JPH07252373A - Cloth or mat base impregnated with erpoxy resin composition and used as electric insulating material - Google Patents
Cloth or mat base impregnated with erpoxy resin composition and used as electric insulating materialInfo
- Publication number
- JPH07252373A JPH07252373A JP21948894A JP21948894A JPH07252373A JP H07252373 A JPH07252373 A JP H07252373A JP 21948894 A JP21948894 A JP 21948894A JP 21948894 A JP21948894 A JP 21948894A JP H07252373 A JPH07252373 A JP H07252373A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- cloth
- resin composition
- insulating material
- dicyclopentadiene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Reinforced Plastic Materials (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電気電子部品用の絶縁
材料に適したエポキシ樹脂組成物を含浸させたクロス状
またはマット状基材に係るものである。特に耐熱性、耐
湿性、内部可塑性などに優れた、ジシクロペンタジエン
・レゾルシノール類変性エポキシ樹脂を必須成分とする
エポキシ樹脂組成物を含浸させた電気絶縁材料を製造す
るためのクロス状またはマット状基材に関するものであ
る。米国特許第４,３９０,６８０号には、レゾルシノー
ルとジシクロペンタジエン濃縮物とから得たフェノール
樹脂をエポキシ樹脂に変性する例が記載されている。し
かしながら、エポキシ樹脂を基材に含浸させる例はな
く、また示唆もされていない。なお、上記特許に記載さ
れている樹脂は、原料のジシクロペンタジエン濃縮物が
ジシクロペンタジエン以外の鎖状化合物を多く含んでい
るため、クロス状またはマット状基材に含浸させて電気
絶縁材料として使用するには適さないものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cloth-like or mat-like base material impregnated with an epoxy resin composition suitable for an insulating material for electric and electronic parts. A cloth-like or mat-like group for producing an electrically insulating material impregnated with an epoxy resin composition containing a dicyclopentadiene / resorcinol-modified epoxy resin as an essential component, which is particularly excellent in heat resistance, moisture resistance, and internal plasticity. It concerns materials. U.S. Pat. No. 4,390,680 describes an example of modifying a phenolic resin obtained from resorcinol and dicyclopentadiene concentrate to an epoxy resin. However, there is no example of impregnating a base material with an epoxy resin, and no suggestion is made. Incidentally, the resin described in the above patent, since the dicyclopentadiene concentrate of the raw material contains a large amount of chain compounds other than dicyclopentadiene, it is impregnated into a cloth-shaped or mat-shaped base material to obtain an electrical insulating material. It is not suitable for use.
【０００２】[0002]
【発明が解決しようとする課題】最近の電気電子機器に
おいては、コンピューターの普及、ＶＴＲの小型化や軽
量化などに伴い、信頼性が高くコストの低い樹脂が要求
されている。通常のエポキシ樹脂であるビスフェノール
Ａ型エポキシ樹脂、フェノールノボラック型エポキシ樹
脂などは、耐熱性、耐湿性、耐薬品性、内部可塑性など
の性能が十分でなく、バランスの取れたエポキシ樹脂の
開発が望まれていた。本発明は前記の欠点に鑑みてなさ
れたもので、その目的は、耐熱性、耐湿性、内部可塑性
および耐薬品性に優れ、電気電子部品用の絶縁材料用と
して適した新規なエポキシ樹脂組成物を含浸させたクロ
ス状またはマット状基材を提供しようとするものであ
る。In recent electric and electronic equipment, a resin having high reliability and low cost is required due to the spread of computers and the downsizing and weight reduction of VTRs. Ordinary epoxy resins such as bisphenol A type epoxy resin and phenol novolac type epoxy resin do not have sufficient heat resistance, moisture resistance, chemical resistance, internal plasticity, etc., and it is desired to develop a balanced epoxy resin. It was rare. The present invention has been made in view of the above-mentioned drawbacks, and an object thereof is a novel epoxy resin composition which is excellent in heat resistance, moisture resistance, internal plasticity and chemical resistance and is suitable as an insulating material for electric and electronic parts. It is intended to provide a cloth-shaped or mat-shaped base material impregnated with.
