JPH0236061U - - Google Patents
Info
- Publication number
- JPH0236061U JPH0236061U JP1988114941U JP11494188U JPH0236061U JP H0236061 U JPH0236061 U JP H0236061U JP 1988114941 U JP1988114941 U JP 1988114941U JP 11494188 U JP11494188 U JP 11494188U JP H0236061 U JPH0236061 U JP H0236061U
- Authority
- JP
- Japan
- Prior art keywords
- stud
- top surface
- led
- lens
- studs
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011810 insulating material Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988114941U JPH0623008Y2 (ja) | 1988-09-02 | 1988-09-02 | ピン端子ｌｅｄ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988114941U JPH0623008Y2 (ja) | 1988-09-02 | 1988-09-02 | ピン端子ｌｅｄ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0236061U true JPH0236061U (US07321065-20080122-C00160.png) | 1990-03-08 |
| JPH0623008Y2 JPH0623008Y2 (ja) | 1994-06-15 |
Family
ID=31356145
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988114941U Expired - Fee Related JPH0623008Y2 (ja) | 1988-09-02 | 1988-09-02 | ピン端子ｌｅｄ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0623008Y2 (US07321065-20080122-C00160.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006509373A (ja) * | 2002-12-06 | 2006-03-16 | クリー インコーポレイテッド | １つの小さい設置面積を有するｌｅｄパッケージダイ |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5768088A (en) * | 1980-10-15 | 1982-04-26 | Toshiba Corp | Photosemiconductor device |
-
1988
- 1988-09-02 JP JP1988114941U patent/JPH0623008Y2/ja not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5768088A (en) * | 1980-10-15 | 1982-04-26 | Toshiba Corp | Photosemiconductor device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006509373A (ja) * | 2002-12-06 | 2006-03-16 | クリー インコーポレイテッド | １つの小さい設置面積を有するｌｅｄパッケージダイ |
| JP2011044718A (ja) * | 2002-12-06 | 2011-03-03 | Cree Inc | １つの小さい設置面積を有するｌｅｄパッケージダイ |
| JP4675627B2 (ja) * | 2002-12-06 | 2011-04-27 | クリー インコーポレイテッド | １つの小さい設置面積を有するｌｅｄパッケージダイ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0623008Y2 (ja) | 1994-06-15 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |