JPH0235453U - - Google Patents

Info

Publication number
JPH0235453U
JPH0235453U JP11473788U JP11473788U JPH0235453U JP H0235453 U JPH0235453 U JP H0235453U JP 11473788 U JP11473788 U JP 11473788U JP 11473788 U JP11473788 U JP 11473788U JP H0235453 U JPH0235453 U JP H0235453U
Authority
JP
Japan
Prior art keywords
gate electrode
ceramic substrate
electrode
thermally conductive
conductive ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11473788U
Other languages
English (en)
Other versions
JPH0514519Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11473788U priority Critical patent/JPH0514519Y2/ja
Publication of JPH0235453U publication Critical patent/JPH0235453U/ja
Application granted granted Critical
Publication of JPH0514519Y2 publication Critical patent/JPH0514519Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案による電力用モールドモジユー
ルの構造を示す図で、ａは正面図、ｂは平面図、
ｃは側面図。第２図は従来の電力用モールドモジ
ユールの構造を示す図でａは正面図、ｂは平面図
、ｃは側面図。 １，１１……高熱伝導セラミツクス基板、２…
…ドレーン電極、３……ソース電極、４……ゲー
ト電極、５……半導体素子、６……ソース電極ワ
イヤ、７……ゲート電極ワイヤ、８……金属製基
台、９……モールド樹脂、１０……外枠。

Claims (1)

    【実用新案登録請求の範囲】
  1. 複数の偶数個の半導体素子を組合せ構成する電
    力用半導体モールドモジユールにおいて半導体素
    子のドレーン・ソース面に外部導出のための電極
    を半田接続し、ドレーン電極とゲート電極とは金
    属製基台に裏張りされた熱伝導セラミツクス基板
    に半田接続し、ゲート電極は半導体素子とワイヤ
    ボンデイングにより接続し、ソース電極を熱伝導
    セラミツクス基板を介し対向して配置し、外部と
    接続する導出電極部分を除き一体に樹脂モールド
    したことを特徴とする電力用半導体モールドモジ
    ユール。
JP11473788U 1988-08-30 1988-08-30 Expired - Lifetime JPH0514519Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11473788U JPH0514519Y2 (ja) 1988-08-30 1988-08-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11473788U JPH0514519Y2 (ja) 1988-08-30 1988-08-30

Publications (2)

Publication Number Publication Date
JPH0235453U true JPH0235453U (ja) 1990-03-07
JPH0514519Y2 JPH0514519Y2 (ja) 1993-04-19

Family

ID=31355761

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11473788U Expired - Lifetime JPH0514519Y2 (ja) 1988-08-30 1988-08-30

Country Status (1)

Country Link
JP (1) JPH0514519Y2 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003511864A (ja) * 1999-10-09 2003-03-25 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 電力半導体モジュール
JP2006093679A (ja) * 2004-08-24 2006-04-06 Sony Corp 半導体パッケージ
JP2010103231A (ja) * 2008-10-22 2010-05-06 Denso Corp 電子装置
JP2016021558A (ja) * 2014-06-19 2016-02-04 パナソニックＩｐマネジメント株式会社 電子装置およびその製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003511864A (ja) * 1999-10-09 2003-03-25 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 電力半導体モジュール
JP2006093679A (ja) * 2004-08-24 2006-04-06 Sony Corp 半導体パッケージ
JP4626445B2 (ja) * 2004-08-24 2011-02-09 ソニー株式会社 半導体パッケージの製造方法
JP2010103231A (ja) * 2008-10-22 2010-05-06 Denso Corp 電子装置
JP2016021558A (ja) * 2014-06-19 2016-02-04 パナソニックＩｐマネジメント株式会社 電子装置およびその製造方法

Also Published As

Publication number Publication date
JPH0514519Y2 (ja) 1993-04-19

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