JPH02304901A - Fixed film resistor - Google Patents
Fixed film resistorInfo
- Publication number
- JPH02304901A JPH02304901A JP1124166A JP12416689A JPH02304901A JP H02304901 A JPH02304901 A JP H02304901A JP 1124166 A JP1124166 A JP 1124166A JP 12416689 A JP12416689 A JP 12416689A JP H02304901 A JPH02304901 A JP H02304901A
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- coating layer
- varnish
- layer
- coated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 claims abstract description 8
- 239000005011 phenolic resin Substances 0.000 claims abstract description 8
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 8
- 229920001721 polyimide Polymers 0.000 claims abstract description 3
- 239000009719 polyimide resin Substances 0.000 claims abstract description 3
- 239000003973 paint Substances 0.000 claims description 10
- 229910052573 porcelain Inorganic materials 0.000 claims description 4
- 229920000642 polymer Polymers 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 230000001681 protective effect Effects 0.000 claims 1
- 229920001568 phenolic resin Polymers 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract description 2
- 239000002966 varnish Substances 0.000 abstract 7
- 239000011247 coating layer Substances 0.000 abstract 6
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract 2
- 230000007423 decrease Effects 0.000 abstract 1
- 239000008393 encapsulating agent Substances 0.000 abstract 1
- 230000006866 deterioration Effects 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000009966 trimming Methods 0.000 description 2
- 241000282326 Felis catus Species 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野〕
本考案は各itt子機器に使用される固定皮膜抵抗器に
間するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to fixed film resistors used in various ITT child devices.
C従来の技術] 一般に固定皮膜抵抗器は次のように形成される。C. Conventional technology] Fixed film resistors are generally formed as follows.
即ち、第1図に示すように円萬形磁器基体1表面に抵抗
皮膜2を有する抵抗体を帽子型端子3に圧入等の方法で
接続し、抵抗皮膜2をスパイラル状4にトリミングする
。That is, as shown in FIG. 1, a resistor having a resistive film 2 on the surface of a circular porcelain base 1 is connected to a cap-shaped terminal 3 by a method such as press fitting, and the resistive film 2 is trimmed into a spiral shape 4.
更にこの全体をエポキシ樹脂やフェノール樹脂等の絶縁
材料による外装5で被覆している。Further, this entire body is covered with an exterior 5 made of an insulating material such as epoxy resin or phenol resin.
[本発明が解決しようとする問題点]
従来の固定皮膜抵抗器の外装として使用しているフェノ
ール樹脂やエポキシ樹脂では熱伝導率が低い(0,2X
10−司乃至lXl0’″3)ため、抵抗器に電流を流
した場合に抵抗皮膜から発生する自己発熱で第2図(A
)及び(B)に示すように抵抗器の中央部の表面温度が
極めて高くなる。[Problems to be solved by the present invention] Phenol resins and epoxy resins used as the exterior of conventional fixed film resistors have low thermal conductivity (0.2X
10-10-1X10'''3) Therefore, when current is passed through the resistor, the self-heating generated from the resistive film causes heat generation in Figure 2 (A
) and (B), the surface temperature at the center of the resistor becomes extremely high.
従ってスパイラル状にトリミングされた抵抗皮膜の中心
部の熱劣化が激しくなる。Therefore, thermal deterioration in the center of the spirally trimmed resistive film becomes severe.
[本発明が採用する手段]
本発明は熱伝導率がフェノール樹脂やエポキシ樹脂より
10倍以上高い無機系塗料を外装材料として使用するも
のである。[Means Adopted by the Present Invention] The present invention uses an inorganic paint having a thermal conductivity 10 times or more higher than that of phenol resin or epoxy resin as an exterior material.
しかし無機系塗料は抵抗皮膜に直接被覆すると熱衝撃及
び高温負荷寿命等の環境試験で抵抗値変化が大きい。However, when inorganic paints are directly coated on a resistive film, the resistance value changes greatly in environmental tests such as thermal shock and high temperature load life.
又、無機系塗料はフェノール樹脂やエポキシ樹脂より吸
水率が大きいことから抵抗器の耐湿性を損なう。Furthermore, since inorganic paints have a higher water absorption rate than phenolic resins or epoxy resins, they impair the moisture resistance of resistors.
従って本発明は第3図に示すように外装を3層構造とし
、抵抗皮膜に外接する第1層7にフェノール樹脂又はポ
リイミド樹脂等の高分子塗料を被覆し第2層Bに熱伝導
率が5X10−”cal/cm@sec*℃以上の無機
系塗料を被覆し、第3層9にエポキシ樹脂等の絶縁塗料
を被覆する。Therefore, the present invention has a three-layer exterior structure as shown in FIG. 3, the first layer 7 circumscribing the resistive film is coated with a polymer paint such as phenol resin or polyimide resin, and the second layer B has a thermal conductivity. An inorganic paint having a temperature of 5×10-”cal/cm@sec*°C or higher is coated, and the third layer 9 is coated with an insulating paint such as an epoxy resin.
[実施例]
第3図に於ける磁器基体1として熱伝導率が10 X
l O−”cat/cmΦsec・℃のアルミナ系磁器
を用い、その表面にニクロム系抵抗皮膜2を着膜して形
成した抵抗体をレーザートリミング装置によりスパイラ
ル状4にトリミングする。[Example] The porcelain substrate 1 in FIG. 3 has a thermal conductivity of 10
Using alumina-based porcelain having a temperature of 1 O-'' cat/cmΦsec·°C, a resistor formed by depositing a nichrome-based resistance film 2 on its surface is trimmed into a spiral shape 4 using a laser trimming device.
