JPH0313993Y2 - - Google Patents
Info
- Publication number
- JPH0313993Y2 JPH0313993Y2 JP1982011811U JP1181182U JPH0313993Y2 JP H0313993 Y2 JPH0313993 Y2 JP H0313993Y2 JP 1982011811 U JP1982011811 U JP 1982011811U JP 1181182 U JP1181182 U JP 1181182U JP H0313993 Y2 JPH0313993 Y2 JP H0313993Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- resistor pattern
- ceramic heater
- ceramic
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000919 ceramic Substances 0.000 claims description 24
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 9
- 239000011521 glass Substances 0.000 claims description 8
- 238000005553 drilling Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 9
- 238000005219 brazing Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Landscapes
- Resistance Heating (AREA)
Description
【考案の詳細な説明】
本案はセラミツクヒータにおけるリード線の取
付構造に関するものである。[Detailed Description of the Invention] The present invention relates to a lead wire mounting structure in a ceramic heater.
在来のセラミツクヒータは第1図、第2図にて
例示したようにアルミナセラミツクなどのセラミ
ツク体1に発熱抵抗パターン2が埋設してあり該
発熱抵抗パターン2の両端を露出させた露出端部
3にニツケルメツキを施し、銀ロウでもつて熱膨
張率が近似したコバー、42アロイ、ニツケルなど
の金属よりなるリード線4をロウ接したものであ
る。そのため発熱抵抗パターン2がセラミツク体
1中に埋設され、外気と遮断されていることから
腐蝕性ガスや酸化による発熱抵抗パターンの劣化
や断線の恐れが少なく、温度の立上りが速く、し
かも発熱抵抗パターン2がタングステン、モリブ
テン、マンガンなどの金属粉末を主体に形成され
たもので正の温度抵抗係数をもち、ある一定温度
以上には上昇しないという自己温度調整機能を有
するなどの特長を有しており、広く各方面で利用
されている。 In a conventional ceramic heater, as illustrated in FIGS. 1 and 2, a heating resistor pattern 2 is embedded in a ceramic body 1 such as alumina ceramic, and both ends of the heating resistor pattern 2 are exposed at exposed ends. 3 is plated with nickel, and a lead wire 4 made of a metal such as Kovar, 42 alloy, or nickel, which has a coefficient of thermal expansion similar to that of silver solder, is soldered to the lead wire 4. Therefore, since the heating resistor pattern 2 is buried in the ceramic body 1 and isolated from the outside air, there is less risk of deterioration or disconnection of the heating resistor pattern due to corrosive gas or oxidation, and the temperature rises quickly. 2 is mainly formed from metal powders such as tungsten, molybdenum, and manganese, and has a positive temperature resistance coefficient, and has features such as a self-temperature adjustment function that does not rise above a certain temperature. , is widely used in various fields.
ところが、このような長所を有しているにも拘
らず、発熱抵抗パターン2の露出端部3にロウ接
して取り付けるリード線4としても最も一般的な
ニツケル線の場合、セラミツク体、銀ロウ、ニツ
ケル金属の各熱膨張係数が完全に同一でないた
め、熱膨張差に基づく熱応力がくり返し作用し、
またリード線4のロウ接部分も数百度程度に加熱
され続けることから空気中の酸素により酸化され
たりセラミツクヒータが使用される雰囲気とし
て、例えば石油燃焼器における硫化ガスによつて
銀ロウが硫化銀となり脆弱なものとなる。上記の
ような要因が相乗して発熱抵抗パターン2の露出
端部3にロウ接されたリード線4に対し振動や外
力が作用するとリード線4が剥離してしまい、発
熱抵抗パターン2やセラミツク体1には何等異状
が生じていないにも拘らずヒータとして機能しな
い事態が生じていた。 However, despite having such advantages, nickel wire, which is most commonly used as the lead wire 4 that is soldered to the exposed end 3 of the heating resistor pattern 2, is made of ceramic, silver solder, Since the coefficients of thermal expansion of nickel metal are not completely the same, thermal stress based on the difference in thermal expansion acts repeatedly,
In addition, since the soldering part of the lead wire 4 is continuously heated to about several hundred degrees, the atmosphere in which the ceramic heater is used may be oxidized by oxygen in the air, or silver solder may be oxidized by sulfide gas in an oil burner, for example. This makes it vulnerable. When the above factors combine and vibration or external force acts on the lead wire 4 soldered to the exposed end 3 of the heat generating resistor pattern 2, the lead wire 4 will peel off, causing damage to the heat generating resistor pattern 2 and the ceramic body. 1 had a situation where it did not function as a heater even though there was no abnormality.
