JPH0238161U - - Google Patents

Info

Publication number
JPH0238161U
JPH0238161U JP11216188U JP11216188U JPH0238161U JP H0238161 U JPH0238161 U JP H0238161U JP 11216188 U JP11216188 U JP 11216188U JP 11216188 U JP11216188 U JP 11216188U JP H0238161 U JPH0238161 U JP H0238161U
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
mask
solder
approximately
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11216188U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11216188U priority Critical patent/JPH0238161U/ja
Publication of JPH0238161U publication Critical patent/JPH0238161U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Printing Plates And Materials Therefor (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP11216188U 1988-08-29 1988-08-29 Pending JPH0238161U (sv)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11216188U JPH0238161U (sv) 1988-08-29 1988-08-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11216188U JPH0238161U (sv) 1988-08-29 1988-08-29

Publications (1)

Publication Number Publication Date
JPH0238161U true JPH0238161U (sv) 1990-03-14

Family

ID=31350848

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11216188U Pending JPH0238161U (sv) 1988-08-29 1988-08-29

Country Status (1)

Country Link
JP (1) JPH0238161U (sv)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001293972A (ja) * 2000-04-17 2001-10-23 Matsushita Electric Ind Co Ltd スクリーンマスク及びスクリーン印刷方法
JP2005238594A (ja) * 2004-02-25 2005-09-08 Murata Mfg Co Ltd 印刷パターン形成材およびそれを用いた電子部品の製造方法
JP2007081086A (ja) * 2005-09-14 2007-03-29 Seiko Instruments Inc メタルマスク及び電子部品の実装方法
JP2010056368A (ja) * 2008-08-29 2010-03-11 Fuji Mach Mfg Co Ltd 転写装置及び転写方法
US8105644B2 (en) 2007-03-08 2012-01-31 Nitto Denko Corporation Manufacturing method of printed circuit board
JP2014138040A (ja) * 2013-01-15 2014-07-28 Shindengen Electric Mfg Co Ltd はんだペーストの塗布構造

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60260192A (ja) * 1984-06-06 1985-12-23 富士電機株式会社 混成集積回路の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60260192A (ja) * 1984-06-06 1985-12-23 富士電機株式会社 混成集積回路の製造方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001293972A (ja) * 2000-04-17 2001-10-23 Matsushita Electric Ind Co Ltd スクリーンマスク及びスクリーン印刷方法
JP4560880B2 (ja) * 2000-04-17 2010-10-13 パナソニック株式会社 スクリーンマスク及びスクリーン印刷方法
JP2005238594A (ja) * 2004-02-25 2005-09-08 Murata Mfg Co Ltd 印刷パターン形成材およびそれを用いた電子部品の製造方法
JP4525107B2 (ja) * 2004-02-25 2010-08-18 株式会社村田製作所 積層セラミック電子部品の製造方法
JP2007081086A (ja) * 2005-09-14 2007-03-29 Seiko Instruments Inc メタルマスク及び電子部品の実装方法
US8105644B2 (en) 2007-03-08 2012-01-31 Nitto Denko Corporation Manufacturing method of printed circuit board
JP2010056368A (ja) * 2008-08-29 2010-03-11 Fuji Mach Mfg Co Ltd 転写装置及び転写方法
JP2014138040A (ja) * 2013-01-15 2014-07-28 Shindengen Electric Mfg Co Ltd はんだペーストの塗布構造

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