JPH0231151U - - Google Patents
Info
- Publication number
- JPH0231151U JPH0231151U JP10872488U JP10872488U JPH0231151U JP H0231151 U JPH0231151 U JP H0231151U JP 10872488 U JP10872488 U JP 10872488U JP 10872488 U JP10872488 U JP 10872488U JP H0231151 U JPH0231151 U JP H0231151U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- amorphous silicon
- silicon film
- utility
- film formed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 2
- 238000004544 sputter deposition Methods 0.000 claims 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Electrodes Of Semiconductors (AREA)
Description
第１図は本考案の一実施例の平面図、第２図は
第１図のＡ―Ａ′線に沿う拡大断面図である。
１…半導体装置、２…通電領域、３…耐圧構造
、４…電極、５…アルミリング、７…非晶質シリ
コン膜。
FIG. 1 is a plan view of an embodiment of the present invention, and FIG. 2 is an enlarged sectional view taken along line AA' in FIG. DESCRIPTION OF SYMBOLS 1... Semiconductor device, 2... Current carrying area, 3... Voltage-resistant structure, 4... Electrode, 5... Aluminum ring, 7... Amorphous silicon film.
Claims (1)
、スパツタ法により形成した非晶質シリコン膜を
配置したことを特徴とする半導体装置。 A semiconductor device characterized in that an amorphous silicon film formed by a sputtering method is disposed around the surface of a semiconductor device having a planar junction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10872488U JPH0231151U (en) | 1988-08-19 | 1988-08-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10872488U JPH0231151U (en) | 1988-08-19 | 1988-08-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0231151U true JPH0231151U (en) | 1990-02-27 |
Family
ID=31344328
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10872488U Pending JPH0231151U (en) | 1988-08-19 | 1988-08-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0231151U (en) |
-
1988
- 1988-08-19 JP JP10872488U patent/JPH0231151U/ja active Pending