JPS62150628A - Connecting structure of ceramics and metal - Google Patents

Connecting structure of ceramics and metal

Info

Publication number
JPS62150628A
JPS62150628A JP29055485A JP29055485A JPS62150628A JP S62150628 A JPS62150628 A JP S62150628A JP 29055485 A JP29055485 A JP 29055485A JP 29055485 A JP29055485 A JP 29055485A JP S62150628 A JPS62150628 A JP S62150628A
Authority
JP
Japan
Prior art keywords
ceramics
metal
ceramic
brazing
tube
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP29055485A
Other languages
Japanese (ja)
Inventor
Mamoru Kurokuzuhara
黒葛原 守
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP29055485A priority Critical patent/JPS62150628A/en
Publication of JPS62150628A publication Critical patent/JPS62150628A/en
Pending legal-status Critical Current

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  • Microwave Tubes (AREA)

Abstract

PURPOSE:To obtain an inexpensive electron tube without producing a metalized film over a ceramics, by forming a fitting step at the ceramics and soldering a metallic tube with a solder containing an active metal. CONSTITUTION:At a stem ceramics 8 is furnished a step 81 to which the inner periphery (or outer periphery) of a seal tube 5 is inserted. In such a connection structure, a molten solder 14 is sunk around the end surface and the inner periphery (or outer periphery) or the seal tube 5, by a capillary phenomenon, so that a broad soldering area and a good connection can be obtained. Moreover, by placing foil-form solders 15 and 16 beforehand between the seal tube 5 and the step 81 and then melting them, a more secure soldering can be acquired.

Description

【発明の詳細な説明】 〔発明の利用分野〕 本発明はセラミックスと金属の接合技術に係り、特にセ
ラミックスを用いる電子管の封着構造の改良に係るもの
である。
DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a technique for joining ceramics and metal, and particularly to an improvement in the sealing structure of an electron tube using ceramics.

〔発明の背景〕[Background of the invention]

電子管の中で、封着部材としてセラミックスを用いるも
のは、マグネトロン、X線管、送信管など多岐に亘って
いる。その多くは、セラミックスとしてアルミナを用い
、金属部材との接合方法はアルミナの接合面に、Mo−
Mnペーストを塗布し、水素炉中で焼成し、メタライズ
層を形成し、更にNiめっきを施す、いわゆる高融点金
属法による接合層を設けて、銀銅共晶ろうをろう材とし
て用いて金属部材と接合する方法が広く普及している。
Among electron tubes, there are a wide variety of electron tubes that use ceramics as a sealing member, such as magnetrons, X-ray tubes, and transmission tubes. Most of them use alumina as the ceramic, and the method of joining with metal members is to attach Mo-
A bonding layer is provided by the so-called high-melting point metal method, in which Mn paste is applied, fired in a hydrogen furnace, a metallized layer is formed, and Ni plating is applied, and a silver-copper eutectic solder is used as a brazing material to produce metal parts. The method of joining with is widely used.

具体例としてマグネトロンを例にセラミックスと金属部
材の接合例を説明する。第1図は電子レンジ等に用いる
マグネトロンの管球本体の横断面を示す。1は熱電子を
放出する陰極、2は内部に空胴共振器を形成する陽極で
、管球本体の外部からの磁力線を前記陰極1と陽極2で
形成される作用空間に集中させる磁極3,4があり、こ
れらを包含する形でシール円筒5,6が陽極2の円筒部
に当接されている。更に封着部材としてのセラミックス
は陰極1を保持し、陰極電流を供給する陰極端子7とと
もに、前記シール円筒5に接合されるステムセラミック
ス8と、陽極2の特定のベインから延在するアンテナ9
を囲み、前記シール円筒6と排気管10を保持する排気
管サポート11が接合され、発生するマイクロ波の放射
窓となるアンテナセラミックス12とがある。
As a specific example, an example of joining ceramics and a metal member will be explained using a magnetron as an example. FIG. 1 shows a cross section of a tube body of a magnetron used in a microwave oven or the like. 1 is a cathode that emits thermoelectrons, 2 is an anode that forms a cavity resonator inside, and a magnetic pole 3 that concentrates magnetic lines of force from outside the tube body into the action space formed by the cathode 1 and the anode 2; 4, and seal cylinders 5 and 6 are abutted against the cylindrical portion of the anode 2 in a manner that encompasses these cylinders. Further, ceramics as a sealing member holds the cathode 1 and includes a cathode terminal 7 for supplying cathode current, a stem ceramics 8 joined to the seal cylinder 5, and an antenna 9 extending from a specific vane of the anode 2.
There is an antenna ceramic 12 that surrounds the seal cylinder 6 and the exhaust pipe support 11 that holds the exhaust pipe 10, and that serves as a radiation window for the generated microwaves.