【０００３】[0003]
【課題を解決するための手段】本発明者らは、上記の目
的を達成すべく、鋭意研究を重ねた結果、後述するエポ
キシ樹脂組成物が従来のものに比べて耐熱性、耐湿性、
耐薬品性および内部可塑性に優れており、バランスの取
れたエポキシ樹脂組成物であることを見出して本発明を
完成した。すなわち本発明は、一般式化２で示されるジ
シクロペンタジエン・レゾルシノール類変性エポキシ樹
脂Means for Solving the Problems As a result of intensive studies to achieve the above object, the present inventors have found that the epoxy resin composition described below has heat resistance, moisture resistance, and
The present invention has been completed by finding that the epoxy resin composition has excellent chemical resistance and internal plasticity and is well balanced. That is, the present invention provides a dicyclopentadiene / resorcinol-modified epoxy resin represented by the general formula 2.
【化２】 〔式中Ｒは水素原子または炭素数１〜９のアルキル基、
ｎは０〜１５の整数を示す。〕を必須成分とするエポキ
シ樹脂組成物を含浸させた電気絶縁材料用のクロス状ま
たはマット状基材である。[Chemical 2] [Wherein R is a hydrogen atom or an alkyl group having 1 to 9 carbon atoms,
n shows the integer of 0-15. ] A cloth-shaped or mat-shaped base material for an electric insulating material, which is impregnated with an epoxy resin composition containing as an essential component.
【０００４】本発明の必須成分であるジシクロペンタジ
エン・レゾルシノール類変性エポキシ樹脂は、ジシクロ
ペンタジエンとレゾルシノール類を重合し、更にこれに
グリシジル化反応を行って製造する。樹脂の重合度は０
〜１５であり、エポキシ樹脂組成物によって重合度を調
整することができる。ジシクロペンタジエン誘導体を含
有させることにより、エポキシ樹脂組成物の耐湿性を向
上させ、更に内部可塑性を付与することができる。ま
た、レゾルシノール類を含むことにより、架橋密度が高
くなるため、耐熱性および耐湿性を向上させることがで
きる。The dicyclopentadiene / resorcinol-modified epoxy resin, which is an essential component of the present invention, is produced by polymerizing dicyclopentadiene and resorcinols and then subjecting this to a glycidylation reaction. The degree of polymerization of resin is 0
And the degree of polymerization can be adjusted by the epoxy resin composition. By containing the dicyclopentadiene derivative, the moisture resistance of the epoxy resin composition can be improved and further internal plasticity can be imparted. In addition, since the crosslink density is increased by including the resorcinols, heat resistance and moisture resistance can be improved.
【０００５】また、従来公知のエポキシ樹脂、例えばフ
ェノールノボラック型エポキシ樹脂、クレゾールノボラ
ック型エポキシ樹脂、ビスフェノール型エポキシ樹脂、
脂環式エポキシ樹脂等も必要に応じて併用することがで
きる。このエポキシ樹脂組成物には、上述の必須成分の
ほか任意成分としてフェノールノボラック型樹脂やその
他有機酸無水物、アミン化合物などの公知の硬化剤が使
用される。また、エポキシ樹脂の硬化反応を促進する効
果があるイミダゾール化合物や第三級アミン化合物、第
四級アンモニウム塩などの公知の硬化促進剤を用いるこ
とができる。更に本発明で用いる樹脂組成物には、注型
などの目的のために公知の希釈剤を添加することもでき
る。例えば、フタル酸エステル、ブチルグリシジルエー
テル、クレジルグリシジルエーテルなどが挙げられる。
その他、三酸化アンチモン、臭素化エポキシ樹脂などの
難燃化剤；カーボンブラックなどの着色剤；アルコキシ
チタネート系化合物、エポキシシラン、ボラン系化合
物、シラン系カップリング剤などの表面処理剤；天然ゴ
ム、ポリブタジエン−スチレン、ポリイミド、フェノキ
シ樹脂、シリカ粉末、タルク、炭酸カルシウム、無機繊
維などの充填剤などを必要に応じて添加配合することが
できる。Further, conventionally known epoxy resins such as phenol novolac type epoxy resin, cresol novolac type epoxy resin, bisphenol type epoxy resin,
An alicyclic epoxy resin or the like can be used in combination if necessary. In addition to the above-mentioned essential components, a known curing agent such as a phenol novolac type resin, other organic acid anhydride, or an amine compound is used in this epoxy resin composition. Further, a known curing accelerator such as an imidazole compound, a tertiary amine compound, or a quaternary ammonium salt, which has an effect of promoting the curing reaction of the epoxy resin, can be used. Further, a known diluent may be added to the resin composition used in the present invention for the purpose of casting or the like. Examples thereof include phthalic acid ester, butyl glycidyl ether and cresyl glycidyl ether.
