JPS58156581A - Manufacture of sealing parts - Google Patents
Manufacture of sealing partsInfo
- Publication number
- JPS58156581A JPS58156581A JP3653382A JP3653382A JPS58156581A JP S58156581 A JPS58156581 A JP S58156581A JP 3653382 A JP3653382 A JP 3653382A JP 3653382 A JP3653382 A JP 3653382A JP S58156581 A JPS58156581 A JP S58156581A
- Authority
- JP
- Japan
- Prior art keywords
- silver solder
- nickel oxide
- sealed
- parts
- metal member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
[発明の技術分野]
本発明は、銀ろうの流れ出しを防止して気密性および作
業性を向上させた封着部品の製造方法に関づる。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a method for manufacturing a sealed component that prevents silver solder from flowing out and improves airtightness and workability.
[発明の技術的背景とその問題点]
一般にセラミック部材に金属部材をろう付けして形成さ
れる封着部品は、ガラスを用いて封止したハーメチック
シールやプラスチックにより封止L/ t、−製品より
も気密性、耐熱性、熱間絶縁性、耐電圧性、機械的強度
等が一段と優れているため、シリコン整流素子外囲器、
マイクロ波ダイオード用ケース、電子管外囲器等の電子
部品として広く用いられている。[Technical background of the invention and its problems] Generally, sealed parts formed by brazing a metal member to a ceramic member are hermetic seals sealed using glass or L/T sealed with plastic. Silicon rectifying element envelope,
It is widely used as electronic components such as microwave diode cases and electron tube envelopes.
第1図はこのような封着部品の一例を示すもので、円筒
状のセラミック部材1に、この内径よりわずかに大径の
金属部材2が載せられ、両者の接触面が銀ろう3により
ろう付けされて構成されている。FIG. 1 shows an example of such a sealed part, in which a metal member 2 with a slightly larger diameter than the inner diameter is placed on a cylindrical ceramic member 1, and the contact surface between the two is soldered with silver solder 3. It is attached and configured.
このような封着部品のろう付けは、一般にセラミック部
材1の金属部材2とのろう付は部にあらかじめメタライ
ジング処理を施した後、セラミック部材1と金属部材2
との間に円環状の銀ろう3を介在させ状態で、これを例
えば790〜900℃の水素雰囲気中に置いて銀ろう3
を溶融することによって行われている。In general, when brazing such sealed parts, the ceramic member 1 and the metal member 2 are brazed after the ceramic member 1 and the metal member 2 are subjected to a metallizing treatment in advance.
With an annular silver solder 3 interposed between the silver solder 3 and
This is done by melting.
しかしてこのような到着部品の製造方法においては、溶
融した銀ろうがろう付は部から流れ出して後工程で行な
われる抵抗溶接に際して銀ろうがコバールの粒界に侵入
してクラックを発生させるために気密性が阻害され、更
に流れ出た銀ろうを除去するために煩雑な手段を要する
という欠点があった。However, in this method of manufacturing incoming parts, the molten silver solder flows out of the parts and during the resistance welding performed in the subsequent process, the silver solder enters the grain boundaries of Kovar and causes cracks. There were disadvantages in that airtightness was impaired and furthermore, complicated means were required to remove the flowing silver solder.
[発明の目的]
本発明は、このような問題解消するためなされたもので
、銀ろうの流れ出しを簡単に防止して部品の気密性を向
上させるとともに、作業性を向上させた封着部品の製造
方法を提供することを目的とする。[Purpose of the Invention] The present invention was made to solve these problems, and it provides a sealing part that easily prevents silver solder from flowing out, improves the airtightness of the part, and improves workability. The purpose is to provide a manufacturing method.
[発明の概!!1
すなわち本発明は、ろうづけ部に配置された銀ろうと銀
ろうの流れ込みの好ましくない場所との間に酸化ニッケ
ルペーストを塗布して還元雰囲気内で加熱し銀ろうを溶
融させることを特徴とするものである。[Summary of the invention! ! 1. That is, the present invention is characterized in that a nickel oxide paste is applied between the silver solder placed in the brazing part and the unfavorable place where the silver solder flows, and then heated in a reducing atmosphere to melt the silver solder. It is something.
本発明に使用する酸化ニッケルペーストは、酸化ニッケ
ル粉末に熱可塑性アクリル樹脂等の有機バインダを数%
配合して得られるものであり、塗布厚さは10〜20μ
が適切である。The nickel oxide paste used in the present invention is a mixture of nickel oxide powder and several percent organic binder such as thermoplastic acrylic resin.
It is obtained by blending, and the coating thickness is 10 to 20μ
is appropriate.
本発明方法は、第2図に示すように円筒状セラミック部
材1のメタライズ処理の施された部分と円筒状金属部材
2との間に銀ろう3を挿置し、さらにこの銀ろう3と銀
ろうの流れ出しがあっては好ましくない部分(図中の矢
印部分)との間に酸化ニッケルペースト4を塗布した後
、還元雰囲気中で加熱するものである。In the method of the present invention, as shown in FIG. After applying the nickel oxide paste 4 between the parts where wax flow is undesirable (the arrow parts in the figure), it is heated in a reducing atmosphere.
このような本発明方法によれば、銀ろうの溶融に先立ち
酸化ニッケルペーストの塗布層はペースト中の有機バイ
ンダが消失して多孔質となるとともに、酸化ニッケルが
還元されることによりニッケル焼結層となり、その結果
、流れ込んできた銀ろうとよく馴染んで一体化するため
銀ろうの流れを防止することができる。According to the method of the present invention, the organic binder in the paste disappears in the applied layer of nickel oxide paste prior to melting the silver solder and becomes porous, and the nickel oxide is reduced to form a nickel sintered layer. As a result, it blends well with the flowing silver solder and becomes integrated with it, thereby preventing the silver solder from flowing.
