JPH0238898Y2 - - Google Patents

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Publication number
JPH0238898Y2
JPH0238898Y2 JP1986038990U JP3899086U JPH0238898Y2 JP H0238898 Y2 JPH0238898 Y2 JP H0238898Y2 JP 1986038990 U JP1986038990 U JP 1986038990U JP 3899086 U JP3899086 U JP 3899086U JP H0238898 Y2 JPH0238898 Y2 JP H0238898Y2
Authority
JP
Japan
Prior art keywords
sealed
metal fitting
ceramic body
face
soldered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1986038990U
Other languages
Japanese (ja)
Other versions
JPS61168141U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986038990U priority Critical patent/JPH0238898Y2/ja
Publication of JPS61168141U publication Critical patent/JPS61168141U/ja
Application granted granted Critical
Publication of JPH0238898Y2 publication Critical patent/JPH0238898Y2/ja
Expired legal-status Critical Current

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Description

【考案の詳細な説明】 本考案は、セラミツクスに金具をろう付けして
形成される封着部品に関する。
[Detailed Description of the Invention] The present invention relates to a sealed component formed by brazing metal fittings to ceramics.

一般に、セラミツクスに金具をろう付けして形
成される封着部品は、従来のガラスと金属の構造
をもつハーメチツクシールまたはプラスチツク等
を利用した製品よりも、気密性、耐熱性、熱間絶
縁性、耐電圧性、機械的強度等が一段と優れてい
るため、シリコン整流素子外囲器、マイクロ波ダ
イオード用ケース、電子管外囲器等の電子部品と
して広く用いられている。
In general, sealed parts formed by brazing metal fittings to ceramics have better airtightness, heat resistance, and hot insulation than products using conventional hermetic seals with glass and metal structures or plastics. Because of its superior properties such as durability, voltage resistance, and mechanical strength, it is widely used as electronic components such as silicon rectifier envelopes, microwave diode cases, and electron tube envelopes.

第1図は、このような封着部品の一実施例を示
すもので、円筒状のセラミツクス体1に、同一板
厚を有する円筒の金具2の一端が銀ろう3により
ろう付けされて構成されている。
FIG. 1 shows an example of such a sealed part, in which one end of a cylindrical metal fitting 2 having the same plate thickness is soldered to a cylindrical ceramic body 1 with a silver solder 3. ing.

なお、このような封着部品のろう付けは、一般
に、セラミツクス体1の金具2とのろう付け部
に、あらかじめメタライジング処理を施こした
後、セラミツクス体1と金具2との間に円環状の
銀ろう3を挿置した状態で、これを例えば800〜
850℃の水素雰囲気中に挿入し、銀ろう3を溶融
することによつて行なわれる。
In addition, in general, when brazing such a sealed part, the part of the ceramic body 1 to be brazed with the metal fitting 2 is subjected to a metallizing treatment in advance, and then an annular shape is formed between the ceramic body 1 and the metal fitting 2. With the silver solder 3 inserted, for example 800~
This is done by inserting it into a hydrogen atmosphere at 850°C and melting the silver solder 3.

このように構成された封着部品では、金具2の
端面とセラミツクス体1の端面とがろう付けされ
ることとなるため、セラミツクス体1の加工が安
価にでき、比較的廉価な封着部品を提供すること
ができるが、金具2とセラミツクス体1との引張
強度が低く封着部品の機械的強度が不充分である
という欠点があつた。
In the sealed part configured in this way, the end face of the metal fitting 2 and the end face of the ceramic body 1 are brazed, so the processing of the ceramic body 1 can be done at low cost, and a relatively inexpensive sealed part can be manufactured. However, the drawback is that the tensile strength between the metal fitting 2 and the ceramic body 1 is low and the mechanical strength of the sealed parts is insufficient.