Other flame retardants such as antimony trioxide and brominated epoxy resins; coloring agents such as carbon black; surface treatment agents such as alkoxy titanate compounds, epoxysilanes, borane compounds, silane coupling agents; natural rubber, Fillers such as polybutadiene-styrene, polyimide, phenoxy resin, silica powder, talc, calcium carbonate, and inorganic fibers can be added and blended as necessary.
【０００６】上記の必須成分および任意成分の配合割合
としては、必須成分であるジシクロペンタジエン・レゾ
ルシノール類変性エポキシ樹脂１００重量部に対して硬
化剤は樹脂が硬化し得るに十分な量、通常１０〜９０重
量部の範囲である。また、特に電気絶縁材料としては、
難燃化剤を添加配合することが好ましい。その配合量
は、上記エポキシ樹脂１００重量部に対して難燃化剤１
〜２００重量部の範囲である。As for the mixing ratio of the above-mentioned essential components and optional components, the curing agent is used in an amount sufficient to cure the resin, usually 10 per 100 parts by weight of the dicyclopentadiene resorcinol modified epoxy resin which is the essential component. To 90 parts by weight. Also, especially as an electrically insulating material,
It is preferable to add a flame retardant. The blending amount is 1 flame retardant with respect to 100 parts by weight of the epoxy resin.
To 200 parts by weight.
【０００７】本発明においては、上記の樹脂組成物を、
ガラス繊維、アスベスト繊維、炭素繊維、合成繊維など
のクロス状またはマット状の基材に含浸させ、必要に応
じて乾燥させた後、部分加熱処理を行ってプリプレグと
する。In the present invention, the above resin composition is
A cloth-shaped or mat-shaped base material such as glass fiber, asbestos fiber, carbon fiber, or synthetic fiber is impregnated, dried as necessary, and then partially heat-treated to obtain a prepreg.
【０００８】[0008]
【実施例】以下、実施例および比較例により本発明を具
体的に説明する。 ＜ジシクロペンタジエン・レゾルシノール変性エポキシ
樹脂の製造例＞レゾルシノール１,０００部（以下部は
いずれも重量部）を温度計、冷却器、撹拌装置、滴下管
を付した反応器内に仕込み、１００±５℃に保ちなが
ら、４７％ＢＦ3エーテルコンプレックス１５部を加
え、完全に混合するまで撹拌した後、ジシクロペンタジ
エン４１５部を４時間かけて滴下した。滴下後、１００
±５℃で１時間保持した後、１８０℃、４mmＨg で未反
応モノマーを留去し、更にメタノール５００部に溶解し
た。このメタノール溶液に水２５０部を加え、分別沈澱
により樹脂を分取し、残存モノマー１％以下の目的とす
る重合物９２５部を得た。重合物２００部をエピクロル
ヒドリン５００部に溶解し、触媒としてベンジルトリエ
チルアンモニウムブロマイド１.０ｇを加え、８０℃で
６時間反応させた後、これに４９％ＮaＯＨ１２８部を
滴下した。このとき、１５０±５０mmＨgの減圧下でエ
ピクロルヒドリンと水を共沸させ、水を系外に出しなが
ら６.０時間かけて滴下を行った。反応系を８０℃に保
ちながら更に６時間撹拌を続けた後、エピクロルヒドリ
ンを減圧留去し、メチルイソブチルケトン５００部に溶
解した。次に反応によって生じたＮaＣl を濾過し、濾
液の有機層を水洗した後、減圧濃縮してジシクロペンタ
ジエン・レゾルシノール変性エポキシ樹脂２２４部を得
た。このエポキシ樹脂の分析結果を表１に示す。EXAMPLES The present invention will be specifically described below with reference to Examples and Comparative Examples. <Production Example of Dicyclopentadiene / Resorcinol-Modified Epoxy Resin> Resorcinol (1,000 parts (all parts below are parts by weight)) was charged into a reactor equipped with a thermometer, a cooler, a stirrer, and a dropping pipe, and 100 ± While maintaining the temperature at 5 ° C, 15 parts of 47% BF 3 ether complex was added, and the mixture was stirred until completely mixed, and then 415 parts of dicyclopentadiene was added dropwise over 4 hours. 100 after dropping