ここにおいてステムセラミックス8とアンテナセラミッ
クス12と、金属部材の接合部については、各々ステム
セラミックス8とシール円筒5およびアンテナセラミッ
クス12とシール円筒6、排気管サポート11は同一形
態の接合構造である。
Here, regarding the joints between the stem ceramics 8, the antenna ceramics 12, and the metal members, the stem ceramics 8 and the seal cylinder 5, the antenna ceramics 12, the seal cylinder 6, and the exhaust pipe support 11 have the same joint structure.

即ち、例として、第2図にステムセラミックス8とシー
ル円筒5の接合部の拡大断面図で示すように、ステムセ
ラミックス8の端面には、高融点金属法によるメタライ
ズ膜8aとNiめつき層8bとが有り、シール円筒5が
銀ろう13を介してろう付されている。この構造は、い
わゆる突合せ接合と称し、シール円筒5とステムセラミ
ックス8の熱膨張差によるストレスをシール円筒5が柔
軟性を有することによって吸収している。この構造に関
しては特開昭56−24733にても開示されている技
術である。この技術によりシール円筒として安価な鉄材
を使うことができる。一方、ステムセラミックス8と陰
極端子7の接合構造は。
That is, as an example, as shown in FIG. 2, which is an enlarged cross-sectional view of the joint between the stem ceramics 8 and the seal cylinder 5, the end face of the stem ceramics 8 is coated with a metallized film 8a formed by a refractory metal method and a Ni plating layer 8b. The seal cylinder 5 is brazed with silver solder 13. This structure is called a butt joint, and the flexibility of the seal cylinder 5 absorbs the stress caused by the difference in thermal expansion between the seal cylinder 5 and the stem ceramics 8. This structure is a technique also disclosed in Japanese Patent Laid-Open No. 56-24733. This technology allows the use of inexpensive iron material as the seal cylinder. On the other hand, the bonding structure between the stem ceramics 8 and the cathode terminal 7 is as follows.

いわゆる面付けと称し、第3図の拡大図で示されるよう
に、比較的広い接合面を有し、端子7とメタライズ膜8
a、Niめっき層8bが銀ろう13を介してろう付けさ
れる。この場合は、端子7の材料がステムセラミックス
8の熱膨張係数に近い金属、例えば、セラミックスがア
ルミナであると、コバールやファー二などに限定される
This is called surface bonding, and as shown in the enlarged view of FIG.
a, Ni plating layer 8b is brazed with silver solder 13 interposed therebetween. In this case, the material of the terminal 7 is a metal having a coefficient of thermal expansion close to that of the stem ceramics 8, for example, if the ceramic is alumina, it is limited to Kovar, Furni, etc.

以上の高融点金属法によるメタライズ技術や、接合構造
は銀ろうが金属に対して、非常に濡れ性が良いことから
良好な接合が得られ広く利用されているものであるが、
反面、高融点金属法はメタライズ膜を形成する工程が長
く、セラミック部材のコスト高に繋がり、より廉価な電
子管を得るには大きな障害となっている。
The metallization technology and bonding structure using the above-mentioned high-melting-point metal method are widely used because silver solder has very good wettability with metal, resulting in good bonding.
On the other hand, the high melting point metal method requires a long process to form a metallized film, which leads to high costs for ceramic members, and is a major obstacle to obtaining cheaper electron tubes.

〔発明の目的〕[Purpose of the invention]

本発明は、安価な電子管を得る為に簡便な接合法を利用
し、その接合法を利用するのに好適な接合構造を提供す
ることを目的とする。
An object of the present invention is to utilize a simple bonding method in order to obtain an inexpensive electron tube, and to provide a bonding structure suitable for using the bonding method.

