JPH0238416A - Epoxy resin composition and epoxy resin laminate - Google Patents
Epoxy resin composition and epoxy resin laminateInfo
- Publication number
- JPH0238416A JPH0238416A JP19004088A JP19004088A JPH0238416A JP H0238416 A JPH0238416 A JP H0238416A JP 19004088 A JP19004088 A JP 19004088A JP 19004088 A JP19004088 A JP 19004088A JP H0238416 A JPH0238416 A JP H0238416A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- tung oil
- phenol
- acid
- laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 35
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 35
- 239000000203 mixture Substances 0.000 title claims abstract description 12
- 239000002383 tung oil Substances 0.000 claims abstract description 23
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 12
- 150000002989 phenols Chemical class 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract description 9
- 230000035939 shock Effects 0.000 abstract description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 abstract description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 abstract description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 abstract description 4
- LBLYYCQCTBFVLH-UHFFFAOYSA-N 2-Methylbenzenesulfonic acid Chemical compound CC1=CC=CC=C1S(O)(=O)=O LBLYYCQCTBFVLH-UHFFFAOYSA-N 0.000 abstract description 3
- 239000003054 catalyst Substances 0.000 abstract description 3
- JIRHAGAOHOYLNO-UHFFFAOYSA-N (3-cyclopentyloxy-4-methoxyphenyl)methanol Chemical compound COC1=CC=C(CO)C=C1OC1CCCC1 JIRHAGAOHOYLNO-UHFFFAOYSA-N 0.000 abstract description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 abstract description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 abstract description 2
- 229930003836 cresol Natural products 0.000 abstract description 2
- 150000007524 organic acids Chemical class 0.000 abstract description 2
- 235000005985 organic acids Nutrition 0.000 abstract description 2
- 239000004841 bisphenol A epoxy resin Substances 0.000 abstract 1
- 239000004842 bisphenol F epoxy resin Substances 0.000 abstract 1
- 238000005336 cracking Methods 0.000 abstract 1
- 150000007522 mineralic acids Chemical class 0.000 abstract 1
- 239000004843 novolac epoxy resin Substances 0.000 abstract 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 10
- 239000004593 Epoxy Substances 0.000 description 9
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- 238000004132 cross linking Methods 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- GJYCVCVHRSWLNY-UHFFFAOYSA-N 2-butylphenol Chemical compound CCCCC1=CC=CC=C1O GJYCVCVHRSWLNY-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- -1 octylphenol Chemical compound 0.000 description 2
- 239000004848 polyfunctional curative Substances 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- RMTXUPIIESNLPW-UHFFFAOYSA-N 1,2-dihydroxy-3-(pentadeca-8,11-dienyl)benzene Natural products CCCC=CCC=CCCCCCCCC1=CC=CC(O)=C1O RMTXUPIIESNLPW-UHFFFAOYSA-N 0.000 description 1
- QARRXYBJLBIVAK-UEMSJJPVSA-N 3-[(8e,11e)-pentadeca-8,11-dienyl]benzene-1,2-diol;3-[(8e,11e)-pentadeca-8,11,14-trienyl]benzene-1,2-diol;3-[(8e,11e,13e)-pentadeca-8,11,13-trienyl]benzene-1,2-diol;3-[(e)-pentadec-8-enyl]benzene-1,2-diol;3-pentadecylbenzene-1,2-diol Chemical compound CCCCCCCCCCCCCCCC1=CC=CC(O)=C1O.CCCCCC\C=C\CCCCCCCC1=CC=CC(O)=C1O.CCC\C=C\C\C=C\CCCCCCCC1=CC=CC(O)=C1O.C\C=C\C=C\C\C=C\CCCCCCCC1=CC=CC(O)=C1O.OC1=CC=CC(CCCCCCC\C=C\C\C=C\CC=C)=C1O QARRXYBJLBIVAK-UEMSJJPVSA-N 0.000 description 1
- IYROWZYPEIMDDN-UHFFFAOYSA-N 3-n-pentadec-8,11,13-trienyl catechol Natural products CC=CC=CCC=CCCCCCCCC1=CC=CC(O)=C1O IYROWZYPEIMDDN-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- DQTMTQZSOJMZSF-UHFFFAOYSA-N urushiol Natural products CCCCCCCCCCCCCCCC1=CC=CC(O)=C1O DQTMTQZSOJMZSF-UHFFFAOYSA-N 0.000 description 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Epoxy Resins (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、産業用、民生用等のあらゆる電子機器に使用
されるエポキシ樹脂組成物およびこの組成物を用いたエ
ポキシ樹脂積層板に関する。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an epoxy resin composition used in all types of electronic equipment, such as industrial and consumer electronic devices, and an epoxy resin laminate using this composition.
