JPH023687Y2 - - Google Patents
Info
- Publication number
- JPH023687Y2 JPH023687Y2 JP7197785U JP7197785U JPH023687Y2 JP H023687 Y2 JPH023687 Y2 JP H023687Y2 JP 7197785 U JP7197785 U JP 7197785U JP 7197785 U JP7197785 U JP 7197785U JP H023687 Y2 JPH023687 Y2 JP H023687Y2
- Authority
- JP
- Japan
- Prior art keywords
- seeding machine
- main shaft
- machine
- split metal
- seeding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000010899 nucleation Methods 0.000 claims description 57
- 239000002184 metal Substances 0.000 claims description 33
- 229910052751 metal Inorganic materials 0.000 claims description 33
- 238000009331 sowing Methods 0.000 claims description 28
- 230000005540 biological transmission Effects 0.000 claims description 20
- 239000003337 fertilizer Substances 0.000 description 15
- 230000004720 fertilization Effects 0.000 description 6
- 239000002689 soil Substances 0.000 description 5
- 230000007246 mechanism Effects 0.000 description 3
- 238000013019 agitation Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 240000001931 Ludwigia octovalvis Species 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
Landscapes
- Sowing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7197785U JPH023687Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1985-05-15 | 1985-05-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7197785U JPH023687Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1985-05-15 | 1985-05-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61186317U JPS61186317U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1986-11-20 |
| JPH023687Y2 true JPH023687Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1990-01-29 |
Family
ID=30609959
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7197785U Expired JPH023687Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1985-05-15 | 1985-05-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH023687Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10580749B2 (en) | 2005-03-25 | 2020-03-03 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of forming high routing density interconnect sites on substrate |
-
1985
- 1985-05-15 JP JP7197785U patent/JPH023687Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10580749B2 (en) | 2005-03-25 | 2020-03-03 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of forming high routing density interconnect sites on substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61186317U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1986-11-20 |