After holding at ± 5 ° C for 1 hour, the unreacted monomer was distilled off at 180 ° C and 4 mmHg, and the residue was dissolved in 500 parts of methanol. 250 parts of water was added to this methanol solution, and the resin was separated by fractional precipitation to obtain 925 parts of the intended polymer having a residual monomer content of 1% or less. 200 parts of the polymer was dissolved in 500 parts of epichlorohydrin, 1.0 g of benzyltriethylammonium bromide was added as a catalyst, the mixture was reacted at 80 ° C. for 6 hours, and 128 parts of 49% NaOH was added dropwise thereto. At this time, epichlorohydrin and water were azeotropically distilled under a reduced pressure of 150 ± 50 mmHg, and the solution was added dropwise over 6.0 hours while the water was taken out of the system. After stirring for 6 hours while maintaining the reaction system at 80 ° C., epichlorohydrin was distilled off under reduced pressure and dissolved in 500 parts of methyl isobutyl ketone. Then, NaCl generated by the reaction was filtered, the organic layer of the filtrate was washed with water, and then concentrated under reduced pressure to obtain 224 parts of dicyclopentadiene / resorcinol-modified epoxy resin. Table 1 shows the analysis results of this epoxy resin.
【０００９】[0009]
【表１】 [Table 1]
【００１０】＜実施例１〜４、比較例１＞使用した基本
樹脂および硬化剤の種類は以下の通りである。 基本樹脂 (１)ジシクロペンタジエン・レゾルシノール変性エポキ
シ樹脂（エポキシ当量３０５ｇ）：Ａ (２)オルトクレゾールノボラック型エポキシ樹脂（エポ
キシ当量２１８ｇ、日本化薬(株)製）：ＥＯＣＮ (３)ビスフェノールＡ型エポキシ樹脂（エポキシ当量４
７０ｇ；商品名：ＤＹ−０１１、東都化成(株)製）：Ｂ
ＡＥ 硬化剤 (１)ジアミノジフェニルメタン：ＤＤＭ (２)フェノール・ノボラック樹脂（商品名：ＢＧＲ−５
５７、昭和合成化学製）：ＰＮ 上記の基本樹脂および硬化剤を用い、更に硬化促進剤と
して三級アミンを加え、表２の配合に従って当量比１／
１／０.１で微粉砕混合し、示差熱分析による熱分解
開始温度モニターＩＣ上で硬化させ、また１５０℃で
のリーク電流および耐湿性（ＰＣＴ）を測定した。結
果は表２の通りである。<Examples 1 to 4, Comparative Example 1> The types of the basic resin and the curing agent used are as follows. Basic resin (1) Dicyclopentadiene / resorcinol modified epoxy resin (epoxy equivalent 305 g): A (2) Orthocresol novolac type epoxy resin (epoxy equivalent 218 g, manufactured by Nippon Kayaku Co., Ltd.): EOCN (3) Bisphenol A type Epoxy resin (epoxy equivalent 4
70 g; product name: DY-011, manufactured by Tohto Kasei Co., Ltd.): B
AE curing agent (1) Diaminodiphenylmethane: DDM (2) Phenol novolac resin (Brand name: BGR-5
57, manufactured by Showa Gosei Kagaku Co., Ltd .: PN Using the above-mentioned basic resin and curing agent, further adding a tertiary amine as a curing accelerator, and equivalence ratio 1 /
The mixture was finely pulverized and mixed at a ratio of 1 / 0.1, cured on a thermal decomposition initiation temperature monitor IC by differential thermal analysis, and leak current at 150 ° C. and moisture resistance (PCT) were measured. The results are shown in Table 2.