〔発明の概要〕[Summary of the invention]

セラミックスにメタライズ膜を生成することを必要とし
ないで、活性金属を添加したろう材を用い、このろう材
を用いるのに好都合なセラミックスの形状を利用するも
のである。
It is not necessary to produce a metallized film on ceramics, but instead uses a brazing filler metal to which an active metal is added, and utilizes the shape of the ceramic that is convenient for using this brazing filler metal.

〔発明の実施例〕[Embodiments of the invention]

本発明は、特開昭59−232692号や特開昭60−
40687号などに開示されているような、銀ろうや銅
ろう中にTiやZrなどの活性金属を添加されたろう材
を用いるろう付は方法を利用するものである。
The present invention is applicable to Japanese Patent Application Laid-open Nos. 59-232692 and 60-60.
40687, etc., brazing using a brazing filler metal in which an active metal such as Ti or Zr is added to a silver solder or a copper solder is utilized.

この方法の接合のメカニズムは、ろう中のTiやZrが
一部酸化されてアルミナと直接反応したり、TiやZr
のイオンがアルミナ結晶中に拡散し、接合界面に、アル
ミナとの固溶体や化合物が生成し、接合されるものであ
る。
The bonding mechanism of this method is that Ti and Zr in the solder are partially oxidized and react directly with alumina, or that Ti and Zr
ions diffuse into the alumina crystal, forming a solid solution or compound with alumina at the bonding interface, resulting in bonding.

これによれば、ろう材を供給するだけで1回の加熱でろ
う付けできるし、高融点金属法の様なはん雑な工程を経
て、メタライズ面を得る必要がないので非常にコスト的
に有利な方法であることは明白である。
According to this method, brazing can be performed in one heating process by simply supplying the filler metal, and there is no need to go through the complicated process of refractory metal method to obtain a metallized surface, so it is very cost-effective. It is clear that this is an advantageous method.

但し接合部の熱応力を緩和する第2図の接合部構造をそ
のまま取り入れる場合において、セラミックスの端部に
はろうの流れの良いメタライズ面がないので、ろう何時
、溶融したろう材はシール円筒5の方により多く濡れて
しまい、セラミックス側には、流れにくいので、良好な
接合部が得られない。
However, if the joint structure shown in Fig. 2, which alleviates the thermal stress at the joint, is adopted as is, there is no metallized surface on the end of the ceramic that allows the solder to flow well, so when the solder melts, the molten filler metal flows into the sealing cylinder 5. The ceramic side gets wet more and it is difficult to flow to the ceramic side, so a good joint cannot be obtained.

従い、本発明では第4図に示すように、シール円筒5の
内周(外周でも良い)が嵌合する段部81をステムセラ
ミックス8に設けることが特徴である。この接合部形状
によれば、シール円筒5の端部の平面と内周面(外周面
でも良い)に亘り、溶けたろう材14が毛細管現象によ
り入り込むので広いろう付は面を得て、良好な接合が得
られる。
Therefore, as shown in FIG. 4, the present invention is characterized in that the stem ceramics 8 is provided with a stepped portion 81 into which the inner periphery (or the outer periphery) of the seal cylinder 5 fits. According to this joint shape, the melted brazing filler metal 14 enters through the flat surface of the end of the seal cylinder 5 and the inner circumferential surface (or the outer circumferential surface) by capillary action, so that wide brazing can be achieved with a good surface. A bond is obtained.

尚、本発明によるセラミックスの形状をより良く、生か
す為に、第5図や第6図に示すように箔状のろう材15
.16をあらかじめシール円筒5との間にはさみ込んで
箔状ろう材を溶融させることによってより確実なろう付
けを得ることができる。
In addition, in order to make better use of the shape of the ceramic according to the present invention, a foil-shaped brazing filler metal 15 is used as shown in FIGS. 5 and 6.
.. 16 is sandwiched between the seal cylinder 5 and the foil-shaped brazing material in advance to melt the brazing material, thereby achieving more reliable brazing.