本案は上記事態に鑑みて開発したセラミツクヒ
ータであつて、特にリード線の取付強度の低下を
回避せんとするものである。 The present invention is a ceramic heater developed in view of the above situation, and is particularly intended to avoid a decrease in the mounting strength of the lead wires.
以下、図により本案実施例を具体的に説明す
る。なお、従来と同一部品は同一符号を付す。 Hereinafter, embodiments of the present invention will be explained in detail with reference to the drawings. Note that parts that are the same as before are given the same symbols.
第3図イは本考案実施例に係るセラミツクヒー
タの一部断面図である。このセラミツクヒータは
セラミツク体1中に発熱抵抗パターン2を埋設し
たものであり、前記セラミツク体1の一部に凹部
7を穿設してその底面に発熱抵抗パターン2を露
出させ、この露出端部3にニツケルメツキを施し
た後、銀ロウを用いてリード線4をロウ接し、前
記凹部7中にガラス材を充填し溶着させることに
より、ロウ接部およびリード線4の端部を覆う如
くガラス質層5を被着した構造となつている。 FIG. 3A is a partial sectional view of a ceramic heater according to an embodiment of the present invention. This ceramic heater has a heating resistor pattern 2 embedded in a ceramic body 1. A recess 7 is formed in a part of the ceramic body 1, and the heating resistor pattern 2 is exposed at the bottom of the recess 7. After nickel plating 3, the lead wire 4 is soldered using silver solder, and a glass material is filled in the recess 7 and welded to cover the soldered part and the end of the lead wire 4. It has a structure in which layer 5 is applied.
また、同図ロに示した実施例のように発熱抵抗
パターン2の一部をセラミツク体1の表面まで延
在させた露出端部3を取囲むようにセラミツクま
たはガラス等よりなる枠体6を配置して凹部7を
形成し、前記露出端部3にリード線4をロウ接す
るとともに、前記凹部7中にガラス材を充填して
ガラス質層5を形成したものでもよい。 In addition, as in the embodiment shown in FIG. Alternatively, a concave portion 7 may be formed, a lead wire 4 is soldered to the exposed end portion 3, and a glass material is filled in the concave portion 7 to form a vitreous layer 5.
このように、本考案のセラミツクヒータは、凹
部7中で、発熱抵抗パターン2の露出端部3とリ
ード線4をロウ接するとともに、前記凹部7中に
ガラス材を充填してガラス質層5を形成したもの
であるため、該ガラス質層5が剥離する恐れはな
く、強固な接合構造とできる。 As described above, in the ceramic heater of the present invention, the exposed end portion 3 of the heating resistor pattern 2 and the lead wire 4 are brazed together in the recess 7, and the recess 7 is filled with a glass material to form the vitreous layer 5. Since the vitreous layer 5 is formed, there is no fear that the vitreous layer 5 will peel off, and a strong bonding structure can be achieved.
次に第2図ロで示したリード線のロウ接構造をも
ち、リード線径が1mmで、ロウ材およびその量が
同じであるなどの同一条件でもつて、20個のサン
プルを製作し、そのうち10個には第3図イで示し
た実施例のように融点が約500℃のガラス材を用
い厚さ約1mmのガラス質層を形成した。これらガ
ラス質層を被着したサンプル10個、被着していな
いロウ接したままのサンプル10個の合計20個に対
し、同一条件の雰囲気のもとで300℃の断続的加
熱を繰り返し、約500時間後、各リード線に同一
方向の外力を作用させたところ、ロウ接したまま
でガラス質層を被着していないサンプルは10個の
うち1個を除きすべてのリード線がロウ接部から
剥離してしまつた。一方ガラス質層を被着したサ
ンプル10個は全く異状を来たさず、その後、同様
の加熱繰り返し実験を5000時間行つた後において
もロウ接部から剥離したサンプルは1個もなく、
ロウ接部の強度劣化は全く見当らなかつた。Next, 20 samples were manufactured under the same conditions, such as the lead wire brazing structure shown in Figure 2 B, the lead wire diameter was 1 mm, and the same amount of brazing material. For 10 pieces, a glass material having a melting point of about 500° C. was used to form a vitreous layer about 1 mm thick, as in the example shown in FIG. 3A. A total of 20 samples, 10 with the glassy layer attached and 10 unattached with the solder, were repeatedly heated intermittently at 300℃ under the same atmosphere. After 500 hours, when an external force was applied to each lead wire in the same direction, all but one of the 10 lead wires remained in solder contact but did not have a glassy layer attached. It peeled off from me. On the other hand, the 10 samples coated with the glassy layer showed no abnormality at all, and even after repeated heating experiments for 5000 hours, not a single sample peeled off from the solder joint.