従来の技術
従来、エポキシ樹脂積層板、或は、銅張ジェポキシ樹脂
積層板は、マトリックス樹脂の硬化剤として、アミン類
、酸無水物類、イミダゾール類及びジシアンジアミド（
ＤＬＣＹ）フェノールノボランク樹脂等を広く用いてい
る。しかし、積層板の柔軟性、強靭性、さらには眉間密
着性などの面で、汎用のビスフェノールＡ系エポキシ樹
脂と上記硬化剤の組み合わせのみでは、顧客の多様な要
求特性に対応できないことが多い。Prior Art Conventionally, epoxy resin laminates or copper-clad epoxy resin laminates have been manufactured using amines, acid anhydrides, imidazoles, and dicyandiamide (
DLCY) Phenol novolank resin etc. are widely used. However, in terms of the flexibility, toughness, and glabella adhesion of the laminate, the combination of a general-purpose bisphenol A-based epoxy resin and the above-mentioned curing agent alone is often unable to meet the diverse characteristics required by customers.
このため、よシ高度な機械的特性を得るために併用され
るのが可撓性付与剤である０
しかし、可撓性付与剤は、樹脂の分子中に鎖状構造を導
入し、樹脂の架橋密度を下げるため、積層板のガラス転
移温度、引つ張シ強さ、弾性率、及び耐薬品性などを低
下させるという問題がある。For this reason, flexibility-imparting agents are used in combination to obtain highly advanced mechanical properties. However, flexibility-imparting agents introduce a chain structure into the resin molecules, making the resin more flexible. Since the crosslinking density is lowered, there is a problem in that the glass transition temperature, tensile strength, elastic modulus, chemical resistance, etc. of the laminate are lowered.
発明が解決しようとする課題
本発明は上記の欠点を除去するもので、機械的強度、熱
衝撃に対する耐クラツク性、眉間密着性及び接着性の改
良されたエポキシ樹脂積層板およびこれに使用するエポ
キシ樹脂組成物を提供することを目的とする。Problems to be Solved by the Invention The present invention aims to eliminate the above-mentioned drawbacks, and provides an epoxy resin laminate with improved mechanical strength, crack resistance against thermal shock, glabella adhesion and adhesion, and an epoxy resin used therein. The purpose is to provide a resin composition.
課題を解決するための手段
上記の目的を達成する本発明のエポキシ樹脂組成物は、
フェノール類と桐油を反ろさせたフェノール類の桐油付
加物を硬化剤として配合した点に特徴を有する。Means for Solving the Problems The epoxy resin composition of the present invention that achieves the above objects is
It is characterized in that it contains a tung oil adduct of phenols and tung oil as a hardening agent.
また、本発明のエポキシ樹脂積層板は、シト状基材にエ
ポキシ樹脂を含浸して積層成形したものにおいて、上記
エポキシ樹脂組成物を用いたものである。Furthermore, the epoxy resin laminate of the present invention is obtained by impregnating a sheet-like base material with an epoxy resin and laminating and molding the same, using the above-mentioned epoxy resin composition.
作用
本発明に係るエポキシ樹脂組成物は、前記の如く、フェ
ノール類と桐油を反応させたフェノール類の桐油付加物
を、硬化剤として使用するが、式（１）で示した該桐油
付加物の構造式からもわかるように、桐油骨格が導入さ
れているために、適度な架橋密度（架橋点分子量）を与
えることができる。架橋密度は、反応させる桐油とフェ
ノール類の配合割合、触媒の種類及び量、フェノール類
の種類により適当Ｖｃｖ４整すればよい。フェノール類
の桐油付加物は、エポキシ樹脂に対して硬化剤及び可撓
性付与剤としての２つの役割シを有しており、この配合
によって、従来の硬化剤、可撓性付与剤、さらには可盟
剤では充分に得られなかった機械的特性、耐熱衝撃性、
及び接着性等の優れた可撓性を所望のレベルで得ること
ができる。Function The epoxy resin composition according to the present invention uses, as a curing agent, a tung oil adduct of phenols obtained by reacting phenols with tung oil. As can be seen from the structural formula, since a tung oil skeleton is introduced, an appropriate crosslinking density (crosslinking point molecular weight) can be provided. The crosslinking density may be appropriately adjusted to Vcv4 depending on the mixing ratio of tung oil and phenols to be reacted, the type and amount of catalyst, and the type of phenol. Tung oil adducts of phenols have dual roles as hardeners and flexibilizers for epoxy resins, and this formulation allows them to be used as hardeners, flexibilizers, and even Mechanical properties, thermal shock resistance, and
It is possible to obtain a desired level of excellent flexibility such as adhesiveness and adhesion.
