assembly provided in an embodiment of the present invention, each hexagon is tight
Solid matter arranges to form honeycomb.
It optionally, in the specific implementation, further include the second exposure mask in above-mentioned mask assembly provided in an embodiment of the present invention
Version, second mask plate have and the masked areas multiple open areas correspondingly；The area of the open area
Greater than the area of the masked areas.
Optionally, in the specific implementation, in above-mentioned mask assembly provided in an embodiment of the present invention, first mask plate
Material be nonmetallic materials, the material of second mask plate is metal material.
Correspondingly, the embodiment of the invention also provides a kind of production methods of Mini LED backlight mould group, comprising:
Multiple luminescence chips of array arrangement are formed on underlay substrate；
Mask assembly described in any of the above embodiments provided in an embodiment of the present invention is covered on the luminescence chip backwards to institute
Underlay substrate side is stated, and makes one a pair of each masked areas and the luminescence chip of the first mask plate in the mask assembly
It answers；
The material for being used to prepare catoptric arrangement is sprayed into the hair by the engraved structure in masked areas spraying portion
On underlay substrate between optical chip, the catoptric arrangement for surrounding each luminescence chip surrounding is formed.
Optionally, in the specific implementation, in above-mentioned production method provided in an embodiment of the present invention, by the embodiment of the present invention
The mask assembly described in any of the above embodiments provided is covered on the luminescence chip before the underlay substrate side, also wraps
It includes:
First mask plate and second mask plate are combined, and make the open region in second mask plate
Masked areas in domain and first mask plate corresponds；
Mask assembly described in any of the above embodiments provided in an embodiment of the present invention is covered on the luminescence chip backwards to institute
Underlay substrate side is stated, is specifically included:
Second mask plate is placed in the luminescence chip backwards to the underlay substrate side, by first mask plate
Second mask plate is placed in backwards to the underlay substrate side.
Optionally, in the specific implementation, in above-mentioned production method provided in an embodiment of the present invention, reflection will be used to prepare
The material of structure is sprayed on the underlay substrate between the luminescence chip by the engraved structure in masked areas spraying portion
Later, further includes:
Solidify the material on the underlay substrate being sprayed between the luminescence chip.
Optionally, in the specific implementation, in above-mentioned production method provided in an embodiment of the present invention, solidification is sprayed into described
After the material on underlay substrate between luminescence chip, further includes:
First mask plate and second mask plate are removed, the reflection for surrounding each luminescence chip surrounding is formed
Structure.
The present invention has the beneficial effect that:
The production method of mask assembly and Mini LED backlight mould group provided in an embodiment of the present invention is implemented using the present invention
When the above-mentioned mask assembly production that example provides surrounds the catoptric arrangement of each luminescence chip surrounding in Mini LED backlight mould group, due to
First mask plate have with luminescence chip multiple masked areas correspondingly, the first mask plate two neighboring masked areas it
Between region be the first occlusion part, each masked areas, which has, blocks the second occlusion part of luminescence chip, and hides around second
Stopper surrounding is used to spray the spraying portion of production catoptric arrangement material requested；Spraying portion has multiple hollowed out areas.It in this way can be with
After the complete luminescence chip of die bond, which is covered in above luminescence chip and is made each masked areas and luminescence chip one by one
Corresponding, the second occlusion part of such masked areas covers luminescence chip, and spraying portion is opposite with the gap location of luminescence chip surrounding
It answers, then forms the material for being used to make catoptric arrangement by the gap location that the hollowed out area in spraying portion is sprayed into luminescence chip
Catoptric arrangement, due to can luminescence chip surrounding simultaneously spray production catoptric arrangement material, process is simpler, consumption
When it is less, spray efficiency is higher, has production；And in spraying process, the second occlusion part blocks luminescence chip and avoids spraying
It applies on material spraying to luminescence chip, so that biggish welding error will not be caused to subsequent Mini LED backlight mould group.
