JPH0234183B2 - - Google Patents

Info

Publication number
JPH0234183B2
JPH0234183B2 JP59083708A JP8370884A JPH0234183B2 JP H0234183 B2 JPH0234183 B2 JP H0234183B2 JP 59083708 A JP59083708 A JP 59083708A JP 8370884 A JP8370884 A JP 8370884A JP H0234183 B2 JPH0234183 B2 JP H0234183B2
Authority
JP
Japan
Prior art keywords
heat transfer
tunnel
heat
cavity
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59083708A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60229353A (ja
Inventor
Hisashi Nakayama
Tadakatsu Nakajima
Shigeki Hirasawa
Akiomi Kono
Takatsugu Takenaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP59083708A priority Critical patent/JPS60229353A/ja
Priority to US06/726,715 priority patent/US4619316A/en
Priority to DE8585105149T priority patent/DE3571894D1/de
Priority to EP85105149A priority patent/EP0159722B1/en
Publication of JPS60229353A publication Critical patent/JPS60229353A/ja
Publication of JPH0234183B2 publication Critical patent/JPH0234183B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
    • F28F13/187—Heat-exchange surfaces provided with microstructures or with porous coatings especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S505/00—Superconductor technology: apparatus, material, process
    • Y10S505/825—Apparatus per se, device per se, or process of making or operating same
    • Y10S505/90—Heat exchange

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Containers, Films, And Cooling For Superconductive Devices (AREA)
JP59083708A 1984-04-27 1984-04-27 熱伝達装置 Granted JPS60229353A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP59083708A JPS60229353A (ja) 1984-04-27 1984-04-27 熱伝達装置
US06/726,715 US4619316A (en) 1984-04-27 1985-04-24 Heat transfer apparatus
DE8585105149T DE3571894D1 (en) 1984-04-27 1985-04-26 Heat transfer apparatus
EP85105149A EP0159722B1 (en) 1984-04-27 1985-04-26 Heat transfer apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59083708A JPS60229353A (ja) 1984-04-27 1984-04-27 熱伝達装置

Publications (2)

Publication Number Publication Date
JPS60229353A JPS60229353A (ja) 1985-11-14
JPH0234183B2 true JPH0234183B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1990-08-01

Family

ID=13809993

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59083708A Granted JPS60229353A (ja) 1984-04-27 1984-04-27 熱伝達装置

Country Status (4)

