JPH023624Y2 - - Google Patents

Info

Publication number
JPH023624Y2
JPH023624Y2 JP1984023734U JP2373484U JPH023624Y2 JP H023624 Y2 JPH023624 Y2 JP H023624Y2 JP 1984023734 U JP1984023734 U JP 1984023734U JP 2373484 U JP2373484 U JP 2373484U JP H023624 Y2 JPH023624 Y2 JP H023624Y2
Authority
JP
Japan
Prior art keywords
spool
wire
bonding wire
alumite
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1984023734U
Other languages
English (en)
Japanese (ja)
Other versions
JPS60136138U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984023734U priority Critical patent/JPS60136138U/ja
Publication of JPS60136138U publication Critical patent/JPS60136138U/ja
Application granted granted Critical
Publication of JPH023624Y2 publication Critical patent/JPH023624Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member

Landscapes

  • Wire Bonding (AREA)
  • Manufacturing Of Electric Cables (AREA)
JP1984023734U 1984-02-20 1984-02-20 ボンデイングワイヤ−用スプ−ル Granted JPS60136138U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984023734U JPS60136138U (ja) 1984-02-20 1984-02-20 ボンデイングワイヤ−用スプ−ル

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984023734U JPS60136138U (ja) 1984-02-20 1984-02-20 ボンデイングワイヤ−用スプ−ル

Publications (2)

Publication Number Publication Date
JPS60136138U JPS60136138U (ja) 1985-09-10
JPH023624Y2 true JPH023624Y2 (https=) 1990-01-29

Family

ID=30517234

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984023734U Granted JPS60136138U (ja) 1984-02-20 1984-02-20 ボンデイングワイヤ−用スプ−ル

Country Status (1)

Country Link
JP (1) JPS60136138U (https=)

Also Published As

Publication number Publication date
JPS60136138U (ja) 1985-09-10

Similar Documents

Publication Publication Date Title
JPH023624Y2 (https=)
US2466890A (en) Method of soldering to a nickel alloy coil
JP2004146351A (ja) 低圧放電ランプ及びその製造方法
JPH05145220A (ja) 導体膜および導体膜の製造方法
JPH0578896A (ja) ストライプめつき条の製造方法
JPH0533806B2 (https=)
JPS6257106B2 (https=)
JP2583317B2 (ja) 酸化被膜を有する超電導体
JPH03158496A (ja) ナットねじ孔面のめっき方法
JPH02281749A (ja) リードフレームの製造方法
JPS6138187Y2 (https=)
JPH0452187B2 (https=)
JP3395759B2 (ja) チップインダクタの製造方法
WO2000079588A1 (fr) Boitier a joint en resine et plaquette de formation de bornes
JPH01100282A (ja) 接点材料の部分めっき方法
JPH04322889A (ja) クラッド材とその製造方法
JPH0520511B2 (https=)
JPS62156089A (ja) 部分クラツド材の製造方法
JPH10178136A (ja) リードフレームの製造方法
JPS59193297A (ja) ブラシめつき方法
JP2531361B2 (ja) 半導体装置のワイヤボンディング方法及びボンディング用ワイヤ
JPH02132999A (ja) スピーカ用ボイスコイルの引出線の端末処理方法
JP2001015256A (ja) 曲面状発熱体の製造方法及び曲面状発熱体
JPS58184209A (ja) 素線絶縁ケ−ブル導体の製造方法
JPS58184234A (ja) 管球用口金の製造方法