【００１１】[0011]
【表２】 [Table 2]
【００１２】＜実施例５、６、比較例２、３＞（積層板へ
の適用例） エポキシ樹脂としてジシクロペンタジエン・レゾルシノ
ール変性エポキシ樹脂（Ａ）、オルトクレゾールノボラ
ック型エポキシ樹脂（ＥＯＣＮ）およびビスフェノール
Ａ型エポキシ樹脂（ＢＡＥ）を、難燃化剤として臭素化
ビスフェノールＡ型エポキシ樹脂（エポキシ当量４００
ｇ；商品名：ＹＤＢ−４００、東都化成製、以下「ＴＢ
ＢＡＥ」と略す）を、また硬化剤としてジシアンジアミ
ドを用いて表−３に示す配合の樹脂ワニス（樹脂成分が
６０重量％）を調製し、これをガラス布（Ｅ−ガラス）
に含浸させた後、このワニス含浸布を１６０℃の乾燥室
中で４分間乾燥し、Ｂステージ状のプリプレグを得た。
上記のプリプレグを切断して得た８枚のプリプレグを重
ね、更にその両面に厚さ３５μｍの電解銅箔を１枚ずつ
重ねて、圧力４０kg/cm2および温度１７５℃で１２０分
間加圧加熱を行い、積層板を作製した。得られた硬化積
層板の物性を表−３に示す。なお、各物性値の試験方法
は以下の通りである。 （１）ガラス転移温度 ＤＳＣにより測定 （２）吸水率（ＪＩＳ Ｃ６４８１に準拠） １００℃の水中で５０時間煮沸した後の重量増加量を測
定 （３）引剥し強さ（ＪＩＳ Ｃ６４８１に準拠） （４）誘電特性（ＪＩＳ Ｃ６４８１に準拠） 表３からわかるように、ジシクロペンタジエン・レゾル
シノール変性エポキシ樹脂を用いた積層板は、耐熱性、
耐湿性、接着性および電気特性が良好であった。<Examples 5 and 6, Comparative Examples 2 and 3> (Examples of application to laminated board) Dicyclopentadiene / resorcinol modified epoxy resin (A), orthocresol novolac type epoxy resin (EOCN) and bisphenol as epoxy resin. A type epoxy resin (BAE) is used as a flame retardant, brominated bisphenol A type epoxy resin (epoxy equivalent 400
g; Trade name: YDB-400, manufactured by Tohto Kasei, hereafter "TB
BAE ”) and dicyandiamide as a curing agent, to prepare a resin varnish having a composition shown in Table 3 (60% by weight of the resin component), which is used as a glass cloth (E-glass).
After impregnating the varnish, the varnish-impregnated cloth was dried in a drying chamber at 160 ° C. for 4 minutes to obtain a B-stage prepreg.
Eight sheets of prepreg obtained by cutting the above prepreg are stacked, and electrolytic copper foil with a thickness of 35 μm is further stacked on both sides thereof, and pressure heating is performed at a pressure of 40 kg / cm 2 and a temperature of 175 ° C. for 120 minutes. Then, a laminated board was prepared. Table 3 shows the physical properties of the obtained cured laminate. In addition, the test method of each physical property value is as follows. (1) Glass transition temperature Measured by DSC (2) Water absorption rate (according to JIS C6481) The weight increase amount after boiling for 50 hours in water at 100 ° C. was measured (3) Peel strength (according to JIS C6481) ( 4) Dielectric property (according to JIS C6481) As can be seen from Table 3, the laminate using the dicyclopentadiene / resorcinol-modified epoxy resin has a heat resistance,
Moisture resistance, adhesion and electrical properties were good.
