JPH0235449U - - Google Patents

Info

Publication number
JPH0235449U
JPH0235449U JP11437488U JP11437488U JPH0235449U JP H0235449 U JPH0235449 U JP H0235449U JP 11437488 U JP11437488 U JP 11437488U JP 11437488 U JP11437488 U JP 11437488U JP H0235449 U JPH0235449 U JP H0235449U
Authority
JP
Japan
Prior art keywords
package
semiconductor device
metal plate
semiconductor chip
flat circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11437488U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11437488U priority Critical patent/JPH0235449U/ja
Publication of JPH0235449U publication Critical patent/JPH0235449U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図はこの考案の一実施例による半導体装置
用パツケージを示す断面図、第２図は従来の半導
体装置用パツケージを示す断面図である。 図において、１は半導体チツプ、２は金属基体
、３は誘電体基板、４は金属板、５ははんだ、６
はろー材、７は金属細線である。なお、図中、同
一符号は同一、又は相当部分を示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. マイクロ波平面回路及び半導体チツプを搭載す
    るマイクロ波平面回路基板の熱膨張係数に近似し
    た熱膨張係数を有する金属板が、金属固体ブロツ
    クに固着されている半導体装置用パツケージにお
    いて、半導体チツプ側の端面をカツトした金属板
    を備えたことを特徴とする半導体装置用パツケー
    ジ。
JP11437488U 1988-08-30 1988-08-30 Pending JPH0235449U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11437488U JPH0235449U (ja) 1988-08-30 1988-08-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11437488U JPH0235449U (ja) 1988-08-30 1988-08-30

Publications (1)

Publication Number Publication Date
JPH0235449U true JPH0235449U (ja) 1990-03-07

Family

ID=31355061

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11437488U Pending JPH0235449U (ja) 1988-08-30 1988-08-30

Country Status (1)

Country Link
JP (1) JPH0235449U (ja)

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