No deterioration in strength of the brazed joint was observed at all.
これは、ガラス質層を被着してあることにより
リード線からの外力や応力がロウ接部に作用する
のを回避し、かつ、ガラス質層の圧着効果による
ものと考えられる。 This is thought to be due to the fact that the glass layer prevents external force or stress from the lead wire from acting on the solder joint, and also because of the pressure bonding effect of the glass layer.
以上のように本案は、セラミツクヒータのリー
ド線ロウ接部及びロウ接して取付けられたリード
線のロウ接部近傍がガラス質層でもつて覆われた
構造としたもので、セラミツク体、ロウ材、リー
ド線の各材質の熱膨張差に基づく熱応力、リード
線に作用する外力を回避せしめるとともに緻密な
ガラス質層が硫化ガスの如き有害なガスを遮断
し、ロウ材の劣化を防ぐなど、リード線ロウ接部
の強度の低下を招来しないセラミツクヒータを提
供することができる。 As described above, the present invention has a structure in which the solder joints of the ceramic heater lead wires and the vicinity of the solder joints of the lead wires attached in solder contact are covered with a glassy layer, and the ceramic body, the brazing material, It avoids thermal stress due to the difference in thermal expansion between the lead wire materials and external forces acting on the lead wire, and the dense glass layer blocks harmful gases such as sulfide gas and prevents deterioration of the brazing material. It is possible to provide a ceramic heater that does not cause a decrease in the strength of the wire soldering portion.
第1図イ、ロ、第2図イ、ロは在来のセラミツ
クヒータのリード線ロウ接態様を示す平面図とX
−X線断面図をそれぞれ示す図である。第3図
イ、ロはそれぞれ本考案実施例に係るセラミツク
ヒータのリード線ロウ接部を示す部分断面図であ
る。
1:セラミツク体、2:発熱抵抗パターン、
3:露出端部、4:リード線、5:ガラス質層。
Figures 1A and 2B and Figure 2A and 2B are plan views showing the solder connection of lead wires of conventional ceramic heaters, and
- It is a figure which shows each X-ray cross-sectional view. FIGS. 3A and 3B are partial cross-sectional views showing the lead wire soldering portion of the ceramic heater according to the embodiment of the present invention. 1: Ceramic body, 2: Heat generating resistor pattern,
3: exposed end, 4: lead wire, 5: glassy layer.
Claims (1)
なるセラミツクヒータにおいて、前記セラミツク
体の穿設するか、また枠体を取付けることによつ
て凹部を形成し、該凹部の底面に露出させた発熱
抵抗パターンの露出端部にリード線をロウ接する
とともに、該ロウ接部の表面およびリード線の端
部を覆うように前記凹部内にガラス材を充填して
成るセラミツクヒータ。 In a ceramic heater having a heat generating resistor pattern embedded in a ceramic body, a recess is formed by drilling the ceramic body or by attaching a frame, and the heat generating resistor pattern is exposed at the bottom of the recess. A ceramic heater in which a lead wire is soldered to the exposed end of the ceramic heater, and a glass material is filled in the recess so as to cover the surface of the soldered part and the end of the lead wire.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1181182U JPS58115096U (en) | 1982-02-01 | 1982-02-01 | ceramic heater |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1181182U JPS58115096U (en) | 1982-02-01 | 1982-02-01 | ceramic heater |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58115096U JPS58115096U (en) | 1983-08-05 |
JPH0313993Y2 true JPH0313993Y2 (en) | 1991-03-28 |
Family
ID=30024402
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1181182U Granted JPS58115096U (en) | 1982-02-01 | 1982-02-01 | ceramic heater |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58115096U (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4578647B2 (en) * | 2000-06-01 | 2010-11-10 | 株式会社美鈴工業 | Lead member connecting method and heating element with lead member |
JP5345914B2 (en) * | 2009-09-14 | 2013-11-20 | 日本特殊陶業株式会社 | Ceramic heater |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5152531A (en) * | 1974-10-31 | 1976-05-10 | Kyoto Ceramic | HATSUNETSUSOSHI |
-
1982
- 1982-02-01 JP JP1181182U patent/JPS58115096U/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5152531A (en) * | 1974-10-31 | 1976-05-10 | Kyoto Ceramic | HATSUNETSUSOSHI |
Also Published As
Publication number | Publication date |
---|---|
JPS58115096U (en) | 1983-08-05 |
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