【００１３】[0013]
【表３】 [Table 3]
【００１４】[0014]
【発明の効果】上記のように、本発明の、ジシクロペン
タジエン・レゾルシノール変性エポキシ樹脂を含浸させ
た基材を用いて製造した積層板は、耐熱性、耐湿性、接
着性および電気特性が良好であった。Industrial Applicability As described above, the laminate produced by using the base material impregnated with the dicyclopentadiene / resorcinol-modified epoxy resin of the present invention has good heat resistance, moisture resistance, adhesiveness and electrical characteristics. Met.
─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成６年８月３１日[Submission date] August 31, 1994
【手続補正２】[Procedure Amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】特許請求の範囲[Name of item to be amended] Claims
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【特許請求の範囲】（１） 下記一般式化１で示されるジシクロペンタジエン
・レゾルシノール類変性エポキシ樹脂Claims (1) Dicyclopentadiene resorcinol-modified epoxy resin represented by the following general formula 1
【化１】 〔式中Ｒは水素原子または炭素数１〜９のアルキル基、
ｎは０〜１５の整数を示す。〕を必須成分とするエポキ
シ樹脂組成物を含浸させた電気絶縁材料用のクロス状ま
たはマット状基材。（２） 前記エポキシ樹脂組成物が難燃化剤を含むことを
特徴とする特許請求の範囲第１項に記載のエポキシ樹脂
組成物を含浸させた電気絶縁材料用のクロス状またはマ
ット状基材。[Chemical 1] [Wherein R is a hydrogen atom or an alkyl group having 1 to 9 carbon atoms,
n shows the integer of 0-15. ] A cloth-shaped or mat-shaped base material for an electric insulating material, which is impregnated with an epoxy resin composition containing as an essential component. (2) The epoxy resin composition contains a flame retardant, and a cloth-like or mat-like substrate for an electric insulating material impregnated with the epoxy resin composition according to claim 1. .
Claims (2)
タジエン・レゾルシノール類変性エポキシ樹脂 【化１】 〔式中Ｒは水素原子または炭素数１〜９のアルキル基、
ｎは０〜１５の整数を示す。〕を必須成分とするエポキ
シ樹脂組成物を含浸させた電気絶縁材料用のクロス状ま
たはマット状基材。1. A dicyclopentadiene resorcinol-modified epoxy resin represented by the following general formula 1 [Wherein R is a hydrogen atom or an alkyl group having 1 to 9 carbon atoms,
n shows the integer of 0-15. ] A cloth-shaped or mat-shaped base material for an electric insulating material, which is impregnated with an epoxy resin composition containing as an essential component.