実施例
本発明に用いるフェノール類には、フェノール、クレゾ
ール、キシレノール、ブチルフェノール、オクチルフェ
ノール、ノニルフェノール、カシュナットオイル、ウル
シオール、或は前記フェノール類のノボラック、ビスフ
ェノールＡなどがある。フェノール類と桐油の反応触媒
には、塩酸、硫酸、燐酸などの無機酸、トルエンスルホ
ン酸、キシレンスルホン酸などの有機酸などを用いる。Examples Examples of phenols used in the present invention include phenol, cresol, xylenol, butylphenol, octylphenol, nonylphenol, cashnut oil, urushiol, and the above-mentioned phenols such as novolak and bisphenol A. Inorganic acids such as hydrochloric acid, sulfuric acid, and phosphoric acid, and organic acids such as toluenesulfonic acid and xylenesulfonic acid are used as catalysts for the reaction between phenols and tung oil.
また、フェノール類の桐油付加物を配合するエポキシ樹
脂は、ビスフェノールＡ型エポキシ、臭素化エポキシ、
ノボラック型エポキシ、ビスフェノールＦ系エポキシな
どである。In addition, epoxy resins containing tung oil adducts of phenols include bisphenol A epoxy, brominated epoxy,
These include novolac type epoxy, bisphenol F type epoxy, etc.
本発明のエポキシ樹脂組成物は、フェノール類の桐油付
加物を、主剤であるエポキシ樹脂と混合し、次いで硬化
促進剤として２−エチル−４−メチルイミダゾール等の
イミダゾール類、或はベンジルジメチルアミン（ＢＤＭ
Ａ ）等の第三級アミン類を配合する。配合比は、得ら
れる積層板の性能、生産性などにより、適宜変えればよ
いが、本発明者らが、検討した結果、エポキシ（ビスフ
ェノールＡ型エポキシ）／硬化剤（フェノール類桐油付
加物）／促進剤（２−エチル−４−メチルイミダゾール
） ＝１００／１５〜２５１０．０５〜０．１０（重量
部）が適当であった。希釈溶剤としては、アセトン、Ｍ
ＥＫなどがあげられるが、シート状基材に対する塗工々
程での含浸性、作業性などを考慮して、上記の系に対し
て、２０〜３０重量部配合するのが適当である。The epoxy resin composition of the present invention is prepared by mixing a tung oil adduct of phenols with an epoxy resin as a main ingredient, and then using imidazoles such as 2-ethyl-4-methylimidazole or benzyldimethylamine ( BDM
Add tertiary amines such as A). The blending ratio may be changed as appropriate depending on the performance, productivity, etc. of the laminate to be obtained, but as a result of study by the present inventors, epoxy (bisphenol A type epoxy)/curing agent (phenolic tung oil adduct)/ Accelerator (2-ethyl-4-methylimidazole) = 100/15 to 2510.05 to 0.10 (parts by weight) was suitable. As a diluting solvent, acetone, M
Examples include EK, but it is appropriate to add 20 to 30 parts by weight to the above-mentioned system, taking into account impregnating properties and workability during the coating process on sheet-like substrates.
スルホン酸２ｇを配合して、７０〜８０℃にて１００分
間反応させ、クレゾール−桐油付加物を得、これを硬化
剤として用いる０
エポキシ当量１９０のビスフェノールＡ型エポキシ樹脂
（■油化シェルエポキシ製、８２８）１０）ｃｐに、前
記クレゾール−桐油付加物２に９．２−エチル−４−メ
チル−イミダゾール１０９、メチルエチルケトン２．５
ユを配合し、エポキシ樹脂フェスを得た。ガラスクロス
に、このエポキシ樹脂フエスを含浸乾燥して、樹脂付着
量４０重量％のエポキシ−ガラス布プリプレグを得た。Blend 2 g of sulfonic acid and react at 70 to 80°C for 100 minutes to obtain a cresol-tung oil adduct, which is used as a curing agent. Bisphenol A type epoxy resin with an epoxy equivalent of 190 (■ Manufactured by Yuka Shell Epoxy) , 828) 10) 9.2-ethyl-4-methyl-imidazole 109, methyl ethyl ketone 2.5 to the cresol-tung oil adduct 2 to cp
An epoxy resin face was obtained. A glass cloth was impregnated with this epoxy resin cloth and dried to obtain an epoxy-glass cloth prepreg with a resin coating amount of 40% by weight.
前記プリプレグ８枚を重ね、その両側に厚み１８μｍ銅
箔を重ね、プレス熱盤温度１７０℃、成形圧力６０ν薗
にて１００分間加熱、加圧して、厚さ１．６ ｍｆｌｌ
の銅張積層板を得た。8 sheets of the prepreg were stacked, 18 μm thick copper foil was stacked on both sides, and heated and pressed for 100 minutes at a press hot plate temperature of 170° C. and a molding pressure of 60 ν to give a thickness of 1.6 mfl.
A copper-clad laminate was obtained.