Detailed description of the invention
Figure 1A is the overlooking structure diagram of the relevant technologies and the Mini LED backlight mould group in the present invention；
Figure 1B is the schematic diagram of the section structure of the relevant technologies and the Mini LED backlight mould group in the present invention；
Fig. 2 is the knot for being made each step of the shape of the mouth as one speaks enclosure wall around luminescence chip surrounding of dispensing mode in the related technology
Structure schematic diagram；
Fig. 3 is the structural schematic diagram of the first mask plate in mask assembly provided in an embodiment of the present invention；
Fig. 4 is the enlarged diagram of each masked areas of the first mask plate provided in an embodiment of the present invention；
Fig. 5 is the structural schematic diagram of the second mask plate in mask assembly provided in an embodiment of the present invention；
Fig. 6 is one of the flow chart of production method of Mini LED backlight mould group provided in an embodiment of the present invention；
Fig. 7 is the two of the flow chart of the production method of Mini LED backlight mould group provided in an embodiment of the present invention；
Fig. 8 is the three of the flow chart of the production method of Mini LED backlight mould group provided in an embodiment of the present invention；
Fig. 9 is the four of the flow chart of the production method of Mini LED backlight mould group provided in an embodiment of the present invention；
Figure 10 A- Figure 10 C is that the production method of Mini LED backlight mould group provided in an embodiment of the present invention is executing each step
Structural schematic diagram afterwards.
Specific embodiment
In order to make the purpose of the present invention, the technical scheme and advantages are more clear, with reference to the accompanying drawing, to the embodiment of the present invention
The specific embodiment of the production method of the mask assembly and Mini LED backlight mould group of offer is described in detail.It should manage
Solution, preferred embodiment disclosed below is only for the purpose of illustrating and explaining the present invention and is not intended to limit the present invention.And it is not rushing
In the case where prominent, the features in the embodiments and the embodiments of the present application be can be combined with each other.It should be noted that each in attached drawing
Layer film thickness and shape do not reflect actual proportions, and purpose is schematically illustrate the content of present invention.And it is identical from beginning to end or
Similar label indicates same or similar element or element with the same or similar functions.
A kind of mask assembly provided in an embodiment of the present invention, the mask assembly is for making around Mini as shown in Figure 1A
The catoptric arrangement 3 of each 2 surrounding of luminescence chip in LED backlight mould group；Specifically, as shown in figure 3, the mask assembly is covered including first
Film version 4, the first mask plate 4 is with multiple masked areas 41, the right side Fig. 3 also illustrate each correspondingly with luminescence chip 2
The enlarged diagram of a masked areas 41, region of first mask plate 4 between two neighboring masked areas 41 are blocked for first
Portion 411, the first mask plate 4 is in the second occlusion part 412, Yi Jiwei that each masked areas 41 includes for blocking luminescence chip 2
It is used to spray the spraying portion 413 for making 3 material requested of catoptric arrangement shown in figure 1A around 412 surrounding of the second occlusion part；Spraying portion
413 have multiple hollowed out areas 01.
Above-mentioned mask assembly provided in an embodiment of the present invention, since the first mask plate is with one-to-one with luminescence chip
Multiple masked areas, region of first mask plate between two neighboring masked areas are the first occlusion part, each masked areas
With the second occlusion part for blocking luminescence chip, and around the second occlusion part surrounding for material needed for spraying production catoptric arrangement
The spraying portion of material；Spraying portion has multiple hollowed out areas.It is surrounded using above-mentioned mask assembly production provided in an embodiment of the present invention
It, can be after the complete luminescence chip of die bond, by the exposure mask in Mini LED backlight mould group when the catoptric arrangement of each luminescence chip surrounding
Component is covered in above luminescence chip and makes each masked areas and luminescence chip to correspond, and the second of such masked areas is blocked
Portion covers luminescence chip, and spraying portion is corresponding with the gap location of luminescence chip surrounding, then will be used to make catoptric arrangement
Material forms catoptric arrangement by the gap location that the hollowed out area in spraying portion is sprayed into luminescence chip, due to can be in luminescence chip
Surrounding spray the material of production catoptric arrangement simultaneously, therefore process is simpler, and time-consuming less, spray efficiency is higher, the amount of having
Production property；And in spraying process, the second occlusion part blocks luminescence chip and sprayed on material is avoided to be sprayed on luminescence chip, thus
Biggish welding error will not be caused to subsequent Mini LED backlight mould group.