むことを特徴とする請求項１に記載のエポキシ樹脂組成
物を含浸させた電気絶縁材料用のクロス状またはマット
状基材。2. A cloth-shaped or mat-shaped substrate for an electrical insulating material, which is impregnated with the epoxy resin composition according to claim 1, wherein the epoxy resin composition contains a flame retardant.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21948894A JPH0830123B2 (en) | 1994-08-22 | 1994-08-22 | A cloth-like or mat-like substrate for an electric insulating material impregnated with an epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21948894A JPH0830123B2 (en) | 1994-08-22 | 1994-08-22 | A cloth-like or mat-like substrate for an electric insulating material impregnated with an epoxy resin composition |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60157500A Division JPH0717731B2 (en) | 1985-07-17 | 1985-07-17 | Encapsulating material for electric and electronic parts manufactured from epoxy resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07252373A true JPH07252373A (en) | 1995-10-03 |
| JPH0830123B2 JPH0830123B2 (en) | 1996-03-27 |
Family
ID=16736236
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21948894A Expired - Lifetime JPH0830123B2 (en) | 1994-08-22 | 1994-08-22 | A cloth-like or mat-like substrate for an electric insulating material impregnated with an epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0830123B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011019061A1 (en) * | 2009-08-13 | 2011-02-17 | 昭和電工株式会社 | Method for producing polyglycidyl ether compound |
| JPWO2021193303A1 (en) * | 2020-03-23 | 2021-09-30 | ||
| CN115335427B (en) * | 2020-03-23 | 2024-09-24 | 日本化药株式会社 | Epoxy resin, epoxy compound, epoxy resin composition, resin sheet, prepreg, carbon fiber reinforced composite material, and phenolic resin |
-
1994
- 1994-08-22 JP JP21948894A patent/JPH0830123B2/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011019061A1 (en) * | 2009-08-13 | 2011-02-17 | 昭和電工株式会社 | Method for producing polyglycidyl ether compound |
| JPWO2011019061A1 (en) * | 2009-08-13 | 2013-01-17 | 昭和電工株式会社 | Method for producing polyglycidyl ether compound |
| JPWO2021193303A1 (en) * | 2020-03-23 | 2021-09-30 | ||
| WO2021193303A1 (en) * | 2020-03-23 | 2021-09-30 | 日本化薬株式会社 | Epoxy resin, epoxy compounds, epoxy resin composition, resin sheet, prepreg, carbon-fiber-reinforced composite material, and phenolic resin |
| CN115335427A (en) * | 2020-03-23 | 2022-11-11 | 日本化药株式会社 | Epoxy resin, epoxy compound, epoxy resin composition, resin sheet, prepreg, carbon fiber-reinforced composite material, and phenol resin |
| CN115335427B (en) * | 2020-03-23 | 2024-09-24 | 日本化药株式会社 | Epoxy resin, epoxy compound, epoxy resin composition, resin sheet, prepreg, carbon fiber reinforced composite material, and phenolic resin |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0830123B2 (en) | 1996-03-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6534179B2 (en) | Halogen free triazines, bismaleimide/epoxy polymers, prepregs made therefrom for circuit boards and resin coated articles, and use | |
| JP3092009B2 (en) | Flame retardant and thermosetting flame-retardant resin composition containing the flame retardant | |
| JP5967558B2 (en) | Resin composition, prepreg and laminate | |
| JP2017179035A (en) | Resin composition, prepreg, metal clad laminate, printed wiring board and metal foil with resin | |
| JP3371916B2 (en) | Epoxy resin composition | |
| US4529790A (en) | Epoxy resin composition | |
| JP3230025B2 (en) | Episulfide compound, thermosetting resin composition containing the same | |
| JP2003231762A (en) | Prepreg and laminated sheet | |
| KR0139001B1 (en) | Epoxy resins and compositions containing aromatic diamine curing agent | |
| JP6977241B2 (en) | Thermosetting resin composition, prepreg, laminated board and printed wiring board | |
| JP2003342350A (en) | High-molecular weight epoxy resin, resin composition for electrical laminate, and electrical laminate | |
| JP2004315705A (en) | Modified polyimide resin composition and prepreg and laminate using the same | |
| JPH07252373A (en) | Cloth or mat base impregnated with erpoxy resin composition and used as electric insulating material | |
| JPS6296521A (en) | Epoxy resin composition | |
| JPH0717729B2 (en) | Substrates for electrical and electronic equipment laminates impregnated with an epoxy resin composition | |
| JPH10251380A (en) | Thermoset resin composition | |
| JP3537549B2 (en) | Epoxy resin composition, cured product and laminate | |
| JP2702226B2 (en) | Heat-resistant flame-retardant epoxy resin composition | |
| JP2004224860A (en) | Epoxy resin curing agent, curable epoxy resin composition and cured material | |
| JP2859413B2 (en) | Propargyl ether compound and composition containing the same | |
| JP3218436B2 (en) | Epoxy resin composition | |
| JP2004168930A (en) | Modified polyimide resin composition and its use | |
| JPH0468313B2 (en) | ||
| JPS6119623A (en) | Composition containing epoxy resin | |
| JP2004307673A (en) | Modified polyimide resin composition, and prepreg and laminate using the same |