JPH0245920A - Semiconductor manufacturing device - Google Patents
Semiconductor manufacturing deviceInfo
- Publication number
- JPH0245920A JPH0245920A JP19696788A JP19696788A JPH0245920A JP H0245920 A JPH0245920 A JP H0245920A JP 19696788 A JP19696788 A JP 19696788A JP 19696788 A JP19696788 A JP 19696788A JP H0245920 A JPH0245920 A JP H0245920A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- exhaust chamber
- gas
- semiconductor manufacturing
- preliminary exhaust
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 8
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 235000012431 wafers Nutrition 0.000 claims description 18
- 239000000428 dust Substances 0.000 abstract description 5
- 230000000694 effects Effects 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
Landscapes
- Cleaning In General (AREA)
- Prevention Of Fouling (AREA)
- Drying Of Semiconductors (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体製造装置に関し、特に予備排気室を有す
る半導体製造装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to semiconductor manufacturing equipment, and particularly to a semiconductor manufacturing equipment having a preliminary exhaust chamber.
従来、半導体製造装置は、予備排気室ヘウェーハを出し
入れする際外気が予備排気室内へ流れ込む構造となって
いた。Conventionally, semiconductor manufacturing equipment has a structure in which outside air flows into the preliminary exhaust chamber when a wafer is taken into or taken out from the preliminary exhaust chamber.
上述した従来の半導体製造装置は、予備排気室ヘウェー
ハを出し入れする際、外気が予備排気室へ流れ込む構造
となっているので、ウェーハの出し入れ時に、予備排気
室内へ外気中のごみが入り込むという欠点があった。The above-mentioned conventional semiconductor manufacturing equipment has a structure in which outside air flows into the preliminary exhaust chamber when wafers are taken in and out of the preliminary exhaust chamber, so there is a drawback that dust in the outside air enters the preliminary exhaust chamber when wafers are taken in and out of the preliminary exhaust chamber. there were.
本発明の半導体製造装置は、予備排気室のウェーハ出し
入れ口にガスのカーテンを設けている。In the semiconductor manufacturing apparatus of the present invention, a gas curtain is provided at the wafer inlet/outlet of the preliminary exhaust chamber.
次に、本発明の実施例について図面を参照して説明する
。Next, embodiments of the present invention will be described with reference to the drawings.
第１図（ａ）、（ｂ）は本発明の第１の実施例の断面図
及び正面図である。FIGS. 1(a) and 1(b) are a sectional view and a front view of a first embodiment of the present invention.
ウェーハを収納する予備排気室１は搬送室５とバルブ４
で仕切られている。また、予備排気室１内はウェーハが
収納されると矢印７で示すように排気され、バルブ４が
開き２、ウェーハが搬送される。再びウェーハが予備排
気室に戻り、予備排気室１内が大気になると、ウェーハ
出し入れ口の扉３が開き、ウェーハの出し入れを行う。A preliminary exhaust chamber 1 for storing wafers has a transfer chamber 5 and a valve 4.
It is separated by Further, when the wafer is stored in the preliminary exhaust chamber 1, the interior of the preliminary exhaust chamber 1 is evacuated as shown by the arrow 7, the valve 4 is opened 2, and the wafer is transported. When the wafer returns to the pre-evacuation chamber and the interior of the pre-evacuation chamber 1 becomes atmospheric, the door 3 of the wafer loading/unloading port is opened and the wafer is loaded/unloaded.
ウェーハ出し入れの際、予備排気室１内に設置したガス
管２より外に向けてガスが矢印６で示すように吹き出し
、ウェーハ出し入れ口にガスのカーテンを作る。When loading and unloading wafers, gas is blown outward from a gas pipe 2 installed in a preliminary exhaust chamber 1 as shown by an arrow 6, creating a gas curtain at the wafer loading and unloading port.
