JPH0236057U - - Google Patents

Info

Publication number
JPH0236057U
JPH0236057U JP1988114972U JP11497288U JPH0236057U JP H0236057 U JPH0236057 U JP H0236057U JP 1988114972 U JP1988114972 U JP 1988114972U JP 11497288 U JP11497288 U JP 11497288U JP H0236057 U JPH0236057 U JP H0236057U
Authority
JP
Japan
Prior art keywords
sensor
image sensor
drive circuit
circuit board
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988114972U
Other languages
English (en)
Japanese (ja)
Other versions
JPH079386Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988114972U priority Critical patent/JPH079386Y2/ja
Publication of JPH0236057U publication Critical patent/JPH0236057U/ja
Application granted granted Critical
Publication of JPH079386Y2 publication Critical patent/JPH079386Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/49105Connecting at different heights
    • H01L2224/49109Connecting at different heights outside the semiconductor or solid-state body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
JP1988114972U 1988-09-02 1988-09-02 イメージセンサ Expired - Lifetime JPH079386Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988114972U JPH079386Y2 (ja) 1988-09-02 1988-09-02 イメージセンサ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988114972U JPH079386Y2 (ja) 1988-09-02 1988-09-02 イメージセンサ

Publications (2)

Publication Number Publication Date
JPH0236057U true JPH0236057U (US20030204162A1-20031030-M00002.png) 1990-03-08
JPH079386Y2 JPH079386Y2 (ja) 1995-03-06

Family

ID=31356205

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988114972U Expired - Lifetime JPH079386Y2 (ja) 1988-09-02 1988-09-02 イメージセンサ

Country Status (1)

Country Link
JP (1) JPH079386Y2 (US20030204162A1-20031030-M00002.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004095831A1 (ja) * 2003-04-24 2004-11-04 Hamamatsu Photonics K.K. 固体撮像装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5293285A (en) * 1976-02-02 1977-08-05 Hitachi Ltd Structure for semiconductor device
JPS6218756A (ja) * 1985-07-18 1987-01-27 Toshiba Corp イメ−ジセンサの製造方法
JPS6229162A (ja) * 1985-07-29 1987-02-07 Toshiba Corp イメ−ジセンサ
JPS6329972A (ja) * 1986-07-24 1988-02-08 Toshiba Corp 読取装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5293285A (en) * 1976-02-02 1977-08-05 Hitachi Ltd Structure for semiconductor device
JPS6218756A (ja) * 1985-07-18 1987-01-27 Toshiba Corp イメ−ジセンサの製造方法
JPS6229162A (ja) * 1985-07-29 1987-02-07 Toshiba Corp イメ−ジセンサ
JPS6329972A (ja) * 1986-07-24 1988-02-08 Toshiba Corp 読取装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004095831A1 (ja) * 2003-04-24 2004-11-04 Hamamatsu Photonics K.K. 固体撮像装置
CN100387051C (zh) * 2003-04-24 2008-05-07 浜松光子学株式会社 固体摄像装置

Also Published As

Publication number Publication date
JPH079386Y2 (ja) 1995-03-06

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