[発明の実施例] 次に本発明の実施例について説明する。[Embodiments of the invention] Next, examples of the present invention will be described.
実施例
外径54寵、内径46n1高さIonの円筒状のセラミ
ック部材の端面に411Jのメタライズ処理を施した後
、外t!! 60 mm、内径47寵、高さ6寵、厚さ
0・4mmのコバール合金材の円筒を第2図に示すよう
に重ねてその間に銀ろうを装置し、さらにコバール合金
材の外周面にそのろう付は部より1n離れたところまで
酸化ニッケルペースト(酸化ニッケル粉末100重量部
とアクリル樹脂51量部との混合物)をはけで15μ−
の厚さに塗布した。Example: After metallizing the end face of a cylindrical ceramic member with a diameter of 54mm, an inner diameter of 46n1, and a height of Ion to a thickness of 411J, the outer diameter of the ceramic member was 411J. ! As shown in Figure 2, cylinders made of Kovar alloy material with a diameter of 60 mm, an inner diameter of 47 cm, a height of 6 cm, and a thickness of 0.4 mm were stacked together and silver solder was placed between them, and the outer peripheral surface of the Kovar alloy material was coated with silver solder. For brazing, apply nickel oxide paste (a mixture of 100 parts by weight of nickel oxide powder and 51 parts by weight of acrylic resin) to 15μ-
It was applied to a thickness of .
次いで、水素雰囲気中850℃で加熱して得られた封着
部品は、ヘリウムによる気密試験により10 ’ cc
/ seaの気密度を満足した。Next, the sealed parts obtained by heating at 850°C in a hydrogen atmosphere were tested to be 10' cc by an airtight test using helium.
/ Sea airtightness was satisfied.
以上の実施例では、セラミック部材、と金属部材との封
着部品について説明したが、本発明方法は金属部材と金
属部材との封着部品についても適用できる。また部材の
形状は円筒状に限定されない。In the above embodiments, a sealed part between a ceramic member and a metal member has been described, but the method of the present invention can also be applied to a sealed part between a metal member and a metal member. Further, the shape of the member is not limited to a cylindrical shape.
[発明の効果]
以上の実施例からも明らかなように本発明方法によれば
、銀ろうの流れ出しがなく得られる封着部品は気密度の
優れたものになる。[Effects of the Invention] As is clear from the above examples, according to the method of the present invention, the sealed parts obtained without silver solder flowing out have excellent airtightness.
第1図は従来方法による封着部品の例を示す縦断面図、
第2図は本発明方法による封着部品の一実施例を示す縦
断面図である。
1・・・・・・・・・・・・セラミック部材2・・・・
・・・・・・・・金属部材
3・・・・・・・・・・・・銀ろう
4・・・・・・・・・・・・酸化ニッケルペースト(7
317) 代理人弁理士 則近憲佑(ほか1名)FIG. 1 is a longitudinal cross-sectional view showing an example of a sealed part by a conventional method;
FIG. 2 is a longitudinal sectional view showing an embodiment of a sealed part according to the method of the present invention. 1... Ceramic member 2...
......Metal member 3...Silver solder 4...Nickel oxide paste (7
317) Representative Patent Attorney Kensuke Norichika (and 1 other person)
Claims (2)
部材間、あるいは金属部材と金属部材間に銀ろうを介在
させ、この銀ろうと銀ろうの流れ込みの好ましくない場
所との間に酸化ニッケルペーストを塗布した後、還元雰
囲気内で加熱し銀ろうを溶融させることを特徴とする封
着部品の製造方法。(1) Silver solder is interposed between the metallized ceramic member and the metal member, or between the metal members, and nickel oxide paste is applied between the silver solder and the unfavorable places where the silver solder flows. A method for producing a sealed part, which comprises heating the silver solder in a reducing atmosphere to melt the silver solder.
機バインダとからなる特許請求の範囲第1項記載の封着
部品の製造方法。(2) The method for manufacturing a sealed component according to claim 1, wherein the nickel oxide paste comprises nickel oxide powder and an organic binder.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3653382A JPS58156581A (en) | 1982-03-10 | 1982-03-10 | Manufacture of sealing parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3653382A JPS58156581A (en) | 1982-03-10 | 1982-03-10 | Manufacture of sealing parts |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS58156581A true JPS58156581A (en) | 1983-09-17 |
Family
ID=12472418
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3653382A Pending JPS58156581A (en) | 1982-03-10 | 1982-03-10 | Manufacture of sealing parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58156581A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5018659A (en) * | 1988-06-06 | 1991-05-28 | U.S. Philips Corp. | Method of bonding a metal oxide to a metal |
WO2002020143A1 (en) * | 2000-09-08 | 2002-03-14 | Nippon Steel Corporation | Ceramic/metal composite article, composite structure for transporting oxide ion, and composite article having sealing property |
-
1982
- 1982-03-10 JP JP3653382A patent/JPS58156581A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5018659A (en) * | 1988-06-06 | 1991-05-28 | U.S. Philips Corp. | Method of bonding a metal oxide to a metal |
WO2002020143A1 (en) * | 2000-09-08 | 2002-03-14 | Nippon Steel Corporation | Ceramic/metal composite article, composite structure for transporting oxide ion, and composite article having sealing property |
US7153559B2 (en) | 2000-09-08 | 2006-12-26 | Nippon Steel Corporation | Ceramic-metal composite body, composite structure for transporting oxide ion, and composite body having sealing property |
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