第２図は本発明の第２の実施例の断面図及び正面図であ
る。FIG. 2 is a sectional view and a front view of a second embodiment of the present invention.
ウェーハの出し入れを行う際、予備排気室１の扉３を開
けている間、ウェーハ出し入れ口の上・下に設けたガス
管２より外に向けて矢印６で示すようにガスが吹き出し
ウェーハ出し入れ口にガスのカーテンを作る。When loading and unloading wafers, while the door 3 of the pre-exhaust chamber 1 is open, gas is blown outward from the gas pipes 2 provided above and below the wafer loading/unloading port as shown by arrows 6. Create a gas curtain.
この実施例ではガス管２が上・下に設置されているので
外からのごみの侵入を遮断する効果が大きいという利点
がある。In this embodiment, since the gas pipes 2 are installed at the top and bottom, there is an advantage that the effect of blocking the intrusion of dust from the outside is great.
以上説明したように、本発明は、予備排気室のウェーハ
出し入れ口にガスのカーテンを作るようにしたので、予
備排気室内に入り込むごみを遮断できる効果がある。As described above, in the present invention, a gas curtain is formed at the wafer inlet/outlet of the pre-evacuation chamber, so that there is an effect of blocking dust from entering the pre-evacuation chamber.
第１図（ａ）、（ｂ）及び第２図（ａ）、（ｂ）はそれ
ぞれ本発明の第１及び第２の実施例の断面図及び正面図
である。
１・・・予備排気室、２・・・ガス管、３・・・扉、４
・・・バルブ、５・・・搬送室。1(a), (b) and FIG. 2(a), (b) are a sectional view and a front view of the first and second embodiments of the present invention, respectively. 1...Preliminary exhaust chamber, 2...Gas pipe, 3...Door, 4
... Valve, 5... Transfer chamber.
Claims (1)
製造装置において、前記ウェーハを収納する予備排気室
のウェーハ出し入れ口にガスのカーテンを設けたことを
特徴とする半導体製造装置。1. A semiconductor manufacturing apparatus having a mechanism for transporting semiconductor wafers in a vacuum, characterized in that a gas curtain is provided at a wafer inlet/outlet of a preliminary evacuation chamber in which the wafers are stored.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19696788A JPH0245920A (en) | 1988-08-05 | 1988-08-05 | Semiconductor manufacturing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19696788A JPH0245920A (en) | 1988-08-05 | 1988-08-05 | Semiconductor manufacturing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0245920A true JPH0245920A (en) | 1990-02-15 |
Family
ID=16366628
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19696788A Pending JPH0245920A (en) | 1988-08-05 | 1988-08-05 | Semiconductor manufacturing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0245920A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997014179A1 (en) * | 1995-10-13 | 1997-04-17 | Advanced Semiconductor Materials America, Inc. | Semiconductor processing system with gas curtain |
| US6672864B2 (en) | 2001-08-31 | 2004-01-06 | Applied Materials, Inc. | Method and apparatus for processing substrates in a system having high and low pressure areas |
| US8794896B2 (en) | 2005-12-14 | 2014-08-05 | Tokyo Electron Limited | Vacuum processing apparatus and zonal airflow generating unit |
-
1988
- 1988-08-05 JP JP19696788A patent/JPH0245920A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997014179A1 (en) * | 1995-10-13 | 1997-04-17 | Advanced Semiconductor Materials America, Inc. | Semiconductor processing system with gas curtain |
| US5997588A (en) * | 1995-10-13 | 1999-12-07 | Advanced Semiconductor Materials America, Inc. | Semiconductor processing system with gas curtain |
| US6672864B2 (en) | 2001-08-31 | 2004-01-06 | Applied Materials, Inc. | Method and apparatus for processing substrates in a system having high and low pressure areas |
| US8794896B2 (en) | 2005-12-14 | 2014-08-05 | Tokyo Electron Limited | Vacuum processing apparatus and zonal airflow generating unit |
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