JPH02309709A - Filter device - Google Patents
Filter deviceInfo
- Publication number
- JPH02309709A JPH02309709A JP13084489A JP13084489A JPH02309709A JP H02309709 A JPH02309709 A JP H02309709A JP 13084489 A JP13084489 A JP 13084489A JP 13084489 A JP13084489 A JP 13084489A JP H02309709 A JPH02309709 A JP H02309709A
- Authority
- JP
- Japan
- Prior art keywords
- filter
- metallic
- input
- ground potential
- saw filter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract 4
- 238000010897 surface acoustic wave method Methods 0.000 claims abstract 2
- 239000002184 metal Substances 0.000 claims description 23
- 229910052751 metal Inorganic materials 0.000 claims description 23
- 238000005476 soldering Methods 0.000 abstract description 7
- 229910000679 solder Inorganic materials 0.000 abstract description 6
- 238000007598 dipping method Methods 0.000 abstract 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000013016 damping Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000008267 milk Substances 0.000 description 1
- 210000004080 milk Anatomy 0.000 description 1
- 235000013336 milk Nutrition 0.000 description 1
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、衛星放送用屋内受信機の復調部等に用いられ
るフィルタ装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a filter device used in a demodulation section of an indoor receiver for satellite broadcasting.
従来の技術 先ずsAWフィルタについて簡単な説明を行う。Conventional technology First, a brief explanation of the sAW filter will be given.
第3図に示すように、SAWフィルタ1は、圧電材料か
らなる結晶板2の表面上に、入、出力用としてくし状の
入力側金属電極3.出力側金属電極4を対向して形成さ
れている。入力信号は入力側金属電極3に供給されてS
AWに変換され、結晶板2の表面を伝搬し、出力側金属
電極4に到達して電気信号に変換され、出力信号となる
。この様なSAWフィルタ1を第4図のごとく所定のケ
ー76に収納している。このSAWフィルタ1は、回路
の小形化、無調整化が可能なため、TV受信機等の各種
電子機器への応用及び発展が期待されている。As shown in FIG. 3, the SAW filter 1 includes comb-shaped input side metal electrodes 3 for input and output on the surface of a crystal plate 2 made of a piezoelectric material. The output side metal electrodes 4 are formed facing each other. The input signal is supplied to the input side metal electrode 3 and S
It is converted into an AW, propagates on the surface of the crystal plate 2, reaches the output side metal electrode 4, is converted into an electrical signal, and becomes an output signal. Such a SAW filter 1 is housed in a predetermined case 76 as shown in FIG. Since this SAW filter 1 can be made smaller in circuit size and requires no adjustment, it is expected to be applied and developed in various electronic devices such as TV receivers.
なお6は人、出力リード、7は接地リードである。Note that 6 is a person, an output lead, and 7 is a ground lead.
そして上記SAWフィルタ1を用いたフィルタ装置の構
成は第6図、第6図のような構成であった。つまり、人
、出カリードロ、接地リード7を基板8のリード孔9に
挿通させてSAWフィルタ1を基板8に装着し、その後
、フレーム1oへ実装し、DIP半田を行う。組み立て
完成後のDIP半田付は面を第6図に示す。人、出カリ
ードロはパターンにより前後の回路に接続され、接地リ
ード7はパターンで引き回して半田付は部11において
フレーム1oに接地されている。The configuration of a filter device using the above-mentioned SAW filter 1 was as shown in FIGS. That is, the SAW filter 1 is mounted on the board 8 by inserting the lead wire, lead wire, and ground lead 7 into the lead hole 9 of the board 8, and then mounting it on the frame 1o and performing DIP soldering. The DIP soldering after assembly is completed is shown in Figure 6. The lead wire and output lead wire are connected to the front and rear circuits according to a pattern, and the ground lead 7 is routed in a pattern, and the soldering part 11 is grounded to the frame 1o.