Further, in the specific implementation, in above-mentioned mask assembly provided in an embodiment of the present invention, as shown in figure 3, the
The area of two occlusion parts 412 is greater than the area of luminescence chip 2.Specifically, since the present invention is solid in Mini LED backlight mould group
After the luminescence chip 2 of brilliant complete array arrangement, the catoptric arrangement 3 of each 2 surrounding of luminescence chip is surrounded using the production of the first mask plate 4,
In the materials process for spraying catoptric arrangement 3 in order to prevent, on the material spraying to luminescence chip 2 of catoptric arrangement 3, therefore the present invention
The first mask plate 4 provided has and one-to-one second occlusion part 412 of luminescence chip 2, and the area of the second occlusion part 412
Greater than the area of luminescence chip 2, when the first mask plate 4 being covered in luminescence chip 2 backwards to 1 side of underlay substrate in this way, each the
Two occlusion parts 412 can shelter from corresponding luminescence chip 2 completely, and avoiding will reflection in the materials process of spraying catoptric arrangement 3
On the material spraying of structure 3 to luminescence chip 2, to biggish welding will not be caused to miss to subsequent Mini LED backlight mould group
Difference.
Further, in the specific implementation, in above-mentioned mask assembly provided in an embodiment of the present invention, as shown in figure 4, figure
4 be the enlarged diagram of each masked areas 41, and the shape of hollowed out area 01 is hexagon.When it is implemented, hollowed out area
01 is preferably shaped to regular hexagon.
Further, in the specific implementation, in above-mentioned mask assembly provided in an embodiment of the present invention, as shown in figure 4, respectively
Hexagonal close arranges to form honeycomb.Due to needing to tear the first mask plate after the production for completing catoptric arrangement, and by
Multiple Hexagonal closes arrange the stress inside the first mask plate of the honeycomb structure to be formed and can support the first mask plate
It completely tears, without remaining in Mini LED backlight mould group.
Further, in the specific implementation, in above-mentioned mask assembly provided in an embodiment of the present invention, the first mask plate
Material can be nonmetallic materials, and the first mask plate of nonmetallic materials production is generally disposable products.
In the specific implementation, the material of catoptric arrangement 3 shown in figure 1A is silica gel, which is made of mixing titanium dioxide.
Specifically, as shown in figure 3, the first occlusion part 411 of the first mask plate 4 is exposure mask main structure, it is located at spraying portion
413 be the honeycomb structure formed by multiple regular hexagon hollowed out areas.There are three make in the spraying portion 413 of the honeycomb structure
With: effect first is that the first occlusion part 411 and the second occlusion part 412 are connected, so that the first occlusion part 411, second blocking
Portion 412 and spraying portion 413 are configured to first mask plate 4 an of entirety；Effect will be second is that high reflection made of titanium dioxide will be mixed
Rate silica gel is sprayed on the underlay substrate of Mini LED backlight mould group by the hollowed out area 01 of the structure, the shape of the mouth as one speaks required for being formed
Silica gel enclosing wall (i.e. catoptric arrangement 3), while because spraying portion 413 is to the substrate base for being sprayed into Mini LED backlight mould group from the upper side
Silica gel on plate has the guiding function of similar pipeline, so that being formed by the shape of shape of the mouth as one speaks silica gel enclosing wall (i.e. catoptric arrangement 3)
It is more controllable and regular；Effect is third is that by the width of the second occlusion part 412 of control to control shape of the mouth as one speaks silica gel enclosing wall (i.e. reflection knot
Structure 3) distance (i.e. size B in Figure 1B) apart from luminescence chip, allow to the demand according to Mini LED backlight, to each
Luminescence chip issues the utilization rate of light and light type becomes more controllable.
Further, in the specific implementation, in above-mentioned mask assembly provided in an embodiment of the present invention, as shown in figure 5, also
Including the second mask plate 5, the second mask plate 5 has one-to-one more with the masked areas 41 of the first mask plate 4 shown in Fig. 3
A open area 51, and the meshing 52 between each open area 51；The area of open area 51 is greater than mask regions
The area in domain 41.Specifically, the second mask plate 5 is made of metal material, and can be reused, and main function is and first
Mask plate 4 combines, and provides support and positioning action for the first mask plate 4, enables the first mask plate 4 of thinner thickness very flat
Whole is placed in Mini LED backlight mould group, so that the first mask plate 4 be enable to complete to coat the material for forming catoptric arrangement
While can shelter from luminescence chip 2 again, make 2 pad locations of luminescence chip be not formed catoptric arrangement material covering.Second
The size of the open area 51 of mask plate 5 by luminescence chip 2 used in Mini LED backlight mould group size and required coating shape
It is codetermined at the width of the material of catoptric arrangement.Specifically, during making catoptric arrangement, as shown in Figure 10 B, exposure mask
Second occlusion part 412 and the luminescence chip 2 in region 41 correspond, gap location of the spraying portion between each luminescence chip 2, the
One occlusion part 411 shelters from meshing 52 and the outs open region 51 of the second mask plate 5.The material of second mask plate 5 is
Metal material can reuse.Specifically, due to the material of the first mask plate 4 be nonmetallic materials, thinner thickness,
Support and positioning action are poor；And the material of the second mask plate 5 is metal material, can play support and positioning action, therefore
When carrying out the production of catoptric arrangement, spraying catoptric arrangement is carried out using the sub-assembly of the second mask plate 5 and the first mask plate 4
Material is needed after having made catoptric arrangement since the second mask plate 5 only plays support and positioning action by the second mask plate 5
Removing, therefore in order to prevent in spraying process by the material spraying of catoptric arrangement to the second mask plate 5, it needs the second exposure mask
The area of the open area 51 of version 5 is set greater than the area of masked areas 41, and the spraying portion 413 of such masked areas 41 is just fallen
Enter into open area 51, it is overlapping without having with the entity part of the second mask plate 5, so that the material of catoptric arrangement be avoided to spray
It is applied on the second mask plate 5, so that the second mask plate 5 does not allow easily peelable and reusing poor.
