JPH0238466U - - Google Patents
Info
- Publication number
- JPH0238466U JPH0238466U JP11452888U JP11452888U JPH0238466U JP H0238466 U JPH0238466 U JP H0238466U JP 11452888 U JP11452888 U JP 11452888U JP 11452888 U JP11452888 U JP 11452888U JP H0238466 U JPH0238466 U JP H0238466U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- ring
- holder
- wafer holder
- transport mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 230000007723 transport mechanism Effects 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 claims 8
- 238000007738 vacuum evaporation Methods 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
Description
第１図は本考案に係る成膜装置の縦断面図、第
２図はウエーハ搬送機構の正面図、第３図は同じ
く側面図、第４図はウエーハホルダの概略側面図
、第５図乃至第１２図は金属膜形成の工程図、第
１３図は金属膜形成の要部拡大概略正面図、第１
４図は同じく要部拡大概略側面図である。第１５
図は従来の成膜装置の縦断面正面図、第１６図は
同じく要部拡大部分断面図である。
１５……半導体ウエーハ、１８……蒸着物質、
２０……ウエーハホルダ、２１……ホルダ本体、
３１……ロードロツク室、３２……真空蒸着室、
３２ａ……搬入口、３２ｂ……搬出口、３３……
アンロードロツク室、４０……ウエーハ搬送機構
。
Fig. 1 is a longitudinal sectional view of the film forming apparatus according to the present invention, Fig. 2 is a front view of the wafer transport mechanism, Fig. 3 is a side view of the same, Fig. 4 is a schematic side view of the wafer holder, and Figs. Fig. 12 is a process diagram of metal film formation, Fig. 13 is an enlarged schematic front view of main parts of metal film formation, and Fig. 1
FIG. 4 is also an enlarged schematic side view of the main part. 15th
The figure is a vertical cross-sectional front view of a conventional film forming apparatus, and FIG. 16 is an enlarged partial cross-sectional view of the main part. 15... Semiconductor wafer, 18... Vapor deposition substance,
20...Wafer holder, 21...Holder main body,
31...Loadlock chamber, 32...Vacuum deposition chamber,
32a... Carrying inlet, 32b... Carrying out outlet, 33...
Unload lock chamber, 40...wafer transfer mechanism.
Claims (1)
り、周面に沿つて複数の半導体ウエーハを収納・
保持した断面リング状のウエーハホルダと、 上記ウエーハホルダの外周を支持し、直立姿勢
で回転させながら回転軸方向に前進させるウエー
ハ搬送機構と、 上記ウエーハホルダの搬入・搬出口を有すると
共に、ウエーハホルダのリング内に配された蒸着
源と上記ウエーハ搬送機構とが内蔵され、ウエー
ハホルダを搬入口から搬出口へ回転させながら回
転軸方向に前進させつつ半導体ウエーハを蒸着し
て成形する真空蒸着室と、 上記搬入・搬出口に連設されたロードロツク室
、アンロードロツク室とを具備したことを特徴と
する成膜装置。[Claims for Utility Model Registration] The main body of a half-ring-shaped holder is connected so that it can be opened and closed, and multiple semiconductor wafers can be stored along the circumference.
a wafer holder having a ring-shaped cross section; a wafer transport mechanism that supports the outer periphery of the wafer holder and advances it in the direction of the rotational axis while rotating it in an upright position; A vacuum evaporation chamber in which a wafer holder placed in a ring and a wafer transport mechanism are built in, and a wafer holder is rotated from an inlet to an outlet while advancing in the direction of the rotation axis to evaporate and form a semiconductor wafer. . A film forming apparatus comprising a load lock chamber and an unload lock chamber connected to the loading/unloading port.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11452888U JPH0238466U (en) | 1988-08-31 | 1988-08-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11452888U JPH0238466U (en) | 1988-08-31 | 1988-08-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0238466U true JPH0238466U (en) | 1990-03-14 |
Family
ID=31355362
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11452888U Pending JPH0238466U (en) | 1988-08-31 | 1988-08-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0238466U (en) |
-
1988
- 1988-08-31 JP JP11452888U patent/JPH0238466U/ja active Pending
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