実施例−２
ノニルフェノール１．３に９、桐油１．１ ｋｇ 、ノ
くラートルエンースルホン酸２ｇを配合して、実施例−
１と同様に反応させてノニルフェノール−桐油付加物を
得た。以下、実施例−１と同様な方法で、厚さ１．６
ｍｍの銅張積層板を得た。Example-2 1.3 of nonylphenol, 1.1 kg of tung oil, and 2 g of nocilla toluene-sulfonic acid were blended to produce Example-2.
The reaction was carried out in the same manner as in 1 to obtain a nonylphenol-tung oil adduct. Hereinafter, in the same manner as in Example-1, a thickness of 1.6
A copper-clad laminate with a thickness of 1.5 mm was obtained.
実施例−１及び２の積層板性能を第１表に示す０
比較例
実施例と同様のビスフェノールＡ型エポキシ樹Ｕ１１０
に！９にジシアンジアミド（Ｄ Ｉ ＣＹ ） ０．４
ｋ１７ 、メチルセロツル７”３）Ｃｐ、２−エチル−
４−ノー１１−ルイミダゾール１０ｇ、メチルエチルケ
トン１ゆを配合し、エポキシ樹脂ワニスを得た。該ワニ
スを使用して、実施例と同様にして、厚さ１．６順の鋼
張積層板を得た。その性能を第１表に示す。The laminate performance of Examples 1 and 2 is shown in Table 1.0 Comparative Example Bisphenol A type epoxy tree U110 similar to Example
To! 9 and dicyandiamide (D I CY ) 0.4
k17, methylserotulu7”3)Cp, 2-ethyl-
10 g of 4-no-11-limidazole and 1 g of methyl ethyl ketone were blended to obtain an epoxy resin varnish. Using this varnish, steel clad laminates having a thickness of 1.6 mm were obtained in the same manner as in the examples. Its performance is shown in Table 1.
、犀、′Ｆ＃？ム
注）熱衝撃サイクル寿命：■テスト条件２６０°ＣＩＯ
秒−２０６Ｃ２０秒
を１サイクルとして繰り
返す（シリコン油中）。, Sai, 'F#? Note) Thermal shock cycle life: ■Test conditions 260°CIO
Sec-206C 20 seconds is repeated as one cycle (in silicone oil).
■寿命 導通抵抗値の平均値が１０チ アップしたサイクル数。■Lifespan The average value of continuity resistance is 10 Number of cycles up.
クラック発生率： ＤＩＮ金型（打抜き加工性評価用）
による２ｎｕｎピッチ以上のクラック発生率（試料数ｎ
＝１００）。Crack occurrence rate: DIN mold (for punching workability evaluation)
crack occurrence rate with a pitch of 2nun or more (number of samples n
=100).
発明の効果
上述したように、本発明は、フェノール類と桐油を反応
させたフェノール類の桐油付加物をエポキシ樹脂の硬化
剤として使用するものである。これによって、従来の硬
化剤では得られなかった優れた可撓性、すなわち機械的
特性、耐熱衝撃性、密着性及び接着性を得ることが可能
となるという効果がある。Effects of the Invention As described above, the present invention uses a tung oil adduct of phenols obtained by reacting phenols with tung oil as a curing agent for epoxy resins. This has the effect of making it possible to obtain excellent flexibility, that is, mechanical properties, thermal shock resistance, adhesion, and adhesion that could not be obtained with conventional curing agents.
Claims (1)
油付加物を硬化剤として、これをエポキシ樹脂に配合し
たエポキシ樹脂組成物。 ２、シート状基材にエポキシ樹脂を含浸して積層成形し
た積層板において、エポキシ樹脂が請求項１記載のエポ
キシ樹脂組成物であるエポキシ樹脂積層板。[Scope of Claims] 1. An epoxy resin composition in which a curing agent is a tung oil adduct of phenols obtained by reacting phenols with tung oil, and this is blended into an epoxy resin. 2. An epoxy resin laminate in which a sheet-like base material is impregnated with an epoxy resin and laminated and molded, the epoxy resin being the epoxy resin composition according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19004088A JPH0238416A (en) | 1988-07-29 | 1988-07-29 | Epoxy resin composition and epoxy resin laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19004088A JPH0238416A (en) | 1988-07-29 | 1988-07-29 | Epoxy resin composition and epoxy resin laminate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0238416A true JPH0238416A (en) | 1990-02-07 |
Family
ID=16251360
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19004088A Pending JPH0238416A (en) | 1988-07-29 | 1988-07-29 | Epoxy resin composition and epoxy resin laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0238416A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02225162A (en) * | 1990-01-29 | 1990-09-07 | Takeuchi Tekko Kk | Car washing machine |
-
1988
- 1988-07-29 JP JP19004088A patent/JPH0238416A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02225162A (en) * | 1990-01-29 | 1990-09-07 | Takeuchi Tekko Kk | Car washing machine |
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