本考案は、かかる従来の欠点を解消すべくなさ
れたもので、金具の端面をセラミツクスのメタラ
イズ面に突き合せてろう接してなり、前記金具の
ろう接部を、前記端面に向けて断面先細に形成し
て該先細部分と前記メタライズ面により形成され
る隅部にろう材を充填したことを特徴とする封着
部品を提供しようとするものである。
The present invention has been made in order to eliminate such conventional drawbacks, and is made by brazing the end face of a metal fitting against the metallized surface of ceramics, and making the soldered part of the metal fitting taper in cross section toward the end face. The object of the present invention is to provide a sealed part characterized in that a corner formed by the tapered part and the metallized surface is filled with a brazing material.

以下、本考案の詳細を第2図および第3図に示
す一実施例について説明する。
Hereinafter, details of the present invention will be described with reference to an embodiment shown in FIGS. 2 and 3.

第2図に示す封着部品は、円筒状のセラミツク
ス体4の一端に、円筒の金具5の一端が銀ろう6
によりろう付けされて構成されており、円筒の金
具5の一端先端部7は、第3図に第2図に示した
A部の詳細を示すように、先端先細りの台形形状
に、旋削等の機械加工により形成されている。
The sealing part shown in FIG.
The tip 7 at one end of the cylindrical metal fitting 5 is shaped into a tapered trapezoidal shape by turning, etc., as shown in FIG. 3, which shows details of part A shown in FIG. It is formed by machining.

以上のように構成された封着部品は、第1図に
示した封着部品と同様に、セラミツクス体4の金
具5とのろう付け部に、あらかじめメタライジン
グ処理を施こした後、セラミツクス体4と金具5
との間に円環状の銀ろう6を挿置した状態で、こ
れを例えば830℃の水素雰囲気中に挿入し、銀ろ
う6を溶融することによつて行なわれる。
The sealed part constructed as described above is similar to the sealed part shown in FIG. 4 and metal fittings 5
This is done by inserting an annular silver solder 6 between the two and inserting it into a hydrogen atmosphere at, for example, 830° C. to melt the silver solder 6.

しかしながら、以上のように構成された封着部
品では、金具5の先端部7は、先端先細りの形状
に形成されているので、水素雰囲気中で溶融した
銀ろう6は、第3に示すように先端部7をはい上
り先細部と、セラミツクスのメタライズ面により
形成される隅部にろう材が充填された状態でセラ
ミツクス体4と金具5とは封着されるため、セラ
ミツクス体4と金具5との接合強度は、第1図に
示した封着部品に比較して大巾に向上する。
However, in the sealed component configured as described above, the tip 7 of the metal fitting 5 is formed in a tapered shape, so that the silver solder 6 melted in the hydrogen atmosphere is The ceramic body 4 and the metal fitting 5 are sealed together with the brazing material filled in the corner formed by the tip part 7 and the metallized surface of the ceramic. The bonding strength is greatly improved compared to the sealed parts shown in FIG.

また、封着に必要な銀ろう量が少なくても充分
な封着が得られるという効果をも奏する。
Further, there is also the effect that sufficient sealing can be obtained even if the amount of silver solder required for sealing is small.

実施例 外径16mm、内径12mm、高さ10mmの円筒状のセラ
ミツクス体4に、それぞれ先端部7の形状を上辺
巾0.2mm、底辺巾0.3〜0.6mmの等辺台形状とされる
板厚0.3〜0.6mm、外径Φ14mm、高さ7.5mmの金具5
を第2図に示すように銀ろう6によりろう付けし
封着部品を得た。
Example: A cylindrical ceramic body 4 with an outer diameter of 16 mm, an inner diameter of 12 mm, and a height of 10 mm is made of a plate having a thickness of 0.3 to 0.3 mm and a tip 7 having an equilateral trapezoidal shape with a top width of 0.2 mm and a bottom width of 0.3 to 0.6 mm. 0.6mm, outer diameter Φ14mm, height 7.5mm metal fitting 5
As shown in FIG. 2, these were brazed with silver solder 6 to obtain a sealed part.

