JPH0235453U - - Google Patents
Info
- Publication number
- JPH0235453U JPH0235453U JP1988114737U JP11473788U JPH0235453U JP H0235453 U JPH0235453 U JP H0235453U JP 1988114737 U JP1988114737 U JP 1988114737U JP 11473788 U JP11473788 U JP 11473788U JP H0235453 U JPH0235453 U JP H0235453U
- Authority
- JP
- Japan
- Prior art keywords
- gate electrode
- ceramic substrate
- electrode
- thermally conductive
- conductive ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W72/851—
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988114737U JPH0514519Y2 (enExample) | 1988-08-30 | 1988-08-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988114737U JPH0514519Y2 (enExample) | 1988-08-30 | 1988-08-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0235453U true JPH0235453U (enExample) | 1990-03-07 |
| JPH0514519Y2 JPH0514519Y2 (enExample) | 1993-04-19 |
Family
ID=31355761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988114737U Expired - Lifetime JPH0514519Y2 (enExample) | 1988-08-30 | 1988-08-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0514519Y2 (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003511864A (ja) * | 1999-10-09 | 2003-03-25 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | 電力半導体モジュール |
| JP2006093679A (ja) * | 2004-08-24 | 2006-04-06 | Sony Corp | 半導体パッケージ |
| JP2010103231A (ja) * | 2008-10-22 | 2010-05-06 | Denso Corp | 電子装置 |
| JP2016021558A (ja) * | 2014-06-19 | 2016-02-04 | パナソニックＩｐマネジメント株式会社 | 電子装置およびその製造方法 |
-
1988
- 1988-08-30 JP JP1988114737U patent/JPH0514519Y2/ja not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003511864A (ja) * | 1999-10-09 | 2003-03-25 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | 電力半導体モジュール |
| JP2006093679A (ja) * | 2004-08-24 | 2006-04-06 | Sony Corp | 半導体パッケージ |
| JP2010103231A (ja) * | 2008-10-22 | 2010-05-06 | Denso Corp | 電子装置 |
| JP2016021558A (ja) * | 2014-06-19 | 2016-02-04 | パナソニックＩｐマネジメント株式会社 | 電子装置およびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0514519Y2 (enExample) | 1993-04-19 |