JPH0232603Y2 - - Google Patents
Info
- Publication number
- JPH0232603Y2 JPH0232603Y2 JP19109686U JP19109686U JPH0232603Y2 JP H0232603 Y2 JPH0232603 Y2 JP H0232603Y2 JP 19109686 U JP19109686 U JP 19109686U JP 19109686 U JP19109686 U JP 19109686U JP H0232603 Y2 JPH0232603 Y2 JP H0232603Y2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- binding
- plastic
- insertion hole
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004033 plastic Substances 0.000 claims description 35
- 229920003023 plastic Polymers 0.000 claims description 35
- 229910052751 metal Inorganic materials 0.000 claims description 31
- 239000002184 metal Substances 0.000 claims description 31
- 238000003780 insertion Methods 0.000 claims description 19
- 230000037431 insertion Effects 0.000 claims description 19
- 210000000078 claw Anatomy 0.000 claims description 16
- 239000006223 plastic coating Substances 0.000 description 12
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 206010014357 Electric shock Diseases 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002991 molded plastic Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
Landscapes
- Package Frames And Binding Bands (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19109686U JPH0232603Y2 (en, 2012) | 1986-12-11 | 1986-12-11 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19109686U JPH0232603Y2 (en, 2012) | 1986-12-11 | 1986-12-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6394158U JPS6394158U (en, 2012) | 1988-06-17 |
JPH0232603Y2 true JPH0232603Y2 (en, 2012) | 1990-09-04 |
Family
ID=31144924
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19109686U Expired JPH0232603Y2 (en, 2012) | 1986-12-11 | 1986-12-11 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0232603Y2 (en, 2012) |
-
1986
- 1986-12-11 JP JP19109686U patent/JPH0232603Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS6394158U (en, 2012) | 1988-06-17 |
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