発明が解決しようとする課題
衛星放送用屋内受信機の復調部等のUHF帯に第3図〜
第6図のSAtフィルタ1を用いる場合、従来例の構造
では、基準接地電位となるフレーム1oに対し接地リー
ド7は、半田付は部11に至るまでに、第6図に示すよ
うに長さeを持つパターンを介した接続となっておシ、
よって接地り一ド7はフレーム1oの基準接地電位と異
なる電位になり、この結果第7図に示すリップル、減衰
特性に対する目標の達成が困難であるという欠点があっ
た。Problems to be Solved by the Invention In the UHF band of the demodulator of indoor receivers for satellite broadcasting, etc.
When using the SAt filter 1 shown in FIG. 6, in the conventional structure, the ground lead 7 has a length as shown in FIG. The connection is through a pattern with e,
Therefore, the potential of the grounding node 7 is different from the reference grounding potential of the frame 1o, and as a result, there is a drawback that it is difficult to achieve the targets for the ripple and attenuation characteristics shown in FIG.
本発明は上記問題点を解決するもので、リップル、減衰
特性の目標達成を目的としている。The present invention is intended to solve the above-mentioned problems, and aims to achieve the goals of ripple and damping characteristics.
課題を解決するための手段
そしてこの目的を達成するために本発明は、前記SAt
フィルタの接地部が電気的に接続された金属板を、金属
フレームと電気的に接続したものである。Means for solving the problem and to achieve this object, the present invention provides the above-mentioned SAt
A metal plate, to which the grounding part of the filter is electrically connected, is electrically connected to a metal frame.
作用
本発明は上記した構成により、SAwフィルタの接地部
を金属板を介して直接金属フレームに電気的に接続する
ため、SAtフィルタの接地電位を金属フレームの基準
接地電位に近付ける事ができる。Function: With the above-described configuration, the present invention electrically connects the ground portion of the SAw filter directly to the metal frame via the metal plate, so that the ground potential of the SAt filter can be brought close to the reference ground potential of the metal frame.
実施例
以下、本発明の一実施例を添付図面に基づいて説明する
。EXAMPLE Hereinafter, an example of the present invention will be described based on the accompanying drawings.
第1図、第2図に本発明の一実施例を示す。なお、接地
リードは図中省略してあり、接地は金属製のケース6で
行うようになっている。また本実施例では金属板13の
ベーヌ部14にクリーム半田18を塗布した後、人、出
カリードロを逃げ孔16に挿通させてSAtフィルタ1
を金属板13に組み込み、オープン半田付けする。そし
て人。An embodiment of the present invention is shown in FIGS. 1 and 2. FIG. Note that the ground lead is omitted in the figure, and grounding is performed through the metal case 6. Further, in this embodiment, after applying the cream solder 18 to the vane portion 14 of the metal plate 13, the SAt filter 1 is
is assembled into the metal plate 13 and soldered open. And people.
出カリードロを基板8のリード孔9に挿入して基板8に
装着して、金属フレーム1oへ実装し、DIP半田付け
する。第2図のムー人断面を第1図に示す。DIP半田
付けにより金属板13と金属フレーム10が半田16に
よシ接続されると同時に、基板8と人、出カリードロが
半田17により接続されている。The lead wire is inserted into the lead hole 9 of the board 8, attached to the board 8, mounted on the metal frame 1o, and DIP soldered. A cross-section of the Mu person in FIG. 2 is shown in FIG. The metal plate 13 and the metal frame 10 are connected by solder 16 by DIP soldering, and at the same time, the board 8 and the output card are connected by solder 17.
以上の構造により、接地リード7の根元であるSAtフ
ィルタ1のケー76を金属板13を介して直接金属フレ
ーム1oに接続するため、SAWフィルり1の接地電位
を金属フレーム1oの基準接地電位に近付けることがで
き、これによりリヮプル、減衰特性の目標達成が可能と
なる。With the above structure, the case 76 of the SAt filter 1, which is the root of the ground lead 7, is directly connected to the metal frame 1o via the metal plate 13, so the ground potential of the SAW filter 1 is set to the reference ground potential of the metal frame 1o. This makes it possible to achieve the target ripple and damping characteristics.