In the specific implementation, as shown in Figure 1B, the height A of catoptric arrangement 3 by the second mask plate and the first mask plate thickness
Degree determines, the height of catoptric arrangement 3 can be determined according to the utilization rate and light type of luminescence chip sending light, and then determine second
The thickness of mask plate and the first mask plate, to form required catoptric arrangement.
In the specific implementation, the difference of number of chips, Fig. 3 institute due to different Mini LED backlight mould packet sizes and thereon
The first mask plate 4 and the second mask plate 5 shown in fig. 5 shown can expand or shrink required size.
Conceived based on same hair, the embodiment of the invention also provides a kind of production methods of Mini LED backlight mould group, such as
Shown in Fig. 6, comprising:
S601, multiple luminescence chips that array arrangement is formed on underlay substrate；
S602, above-mentioned mask assembly provided in an embodiment of the present invention is covered on to luminescence chip backwards to underlay substrate side,
And make each masked areas and luminescence chip one-to-one correspondence of the first mask plate in mask assembly；
S603, the material for being used to prepare catoptric arrangement is sprayed into luminous core by the engraved structure in masked areas spraying portion
On underlay substrate between piece, the catoptric arrangement for surrounding each luminescence chip surrounding is formed.
The production method of Mini LED backlight mould group provided in an embodiment of the present invention, after the complete luminescence chip of die bond, by this
Mask assembly is covered in above luminescence chip and makes each masked areas and luminescence chip to correspond, and the second of such masked areas
Occlusion part covers luminescence chip, and spraying portion is corresponding with the gap location of luminescence chip surrounding, then will be used to make reflection knot
The material of structure forms catoptric arrangement by the gap location that the hollowed out area in spraying portion is sprayed into luminescence chip, due to that can shine
The surrounding of chip sprays the material of production catoptric arrangement simultaneously, therefore process is simpler, and time-consuming less, spray efficiency is higher, tool
Standby production；And in spraying process, the second occlusion part blocks luminescence chip and sprayed on material is avoided to be sprayed on luminescence chip,
To which biggish welding error will not be caused to subsequent Mini LED backlight mould group.
Further, in the specific implementation, in above-mentioned mask assembly provided in an embodiment of the present invention, the present invention is implemented
The above-mentioned mask assembly that example provides is covered on luminescence chip before underlay substrate side, as shown in Figure 7, further includes:
S601 ', the first mask plate and the second mask plate are combined, and make open area in the second mask plate and the
Masked areas in one mask plate corresponds；
The mask assembly of any of the above-described provided in an embodiment of the present invention is covered on luminescence chip backwards to underlay substrate one
Side specifically includes:
Second mask plate is placed in luminescence chip backwards to underlay substrate side, the first mask plate is placed in the second mask plate back
To underlay substrate side.
Further, in the specific implementation, it in above-mentioned mask assembly provided in an embodiment of the present invention, will be used to prepare anti-
After penetrating on the underlay substrate that the material of structure is sprayed between luminescence chip by the engraved structure in masked areas spraying portion, such as
Shown in Fig. 8, further includes:
S604, solidify material on the underlay substrate being sprayed between luminescence chip.
