JPH0235760A - Resin molded package - Google Patents

Abstract

PURPOSE:To facilitate estimation of an amount of water contained in a resin mold of a package for preventing cracks in the resin by incorporating, in the resin mold, a resin whose color is varied depending on an amount of water contained in the resin mold and covering the resin mold with a transparent resin layer. CONSTITUTION:In a resin mold 1 of a semiconductor integrated circuit package, there is incorporated a resin 1a whose color is varied depending on an amount of water contained in the resin mold 1. A part of the resin 1a is joined to a transparent resin layer 1b while one end of the transparent resin layer 1b is exposed outside the resin mold 1 so that the resin mold 1 can be monitored visually from the outside of the semiconductor integrated circuit package. Since the resin 1a presents its inherent color depending on an amount of water contained in the mold, it is possible to determine visually whether the amount of water is appropriate or not by observing the color of the inside of the package through the transparent resin layer 1b.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a package structure for a semiconductor integrated circuit, and more particularly to a semiconductor integrated circuit package by resin molding.

[Conventional technology]

Conventionally, in this type of resin molded semiconductor integrated circuit package, there has been no means for easily monitoring the amount of moisture contained within the resin mold.

[Problem to be solved by the invention]

Since it is not possible to predict the moisture content in the conventional resin molded semiconductor integrated circuit package described above, the semiconductor integrated circuit package is mounted on a printed circuit board using an overall heating method such as infrared rays or vPS reflow. In this case, the moisture contained in the resin mold generates voids, which is a cause of resin cracks.

An object of the present invention is to provide a resin mold package that solves the above problems.

[Differences between the invention and the prior art]

In conventional resin molded semiconductor integrated circuit packages, it has been impossible to easily monitor the amount of moisture contained within the resin mold and predict its degree;
The resin mold package with moisture content monitor according to the present invention has a difference in that the degree of moisture content can be easily predicted from the outside through a transparent resin layer.

[Means to solve the problem]

In order to achieve the above object, the present invention provides a resin mold package in which a semiconductor integrated circuit is sealed with resin, in which a resin whose color changes depending on the moisture content is mixed into the resin mold of the package. It is coated with a transparent resin layer from the outside.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIGS. 1(a), (b), and (c) are diagrams showing one embodiment of the present invention.

In the figure, a resin 1a whose color changes depending on the moisture content in the resin mold 1 is mixed into a resin mold 1 of a semiconductor integrated circuit package, and a part of the resin 1a whose color changes is replaced with a transparent resin. 3 is a resin mold which is bonded to a resin layer 1b, and one end of the transparent resin layer 1b is exposed outside the resin mold 1, so that it can be visually monitored from the outside of the semiconductor integrated circuit package. 1 is a resin-sealed chip, and 2 is a lead terminal calculated from the chip 3.

According to the present invention, the resin 1a exhibits a unique color depending on the amount of moisture contained in the mold, and the color inside the package is detected w4 through the transparent resin layer 1b to visually determine whether the moisture content is correct or incorrect. Can be judged.

Incidentally, the present invention can be similarly applied to the DIP type package P shown in FIG. 2 or the type of package P shown in FIG.

〔Effect of the invention〕

As explained above, the present invention mixes a resin whose color changes depending on the amount of water contained in the resin mold into the resin mold of a semiconductor integrated circuit package, and visually transmits it from the outside through a transparent resin layer. By monitoring the amount of moisture in the resin mold of the package, it is possible to easily predict the moisture content in the resin mold of the package. When this is mounted, it is possible to prevent resin cracks caused by excessive moisture content in the resin mold.

[Brief explanation of the drawing]

FIG. 1(a) is a front view showing an embodiment of the present invention, FIG. 1(b) is a sectional view taken along line A-A in FIG. 1(a), and FIG. 1(C) is a front view showing an embodiment of the present invention.
. FIGS. 2 and 3 are diagrams showing an embodiment of a resin mold package according to the present invention. 1...Resin mold 1a...Resin 1b whose color changes depending on the moisture content
...Transparent resin layer 2...Lead terminal 3...
・Chip 1α resin

Claims (1)

[Claims] (1) In a resin mold package in which a semiconductor integrated circuit is sealed with resin, a resin whose color changes depending on the water content is mixed into the resin mold of the package, and the resin is applied from the outside with a transparent resin layer. A resin mold package characterized by being coated.