また、本実施例では、低温で溶融するクリーム半田18
を用いるので、高温の半田ごてによる手半田付けの場合
にしばしば発生するSAtフィルタ1の熱破壊の恐れが
ないものとなる。In addition, in this embodiment, cream solder 18 that melts at a low temperature is used.
Since this is used, there is no risk of thermal destruction of the SAt filter 1, which often occurs when manual soldering is performed using a high-temperature soldering iron.
発明の効果
以上のように本発明によれば、SAtフィルタの接地電
位を金属フレームの基準接地電位に近付けることができ
るので、リップル、減衰特性に対する目標の達成が可能
になるという効果が得られる。Effects of the Invention As described above, according to the present invention, it is possible to bring the ground potential of the SAt filter close to the reference ground potential of the metal frame, so that it is possible to achieve the targets for ripple and attenuation characteristics.
第1図は本発明の一実施例の断面図、第2図はその分解
斜視図、第3図はSAtフィルタの斜視図、第4図はそ
れをケースに収納した斜視図、第6図は従来例の分解斜
視図、第6図はその裏面側の斜視図、第7図は特性図で
ある。
1・・・・・・SAtフィルタ、6・・・・・・ケース
、6・・・・・・入、出力リード、8・・・・・・基板
、9・・・・・・リード孔、10・・・・・・金属フレ
ーム、13・・・・・・金属板。
代理人の氏名 弁理士 粟 野 重 孝 ほか1名9−
ソード乳
第 3 図
第4図
箔5図
第6図Fig. 1 is a sectional view of an embodiment of the present invention, Fig. 2 is an exploded perspective view thereof, Fig. 3 is a perspective view of the SAt filter, Fig. 4 is a perspective view of the SAt filter housed in a case, and Fig. 6 is a perspective view of the SAt filter. FIG. 6 is an exploded perspective view of the conventional example, FIG. 6 is a perspective view of the back side thereof, and FIG. 7 is a characteristic diagram. 1... SAt filter, 6... Case, 6... Input, output lead, 8... Board, 9... Lead hole, 10...Metal frame, 13...Metal plate. Name of agent: Patent attorney Shigetaka Awano and 1 other person9-
Sword Milk Figure 3 Figure 4 Foil Figure 5 Figure 6
Claims (1)
AWフィルタの入,出力リードが接続された基板と、前
記SAWフィルタの接地部が電気的に接続された金属板
を、金属フレームと電気的に接続したフィルタ装置。Surface acoustic wave (hereinafter referred to as SAW) filter and this S
A filter device in which a metal frame is electrically connected to a substrate to which input and output leads of an AW filter are connected, and a metal plate to which a ground portion of the SAW filter is electrically connected.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13084489A JPH02309709A (en) | 1989-05-24 | 1989-05-24 | Filter device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13084489A JPH02309709A (en) | 1989-05-24 | 1989-05-24 | Filter device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02309709A true JPH02309709A (en) | 1990-12-25 |
Family
ID=15044020
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13084489A Pending JPH02309709A (en) | 1989-05-24 | 1989-05-24 | Filter device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02309709A (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59107195A (en) * | 1982-12-13 | 1984-06-21 | Nippon Radiator Co Ltd | Method for manufacturing synthetic resin tank |
JPS6386609A (en) * | 1986-09-29 | 1988-04-18 | Fujitsu Ltd | Package for surface acoustic wave device |
JPH0228124B2 (en) * | 1982-12-30 | 1990-06-21 | Fujitsu Ltd |
-
1989
- 1989-05-24 JP JP13084489A patent/JPH02309709A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59107195A (en) * | 1982-12-13 | 1984-06-21 | Nippon Radiator Co Ltd | Method for manufacturing synthetic resin tank |
JPH0228124B2 (en) * | 1982-12-30 | 1990-06-21 | Fujitsu Ltd | |
JPS6386609A (en) * | 1986-09-29 | 1988-04-18 | Fujitsu Ltd | Package for surface acoustic wave device |
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