Country Link
US (1) US4619316A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
EP (1) EP0159722B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS60229353A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE3571894D1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (78)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR900001393B1 (en) * 1985-04-30 1990-03-09 Fujitsu Ltd Evaporation cooling module for semiconductor device
US4750086A (en) * 1985-12-11 1988-06-07 Unisys Corporation Apparatus for cooling integrated circuit chips with forced coolant jet
US4794984A (en) * 1986-11-10 1989-01-03 Lin Pang Yien Arrangement for increasing heat transfer coefficient between a heating surface and a boiling liquid
US4757370A (en) * 1987-01-12 1988-07-12 International Business Machines Corp. Circuit package cooling technique with liquid film spreading downward across package surface without separation
US4771366A (en) * 1987-07-06 1988-09-13 International Business Machines Corporation Ceramic card assembly having enhanced power distribution and cooling
EP0298372B1 (en) * 1987-07-10 1993-01-13 Hitachi, Ltd. Semiconductor cooling apparatus
JP2741255B2 (ja) * 1989-08-18 1998-04-15 株式会社日立製作所 沸騰冷却用伝熱体
US5006924A (en) * 1989-12-29 1991-04-09 International Business Machines Corporation Heat sink for utilization with high density integrated circuit substrates
US5106451A (en) * 1990-11-15 1992-04-21 International Business Machines Corporation Heat sink and method of attachment
US5177666A (en) * 1991-10-24 1993-01-05 Bland Timothy J Cooling rack for electronic devices
US5208729A (en) * 1992-02-14 1993-05-04 International Business Machines Corporation Multi-chip module
US5406807A (en) * 1992-06-17 1995-04-18 Hitachi, Ltd. Apparatus for cooling semiconductor device and computer having the same
US5333460A (en) * 1992-12-21 1994-08-02 Carrier Corporation Compact and serviceable packaging of a self-contained cryocooler system
US5403783A (en) * 1992-12-28 1995-04-04 Hitachi, Ltd. Integrated circuit substrate with cooling accelerator substrate
US5405808A (en) * 1993-08-16 1995-04-11 Lsi Logic Corporation Fluid-filled and gas-filled semiconductor packages
JP2953273B2 (ja) * 1993-10-22 1999-09-27 住友電気工業株式会社 低温に冷却する素子の接続方法
US5529115A (en) * 1994-07-14 1996-06-25 At&T Global Information Solutions Company Integrated circuit cooling device having internal cooling conduit
FR2738446B1 (fr) * 1995-08-30 1997-09-26 Gec Alsthom Transport Sa Procede et dispositif de filtrage d'un milieu liquide isolant electrique et caloriporteur et groupe d'electronique de puissance comportant un tel dispositif
GB2317686B (en) * 1996-09-26 2000-09-27 Gec Alsthom Ltd Power equipment for use underwater
US5907473A (en) * 1997-04-04 1999-05-25 Raytheon Company Environmentally isolated enclosure for electronic components
US6050333A (en) * 1997-11-10 2000-04-18 Albaroudi; Homam M. Rotary heat exchange apparatus for condensing vapor
US6019167A (en) * 1997-12-19 2000-02-01 Nortel Networks Corporation Liquid immersion cooling apparatus for electronic systems operating in thermally uncontrolled environments
US6021844A (en) * 1998-06-03 2000-02-08 Batchelder; John Samuel Heat exchange apparatus
US6148905A (en) * 1999-04-30 2000-11-21 Motorola, Inc. Two-phase thermosyphon including air feed through slots
US6898082B2 (en) 2002-05-10 2005-05-24 Serguei V. Dessiatoun Enhanced heat transfer structure with heat transfer members of variable density
EP1428997B1 (en) * 2002-12-12 2008-12-24 Perkins Engines Company Limited Cooling arrangement and method with selected surfaces configured to inhibit changes in boiling state
US6919504B2 (en) * 2002-12-19 2005-07-19 3M Innovative Properties Company Flexible heat sink
US7165413B2 (en) * 2004-07-09 2007-01-23 Symons Robert S Integrated liquid cooling device with immersed electronic components
US7162887B2 (en) * 2004-07-09 2007-01-16 Symons Robert S Integrated liquid cooling device for electronic components
US7079393B2 (en) * 2004-11-16 2006-07-18 International Business Machines Corporation Fluidic cooling systems and methods for electronic components
JP4608641B2 (ja) * 2005-04-27 2011-01-12 株式会社豊田自動織機 パワーモジュール用ヒートシンク
CA2605966A1 (en) * 2005-06-07 2006-12-14 Wolverine Tube, Inc. Heat transfer surface for electronic cooling
US7908874B2 (en) * 2006-05-02 2011-03-22 Raytheon Company Method and apparatus for cooling electronics with a coolant at a subambient pressure
US7709296B2 (en) * 2006-10-19 2010-05-04 International Business Machines Corporation Coupling metal clad fiber optics for enhanced heat dissipation
US20080173427A1 (en) * 2007-01-23 2008-07-24 Richard Schumacher Electronic component cooling
US8651172B2 (en) 2007-03-22 2014-02-18 Raytheon Company System and method for separating components of a fluid coolant for cooling a structure
US7934386B2 (en) 2008-02-25 2011-05-03 Raytheon Company System and method for cooling a heat generating structure
US7961475B2 (en) * 2008-10-23 2011-06-14 International Business Machines Corporation Apparatus and method for facilitating immersion-cooling of an electronic subsystem
US7916483B2 (en) * 2008-10-23 2011-03-29 International Business Machines Corporation Open flow cold plate for liquid cooled electronic packages
US7983040B2 (en) * 2008-10-23 2011-07-19 International Business Machines Corporation Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem
US8369091B2 (en) 2010-06-29 2013-02-05 International Business Machines Corporation Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack
