JPH0236057U - - Google Patents
Info
- Publication number
- JPH0236057U JPH0236057U JP1988114972U JP11497288U JPH0236057U JP H0236057 U JPH0236057 U JP H0236057U JP 1988114972 U JP1988114972 U JP 1988114972U JP 11497288 U JP11497288 U JP 11497288U JP H0236057 U JPH0236057 U JP H0236057U
- Authority
- JP
- Japan
- Prior art keywords
- sensor
- image sensor
- drive circuit
- circuit board
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Solid State Image Pick-Up Elements (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988114972U JPH079386Y2 (ja) | 1988-09-02 | 1988-09-02 | イメージセンサ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988114972U JPH079386Y2 (ja) | 1988-09-02 | 1988-09-02 | イメージセンサ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0236057U true JPH0236057U (US20030199744A1-20031023-C00003.png) | 1990-03-08 |
| JPH079386Y2 JPH079386Y2 (ja) | 1995-03-06 |
Family
ID=31356205
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988114972U Expired - Lifetime JPH079386Y2 (ja) | 1988-09-02 | 1988-09-02 | イメージセンサ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH079386Y2 (US20030199744A1-20031023-C00003.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004095831A1 (ja) * | 2003-04-24 | 2004-11-04 | Hamamatsu Photonics K.K. | 固体撮像装置 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5293285A (en) * | 1976-02-02 | 1977-08-05 | Hitachi Ltd | Structure for semiconductor device |
| JPS6218756A (ja) * | 1985-07-18 | 1987-01-27 | Toshiba Corp | イメ−ジセンサの製造方法 |
| JPS6229162A (ja) * | 1985-07-29 | 1987-02-07 | Toshiba Corp | イメ−ジセンサ |
| JPS6329972A (ja) * | 1986-07-24 | 1988-02-08 | Toshiba Corp | 読取装置 |
-
1988
- 1988-09-02 JP JP1988114972U patent/JPH079386Y2/ja not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5293285A (en) * | 1976-02-02 | 1977-08-05 | Hitachi Ltd | Structure for semiconductor device |
| JPS6218756A (ja) * | 1985-07-18 | 1987-01-27 | Toshiba Corp | イメ−ジセンサの製造方法 |
| JPS6229162A (ja) * | 1985-07-29 | 1987-02-07 | Toshiba Corp | イメ−ジセンサ |
| JPS6329972A (ja) * | 1986-07-24 | 1988-02-08 | Toshiba Corp | 読取装置 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004095831A1 (ja) * | 2003-04-24 | 2004-11-04 | Hamamatsu Photonics K.K. | 固体撮像装置 |
| CN100387051C (zh) * | 2003-04-24 | 2008-05-07 | 浜松光子学株式会社 | 固体摄像装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH079386Y2 (ja) | 1995-03-06 |