上記、の抵抗素子を用い外装の第1N、第2層及び第3
層をそれぞ九表1に示す塗料を被覆した。Using the above resistance element, the 1N, 2nd and 3rd layers of the exterior
Each layer was coated with the paint shown in Table 1.
試料Nu 1は従来の外装であり試料Na 2及び試料
N13は本発明による外装である。Sample Nu 1 is a conventional packaging, and samples Na 2 and N13 are packagings according to the invention.
それぞれの試料にかかる電力がIWになるように電流を
流したときの各試料の表面温度を第4図に示す。FIG. 4 shows the surface temperature of each sample when a current was passed so that the power applied to each sample was IW.
表 1
[本発明の効果]
第4図で示すように本発明による抵抗器は従来の抵抗器
と比較し、抵抗器の中央部の表面温度が下がるため抵抗
皮膜の熱劣化が従来より減少する。従って抵抗値変化が
小さくなった。Table 1 [Effects of the present invention] As shown in Fig. 4, the resistor according to the present invention has a lower surface temperature in the center of the resistor than the conventional resistor, so thermal deterioration of the resistive film is reduced compared to the conventional resistor. . Therefore, the change in resistance value became smaller.
例えばトリミング前の抵抗値が100Ωの抵抗体を完成
抵抗値100にΩにトリミングした抵抗素子に1表1の
Nal+Na2及びN113の外装を行なった。For example, a resistor whose resistance value before trimming was 100 Ω was trimmed to a completed resistance value of 100 Ω, and the resistor element was coated with Nal+Na2 and N113 shown in Table 1.
各試料に周囲温度が70℃の環境で定格電力IWの負荷
を1000時間印可してその前後の抵抗値変化を測定し
たところ、試料Na lの抵抗値変化は÷0.45%で
あり試料Na2及び試料N113の抵抗値変化は+0.
18%及び+0.2%と極めて小さな値となった。When a load of rated power IW was applied to each sample for 1000 hours in an environment with an ambient temperature of 70°C and the change in resistance value before and after that was measured, the change in resistance value for sample Na1 was ÷0.45%, and the change in resistance value for sample Na2 was ÷0.45%. And the resistance value change of sample N113 was +0.
The values were extremely small at 18% and +0.2%.
第1図(A)及び(B)は固定皮膜抵抗器の構造図と断
面図。
第2図(A)及び(B)は(iil定皮膜抵抗器に電流
を流したときの表面温度。
第3図は本発明による固定皮膜抵抗器の断面図。
第4rXi(A)及び(B)は従夾の固定皮膜抵抗器と
本発明による固定皮膜抵抗器tこ定格電流を流したとき
の表面温度。
第111J乃至第4図を通じて図中の各符号はそれぞれ
r記のものを示す。
1: E!i器基体 2: 抵抗皮膜3: 帽子型端
子 4ニドリミング溝5: 外装 6: リード線
7: 外装に於ける第1層
8: 外装に於ける第211!
9: 外装に於ける第3M
第 1 図
Cl5)
第2図
(A)
CB)FIGS. 1(A) and 1(B) are a structural diagram and a sectional view of a fixed film resistor. Figures 2 (A) and (B) are the surface temperatures when a current is passed through the fixed film resistor. Figure 3 is a cross-sectional view of the fixed film resistor according to the present invention. ) is the surface temperature of the conventional fixed film resistor and the fixed film resistor according to the present invention when the rated current is applied.Throughout FIGS. 1: E!i device base 2: Resistance film 3: Cap-type terminal 4 Drimming groove 5: Exterior 6: Lead wire 7: 1st layer in the exterior 8: 211th layer in the exterior! 9: In the exterior 3M Figure 1 Cl5) Figure 2 (A) CB)
Claims (1)
装として、抵抗皮膜に外接する第1層にフェノール樹脂
またはポリイミド樹脂等の高分子塗料を被覆し第2層に
熱伝導率が5×10^−3^cal/cm・sec・℃
以上の無機系塗料を被覆し、第3層にエポキシ樹脂等の
絶縁塗料を被覆したことを特徴とする固定皮膜抵抗器。As a protective exterior for a resistor having a resistance film on the surface of a cylindrical porcelain substrate, the first layer circumscribing the resistance film is coated with a polymer paint such as phenol resin or polyimide resin, and the second layer has a thermal conductivity of 5×10. ^-3^cal/cm・sec・℃
A fixed film resistor characterized in that it is coated with the above inorganic paint and the third layer is coated with an insulating paint such as epoxy resin.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1124166A JPH02304901A (en) | 1989-05-19 | 1989-05-19 | Fixed film resistor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1124166A JPH02304901A (en) | 1989-05-19 | 1989-05-19 | Fixed film resistor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02304901A true JPH02304901A (en) | 1990-12-18 |
Family
ID=14878582
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1124166A Pending JPH02304901A (en) | 1989-05-19 | 1989-05-19 | Fixed film resistor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02304901A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5610572A (en) * | 1994-03-24 | 1997-03-11 | Ngk Insulators, Ltd. | Resistor element having a plurality of glass layers |
WO2019116814A1 (en) * | 2017-12-11 | 2019-06-20 | パナソニックIpマネジメント株式会社 | Chip resistor |
-
1989
- 1989-05-19 JP JP1124166A patent/JPH02304901A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5610572A (en) * | 1994-03-24 | 1997-03-11 | Ngk Insulators, Ltd. | Resistor element having a plurality of glass layers |
WO2019116814A1 (en) * | 2017-12-11 | 2019-06-20 | パナソニックIpマネジメント株式会社 | Chip resistor |
JPWO2019116814A1 (en) * | 2017-12-11 | 2020-12-17 | パナソニックIpマネジメント株式会社 | Chip resistor |
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