US8345423B2 (en) 2010-06-29 2013-01-01 International Business Machines Corporation Interleaved, immersion-cooling apparatuses and methods for cooling electronic subsystems
US8184436B2 (en) 2010-06-29 2012-05-22 International Business Machines Corporation Liquid-cooled electronics rack with immersion-cooled electronic subsystems
US8179677B2 (en) 2010-06-29 2012-05-15 International Business Machines Corporation Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack
US8351206B2 (en) 2010-06-29 2013-01-08 International Business Machines Corporation Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit
JP5618419B2 (ja) * 2011-06-13 2014-11-05 株式会社日立製作所 沸騰冷却システム
US8934250B2 (en) 2012-09-26 2015-01-13 International Business Machines Corporation Immersion-cooling of selected electronic component(s) mounted to printed circuit board
JP2014072265A (ja) * 2012-09-28 2014-04-21 Hitachi Ltd 冷却システム、及びそれを用いた電子装置
US9328964B2 (en) 2013-02-01 2016-05-03 Dell Products, L.P. Partitioned, rotating condenser units to enable servicing of submerged it equipment positioned beneath a vapor condenser without interrupting a vaporization-condensation cycling of the remaining immersion cooling system
US20140318741A1 (en) * 2013-04-29 2014-10-30 Nicholas Jeffers Cooling With Liquid Coolant And Bubble Heat Removal
US9414520B2 (en) * 2013-05-28 2016-08-09 Hamilton Sundstrand Corporation Immersion cooled motor controller
US20150022975A1 (en) * 2013-07-19 2015-01-22 General Electric Company Method and system for an immersion boiling heat sink
US9282678B2 (en) * 2013-10-21 2016-03-08 International Business Machines Corporation Field-replaceable bank of immersion-cooled electronic components and separable heat sinks
US9332674B2 (en) 2013-10-21 2016-05-03 International Business Machines Corporation Field-replaceable bank of immersion-cooled electronic components
US10512192B2 (en) * 2015-08-28 2019-12-17 Mark Miyoshi Immersion cooling system with low fluid loss
NL2015841B1 (en) * 2015-11-23 2017-06-07 Aecorsis B V A device comprising heat producing components with liquid submersion cooling.
SG11201804241UA (en) * 2015-12-02 2018-06-28 Downunder Geosolutions Pty Ltd Fluid cooling system and method for electronics equipment
JP6658312B2 (ja) * 2016-06-01 2020-03-04 富士通株式会社 液浸冷却装置、液浸冷却システム、及び液浸冷却装置の制御方法
KR101828345B1 (ko) * 2016-10-19 2018-03-29 주식회사 로킷 바이오 3차원 프린터
US11064631B2 (en) * 2017-07-05 2021-07-13 Fujitsu Limited Liquid immersion cooling device and information processing apparatus
CN107979955B (zh) * 2017-11-24 2020-06-30 北京百度网讯科技有限公司 一种模块化液冷服务器机箱
JP7151503B2 (ja) * 2019-01-23 2022-10-12 富士通株式会社 冷却装置及び電子機器
US11516948B2 (en) * 2019-04-02 2022-11-29 Eaton Intelligent Power Limited Immersion cooling systems and methods for electrical power components
NL2025574B1 (en) * 2020-05-13 2021-11-30 Microsoft Technology Licensing Llc Systems and methods for vapor management in immersion cooling
US11357137B2 (en) * 2020-07-02 2022-06-07 Fang-Shou LEE One-chambered constant pressure apparatus for liquid immersion cooling of servers
CN111857281B (zh) * 2020-08-07 2025-09-05 深圳比特微电子科技有限公司 一种电子设备及用于该电子设备的液体冷却装置
US12050061B2 (en) * 2020-12-14 2024-07-30 Aavid Thermalloy, Llc Shrouded powder patch
CA3151725A1 (en) 2021-04-01 2022-10-01 Ovh Immersion cooling system with dual dielectric cooling liquid circulation
EP4068048B1 (en) 2021-04-01 2025-06-04 Ovh Systems and methods for autonomously activable redundant cooling of a heat generating component
CA3153037A1 (en) * 2021-04-01 2022-10-01 Ovh Hybrid immersion cooling system for rack-mounted electronic assemblies
EP4068930B1 (en) 2021-04-01 2024-03-13 Ovh A rack system for housing an electronic device
US12137536B2 (en) 2021-04-01 2024-11-05 Ovh Systems and methods for autonomously activable redundant cooling of a heat generating component
US11533829B2 (en) * 2021-04-09 2022-12-20 Microsoft Technology Licensing, Llc Systems and methods for immersion-cooled datacenters
US11606878B2 (en) * 2021-04-09 2023-03-14 Microsoft Technology Licensing, Llc Systems and methods for immersion-cooled datacenters
US11744043B2 (en) * 2021-06-22 2023-08-29 Baidu Usa Llc Electronics packaging for phase change cooling systems
US12144148B2 (en) * 2022-06-14 2024-11-12 Microsoft Technology Licensing, Llc Pressure based phase immersion cooling system
US12363858B2 (en) * 2022-10-18 2025-07-15 Microsoft Technology Licensing, Llc Devices, systems, and methods for a cooling system
US12289865B2 (en) * 2022-11-04 2025-04-29 Amulaire Thermal Technology, Inc. Two-phase immersion-cooling heat-dissipation composite structure having high-porosity solid structure and high-thermal-conductivity fins

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4203129A (en) * 1978-07-11 1980-05-13 International Business Machines Corporation Bubble generating tunnels for cooling semiconductor devices
JPS55105959A (en) * 1979-02-07 1980-08-14 Matsushita Electric Ind Co Ltd Container for alkali cell and its manufacturing method
JPS57125546A (en) * 1981-01-29 1982-08-04 Fujitsu Ltd Timing pickup circuit
JPS5984095A (ja) * 1982-11-04 1984-05-15 Hitachi Ltd 熱交換壁

Also Published As

Publication number Publication date
DE3571894D1 (en) 1989-08-31
EP0159722A3 (en) 1987-01-07
EP0159722B1 (en) 1989-07-26
EP0159722A2 (en) 1985-10-30
US4619316A (en) 1986-10-28
JPS60229353A (ja) 1985-11-14

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term