このようにして得られた、100個の封着部品の
引張強度の平均値は、200Kgであつた。また、封
着部の気密度は、ヘリウムによる気密試験により
3×10-8c.c./secの気密度を満足するものであつ
た。
The average tensile strength of the 100 sealed parts thus obtained was 200 kg. In addition, the airtightness of the sealed portion was found to satisfy the airtightness of 3×10 −8 cc/sec in a helium airtightness test.

比較例 先端部7の形状を第1図に示すようにストレー
トとされる以外は、実施例と同様に構成される封
着部品を得た。
Comparative Example A sealed part having the same structure as the example was obtained except that the tip portion 7 was made straight as shown in FIG.

このようにして得られた、100個の封着部品の
引張強度の平均値は100Kgであつた。
The average tensile strength of the 100 sealed parts thus obtained was 100 kg.

本考案封着部品のろう接部の他の例を第4図に
示す。第4図に示すものは絞り加工により得られ
る金具を打抜くことにより得られ好ましいもので
ある。
Another example of the soldered portion of the sealed component of the present invention is shown in FIG. The one shown in FIG. 4 is preferably obtained by punching out a metal fitting obtained by drawing.

以上述べたように、本考案によれば、金具はセ
ラミツクス体に強固に接合されるので、気密性の
高い、機械的強度に優れた封着部品を提供するこ
とができる。
As described above, according to the present invention, since the metal fitting is firmly bonded to the ceramic body, it is possible to provide a sealed component with high airtightness and excellent mechanical strength.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は、従来の封着部品の一実施例を示す縦
断面図、第2図は、本考案の封着部品の一実施例
を示す縦断面図、第3図は、第2図のA部の要部
を示す縦断面図、第4図は本考案の他の例の接合
要部を示す縦断面図である。 1,4……セラミツクス体、2,5……金具、
3,6……銀ろう。
FIG. 1 is a longitudinal sectional view showing an embodiment of a conventional sealing component, FIG. 2 is a longitudinal sectional view showing an embodiment of the sealing component of the present invention, and FIG. 3 is a longitudinal sectional view showing an embodiment of a conventional sealing component. FIG. 4 is a vertical cross-sectional view showing the main parts of part A, and FIG. 4 is a vertical cross-sectional view showing the main parts of the joint of another example of the present invention. 1, 4... Ceramic body, 2, 5... Metal fittings,
3,6...Silver wax.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 金具の端面をセラミツクスのメタライズ面に突
き合わせてろう接してなり、前記金具のろう接部
を、前記端面に向けて断面先細に形成してろう材
が先細部とメタライズ面により形成される隅部に
充填されてなることを特徴とする封着部品。
The end face of the metal fitting is butted against the metallized surface of the ceramic and soldered, and the soldered part of the metal fitting is formed to have a tapered cross section toward the end face, and the brazing material is applied to the corner formed by the tapered part and the metallized surface. A sealed part characterized by being filled.
JP1986038990U 1986-03-19 1986-03-19 Expired JPH0238898Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986038990U JPH0238898Y2 (en) 1986-03-19 1986-03-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986038990U JPH0238898Y2 (en) 1986-03-19 1986-03-19

Publications (2)

Publication Number Publication Date
JPS61168141U JPS61168141U (en) 1986-10-18
JPH0238898Y2 true JPH0238898Y2 (en) 1990-10-19

Family

ID=30546520

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986038990U Expired JPH0238898Y2 (en) 1986-03-19 1986-03-19

Country Status (1)

Country Link
JP (1) JPH0238898Y2 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52114608A (en) * 1976-03-23 1977-09-26 Tokyo Shibaura Electric Co Soldered structure of ceramics with al

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52114608A (en) * 1976-03-23 1977-09-26 Tokyo Shibaura Electric Co Soldered structure of ceramics with al

Also Published As

Publication number Publication date
JPS61168141U (en) 1986-10-18

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