〔発明の効果〕〔Effect of the invention〕

本発明によれば、セラミックスに高価なメタライズ面を
設ける必要のない活性金属法によるろう付けが行えるの
で、安価な電子管を得ることが出来、更には、ろう付は
時に用いる組立治具(図示せず)は、セラミックスとシ
ール円筒の位置出しがセラミックスに設けた段部とのは
め合いにより、自ずと得られるので、大幅に簡単な構造
のもの、あるいは治具を不要とすることが出来るなどの
副次的な効果を奏する。
According to the present invention, since it is possible to perform brazing by an active metal method that does not require providing an expensive metallized surface on ceramics, it is possible to obtain an inexpensive electron tube. (2) The positioning of the ceramic and the sealing cylinder is automatically achieved by fitting the stepped part provided on the ceramic, so it is possible to have a significantly simpler structure or to eliminate the need for a jig. It has the following effects.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は一般のマグネトロン管球本体−構造例を示す断
面図、第2,3図は従来より普及しているセラミックス
と金属筒の接合部構造を示す要部断面図、第4.5.6
図は本発明によるセラミックスと金属筒の接合部構造を
示す要部断面図である。 1・・・陰極、2・・・陽極、5,6・・・シール円筒
、7・・・端子、8・・・ステムセラミックス、12・
・・セラミックス、13,14゜15.16・・・ろう
材。
Fig. 1 is a sectional view showing an example of the structure of a general magnetron tube body, Figs. 2 and 3 are sectional views of main parts showing a conventionally popular joint structure of a ceramic and metal cylinder, and Fig. 4.5. 6
The figure is a sectional view of a main part showing the structure of a joint between a ceramic and a metal cylinder according to the present invention. DESCRIPTION OF SYMBOLS 1... Cathode, 2... Anode, 5, 6... Seal cylinder, 7... Terminal, 8... Stem ceramics, 12...
... Ceramics, 13,14°15.16... Brazing metal.

Claims (1)

【特許請求の範囲】 1、セラミックスと金属筒のろう付けによる接合構造に
おいて、前記セラミックスに前記金属筒端部の内周もし
くは外周とのはめ合い段部を形成し、かつ、活性金属入
りのろう材により該金属筒をろう付接合することを特徴
とするセラミックスと金属の接合構造。 2、上記はめ合い段部と金属筒の間に、箔状のろう材を
はさみ込んでろう付することを特徴とする特許請求の範
囲第1項記載のセラミックスと金属の接合構造。
[Claims] 1. In a joining structure by brazing a ceramic and a metal cylinder, the ceramic has a stepped portion that fits with the inner periphery or outer periphery of the end of the metal cylinder, and the solder contains an active metal. A joining structure of ceramics and metal, characterized in that the metal cylinder is joined by brazing with a material. 2. The ceramic-metal bonding structure according to claim 1, wherein a foil-shaped brazing material is sandwiched between the fitting stepped portion and the metal tube for brazing.
JP29055485A 1985-12-25 1985-12-25 Connecting structure of ceramics and metal Pending JPS62150628A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29055485A JPS62150628A (en) 1985-12-25 1985-12-25 Connecting structure of ceramics and metal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29055485A JPS62150628A (en) 1985-12-25 1985-12-25 Connecting structure of ceramics and metal

Publications (1)

Publication Number Publication Date
JPS62150628A true JPS62150628A (en) 1987-07-04

Family

ID=17757531

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29055485A Pending JPS62150628A (en) 1985-12-25 1985-12-25 Connecting structure of ceramics and metal

Country Status (1)

Country Link
JP (1) JPS62150628A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0241354U (en) * 1988-09-09 1990-03-22
JPH0241356U (en) * 1988-09-09 1990-03-22
KR20010092585A (en) * 2000-03-22 2001-10-26 구자홍 The structure for brazing in magnetron

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5736735A (en) * 1980-08-13 1982-02-27 Hitachi Ltd KODENATSUZETSUENSHINKUYOKI

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5736735A (en) * 1980-08-13 1982-02-27 Hitachi Ltd KODENATSUZETSUENSHINKUYOKI

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0241354U (en) * 1988-09-09 1990-03-22
JPH0241356U (en) * 1988-09-09 1990-03-22
KR20010092585A (en) * 2000-03-22 2001-10-26 구자홍 The structure for brazing in magnetron

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