Further, in the specific implementation, in above-mentioned mask assembly provided in an embodiment of the present invention, solidification is sprayed into hair
After the material on underlay substrate between optical chip, as shown in Figure 9, further includes:
S605, the first mask plate of removing and the second mask plate, form the catoptric arrangement for surrounding each luminescence chip surrounding.
It is carried out below by production method of the specific embodiment to present invention Mini LED backlight mould group shown in figure 1A detailed
It describes in detail bright:
(1) CNT is welded: CNT (connector) welding position brush tin at the underlay substrate back side of Mini LED backlight mould group
Afterwards, manually or automatically CNT and welding position are aligned and are fixed on Mini LED backlight mould in CNT pin placement of foot point red glue
The CNT weld at the underlay substrate back side of group.
(2) die bond: in the underlay substrate front luminescence chip welding position brush tin of Mini LED backlight mould group, to bonder
Thimble height, speed, after the parameters such as luminescence chip position identification are programmed on substrate and blue film, can be carried on the back in Mini LED
The work of full page die bond is completed on the underlay substrate of optical mode group, i.e., multiple luminescence chips of array arrangement are formed on underlay substrate 1
2, as shown in Figure 10 A.
(3) Reflow Soldering: a Reflow Soldering is carried out to the Mini LED backlight mould group for completing the work of full page die bond, is carried out later
Lighting test.If test result OK, Mini LED backlight mould group is cleaned；If test result NG, to defective products into
Row is reprocessed.Secondary back postwelding is carried out to the Mini LED backlight mould group after reprocessing, carries out lighting test, test result OK again
Then continue to clean it.
(4) the parameter adjustment of spraying equipment: in material (silicone spray) technique of spraying production catoptric arrangement, first will
A glue and B glue are closed very much according to pre-designed ratio, and the glue mixed is injected into the glue container of glue sprayer
In, pre- glue spraying effect is observed after exhausting the air in glue, until the parameter of glue spraying equipment is adjusted optimally.
(5) the second mask plate 5 is placed in luminescence chip 2 backwards to 1 side of underlay substrate, the first mask plate 4 is placed in second
Mask plate 5 corresponds each masked areas 41 of the first mask plate 4 and luminescence chip 2 backwards to 1 side of underlay substrate, makes
Masked areas 41 in open area 51 and the first mask plate 4 in second mask plate 5 corresponds, detailed process such as Figure 10 B
It is shown.
(6) start glue sprayer, the spraying production reflection knot in the entire plane where the spraying portion of the first mask plate 4 413
The glue (silica gel material) of structure.Solidify the underlay substrate being sprayed between luminescence chip 2 by the hollowed out area 01 in spraying portion 413
Material on 1, i.e., so that shape of the mouth as one speaks silica gel enclosing wall (catoptric arrangement 3) solidifies；Specifically, according to the characteristic of glue used, setting is roasting
Case parameter toasts Mini LED backlight mould group, so that glue is fully cured.
(7) the first mask plate 4 and the second mask plate 5 are removed, the catoptric arrangement 3 for surrounding each 2 surrounding of luminescence chip is formed,
As illustrated in figure 10 c.
(8) protection of UV film luminescence chip 2 and reflection knot thereon are pasted into Mini LED backlight mould group front shown in Figure 10 C
Structure 3 is not destroyed, with engineering side extra on cutting machine cutting underlay substrate 1.To the Mini LED for completing all cutting work
Backlight module pastes UV film side and carries out the irradiation of UV light, so that UV film loses viscosity.Finally by UV film from backlight module
Under this, the pre-production of whole Mini LED backlight mould groups is so far just completed.
Mini LED backlight mould group shown in figure 1A of the embodiment of the present invention is made in (1)-step (8) through the above steps.
The production method of mask assembly and Mini LED backlight mould group provided in an embodiment of the present invention is implemented using the present invention
When the above-mentioned mask assembly production that example provides surrounds the catoptric arrangement of each luminescence chip surrounding in Mini LED backlight mould group, due to
First mask plate have with luminescence chip multiple masked areas correspondingly, the first mask plate two neighboring masked areas it
Between region be the first occlusion part, each masked areas, which has, blocks the second occlusion part of luminescence chip, and hides around second
Stopper surrounding is used to spray the spraying portion of production catoptric arrangement material requested；Spraying portion has multiple hollowed out areas.It in this way can be with
After the complete luminescence chip of die bond, which is covered in above luminescence chip and is made each masked areas and luminescence chip one by one
Corresponding, the second occlusion part of such masked areas covers luminescence chip, and spraying portion is opposite with the gap location of luminescence chip surrounding
It answers, then forms the material for being used to make catoptric arrangement by the gap location that the hollowed out area in spraying portion is sprayed into luminescence chip
Catoptric arrangement, due to can luminescence chip surrounding simultaneously spray production catoptric arrangement material, process is simpler, consumption
When it is less, spray efficiency is higher, has production；And in spraying process, the second occlusion part blocks luminescence chip and avoids spraying
It applies on material spraying to luminescence chip, so that biggish welding error will not be caused to subsequent Mini LED backlight mould group.
Obviously, various changes and modifications can be made to the invention without departing from essence of the invention by those skilled in the art
Mind and range.In this way, if these modifications and changes of the present invention belongs to the range of the claims in the present invention and its equivalent technologies
Within, then the present invention is also intended to include these modifications and variations.
Claims (10)
1. a kind of mask assembly, which is characterized in that the mask assembly is respectively sent out in Mini LED backlight mould group for making
The catoptric arrangement of optical chip surrounding；The mask assembly includes the first mask plate, and first mask plate has to shine with described
Chip multiple masked areas correspondingly, region of first mask plate between the two neighboring masked areas are the
One occlusion part；First mask plate includes blocking for blocking the second of the luminescence chip in each masked areas
Portion, and be used to spray the spraying portion for making the catoptric arrangement material requested around the second occlusion part surrounding；The spray
Painting portion has multiple hollowed out areas.
2. mask assembly as described in claim 1, which is characterized in that the area of second occlusion part is greater than the luminous core
The area of piece.
3. mask assembly as described in claim 1, which is characterized in that the shape of the hollowed out area is hexagon.
4. mask assembly as claimed in claim 3, which is characterized in that each Hexagonal close arranges to form honeycomb.
5. mask assembly according to any one of claims 1-4, which is characterized in that it further include the second mask plate, described second
Mask plate has and the masked areas multiple open areas correspondingly；The area of the open area is greater than the exposure mask
The area in region.
6. mask assembly as claimed in claim 5, which is characterized in that the material of first mask plate is nonmetallic materials,
The material of second mask plate is metal material.
7. a kind of production method of Mini LED backlight mould group characterized by comprising
Multiple luminescence chips of array arrangement are formed on underlay substrate；
Mask assembly as claimed in any one of claims 1 to 6 is covered on the luminescence chip backwards to the underlay substrate one
Side, and make each masked areas and luminescence chip one-to-one correspondence of the first mask plate in the mask assembly；
The material for being used to prepare catoptric arrangement is sprayed into the luminous core by the engraved structure in masked areas spraying portion
On underlay substrate between piece, the catoptric arrangement for surrounding each luminescence chip surrounding is formed.
8. production method as claimed in claim 7, which is characterized in that by mask set as claimed in any one of claims 1 to 6
Part is covered on the luminescence chip before the underlay substrate side, further includes:
First mask plate and second mask plate are combined, and make open area in second mask plate with
Masked areas in first mask plate corresponds；
Mask assembly as claimed in any one of claims 1 to 6 is covered on the luminescence chip backwards to the underlay substrate one
Side specifically includes:
Second mask plate is placed in the luminescence chip backwards to the underlay substrate side, first mask plate is placed in
Second mask plate is backwards to the underlay substrate side.
9. production method as claimed in claim 8, which is characterized in that cover the material for being used to prepare catoptric arrangement by described
After the engraved structure in diaphragm area spraying portion is sprayed on the underlay substrate between the luminescence chip, further includes:
Solidify the material on the underlay substrate being sprayed between the luminescence chip.
10. production method as claimed in claim 9, which is characterized in that solidify the substrate being sprayed between the luminescence chip
After material on substrate, further includes:
First mask plate and second mask plate are removed, the reflection knot for surrounding each luminescence chip surrounding is formed
Structure.
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| CN201910720599.9A CN110420776B (en) | 2019-08-06 | 2019-08-06 | Mask assembly and method for manufacturing Mini LED backlight module |
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|---|---|---|---|
| CN201910720599.9A CN110420776B (en) | 2019-08-06 | 2019-08-06 | Mask assembly and method for manufacturing Mini LED backlight module |
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| CN110420776B CN110420776B (en) | 2021-03-02 |
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| CN113777828A (en) * | 2021-08-24 | 2021-12-10 | 武汉华星光电技术有限公司 | Light source structure and backlight module |
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