CN115985600A - Small-size surface-mounted circuit protection component and production method thereof - Google Patents
Small-size surface-mounted circuit protection component and production method thereof Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 239000000463 material Substances 0.000 claims abstract description 43
- 229920000642 polymer Polymers 0.000 claims abstract description 22
- 239000011241 protective layer Substances 0.000 claims abstract description 13
- 101000669528 Homo sapiens Tachykinin-4 Proteins 0.000 claims abstract 10
- OKUGPJPKMAEJOE-UHFFFAOYSA-N S-propyl dipropylcarbamothioate Chemical compound CCCSC(=O)N(CCC)CCC OKUGPJPKMAEJOE-UHFFFAOYSA-N 0.000 claims abstract 10
- 102100039365 Tachykinin-4 Human genes 0.000 claims abstract 10
- 239000002131 composite material Substances 0.000 claims description 29
- 229910052751 metal Inorganic materials 0.000 claims description 26
- 239000002184 metal Substances 0.000 claims description 26
- 239000011888 foil Substances 0.000 claims description 22
- 239000000919 ceramic Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 11
- 238000007747 plating Methods 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- -1 polytetrafluoroethylene Polymers 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 239000000805 composite resin Substances 0.000 claims description 8
- 239000011231 conductive filler Substances 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 239000000843 powder Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 238000007639 printing Methods 0.000 claims description 7
- 238000005520 cutting process Methods 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 239000000945 filler Substances 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 229920001577 copolymer Polymers 0.000 claims description 5
- 238000007731 hot pressing Methods 0.000 claims description 5
- 239000010410 layer Substances 0.000 claims description 5
- 229920001187 thermosetting polymer Polymers 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 238000005553 drilling Methods 0.000 claims description 4
- 238000009713 electroplating Methods 0.000 claims description 4
- 239000012467 final product Substances 0.000 claims description 4
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 claims description 4
- 239000011159 matrix material Substances 0.000 claims description 4
- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical compound [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 claims description 4
- 239000004645 polyester resin Substances 0.000 claims description 4
- 229920001225 polyester resin Polymers 0.000 claims description 4
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 4
- 238000005507 spraying Methods 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 238000010147 laser engraving Methods 0.000 claims description 3
- 229920000098 polyolefin Polymers 0.000 claims description 3
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 claims description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 2
- 239000006229 carbon black Substances 0.000 claims description 2
- 239000002041 carbon nanotube Substances 0.000 claims description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 2
- 229910052731 fluorine Inorganic materials 0.000 claims description 2
- 239000011737 fluorine Substances 0.000 claims description 2
- 229910021389 graphene Inorganic materials 0.000 claims description 2
- 239000012796 inorganic flame retardant Substances 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 229920001568 phenolic resin Polymers 0.000 claims description 2
- 239000005011 phenolic resin Substances 0.000 claims description 2
- 229920003192 poly(bis maleimide) Polymers 0.000 claims description 2
- 229920006122 polyamide resin Polymers 0.000 claims description 2
- 229920001721 polyimide Polymers 0.000 claims description 2
- 239000009719 polyimide resin Substances 0.000 claims description 2
- 229920001955 polyphenylene ether Polymers 0.000 claims description 2
- 238000002360 preparation method Methods 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 230000007613 environmental effect Effects 0.000 abstract description 6
- 239000000306 component Substances 0.000 description 18
- 239000000047 product Substances 0.000 description 16
- 239000004698 Polyethylene Substances 0.000 description 4
- 239000011162 core material Substances 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000007774 longterm Effects 0.000 description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- 239000002033 PVDF binder Substances 0.000 description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
- 239000008358 core component Substances 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000005543 nano-size silicon particle Substances 0.000 description 2
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 2
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 2
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QYMGIIIPAFAFRX-UHFFFAOYSA-N butyl prop-2-enoate;ethene Chemical compound C=C.CCCCOC(=O)C=C QYMGIIIPAFAFRX-UHFFFAOYSA-N 0.000 description 1
- 229920001688 coating polymer Polymers 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 229920006245 ethylene-butyl acrylate Polymers 0.000 description 1
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 1
- 229920006225 ethylene-methyl acrylate Polymers 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000004811 fluoropolymer Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000002277 temperature effect Effects 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
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Abstract
The invention relates to a small-size surface-mounted circuit protection component and a production method thereof, comprising the following parts: a flat plate-shaped insulating base material; the upper electrode and the lower electrode are respectively attached to the upper surface and the lower surface of the insulating base material; the upper electrode is composed of a left upper polar plate and a right upper polar plate which are respectively provided with 2-4 finger-shaped intersections and are mutually insulated; the lower electrode consists of a left lower polar plate and a right lower polar plate which are respectively arranged at two ends of the insulating base material; the left conductive film connects the left upper polar plate and the left lower polar plate together to form a left electrode, and the right conductive film connects the right upper polar plate and the right lower polar plate together to form a right electrode; a PPTC film made of polymer positive temperature coefficient material is attached to the finger-shaped cross region of the upper electrode to connect the left electrode and the right electrode together; the insulating protective layer is attached to the upper surface of the PPTC film. The invention is more suitable for product miniaturization, and the PPTC material is protected in the insulating protective layer and is not influenced by environmental factors, thus having better weather resistance.
Description
Technical Field
The invention belongs to the technical field of overcurrent protection electronic component materials, and particularly relates to a small-size surface-mounted circuit protection component and a production method thereof.
Background
The technology of the resistance temperature coefficient characteristic comprises a Polymer Positive Temperature Coefficient (PPTC), a Ceramic Positive Temperature Coefficient (CPTC) and a Negative Temperature Coefficient (NTC), has quick response to current and temperature, is mainly used for overcurrent and over-temperature protection, and can also be used for temperature switching and temperature indication. Therefore, the surface-mounted circuit protection component manufactured based on the technology is widely used in an overcurrent and overtemperature protection device of a circuit and is used in series in the circuit. The surface-mounted PTC over-current protection element at least comprises a PPTC material, an electrode and a conductive component and is prepared by a surface mounting process.
The core component of the protective element is a polymer conductive composite material (PPTC material) and an electrode connected with the PPTC material. The core component of the protection element is in a low-resistance state at room temperature, and an electronic circuit is in a path state; when the temperature rises or the circuit has a fault and large current, the resistance of the circuit jumps to thousands of times, and the circuit is protected. When the temperature recovers or the fault current is eliminated, the resistance of the protection element recovers to be normal.
The existing surface-mounted circuit protection component has larger size, relatively stable structure and mature process, the thermal process (such as temperature and stress of reflow soldering, coating thermosetting and injection molding) in assembly and application has smaller influence on the material and the structure of a product, and the influence of environmental factors such as temperature, humidity and the like in the environment is smaller, so that the performance and the long-term reliability of the surface-mounted circuit protection component are better.
However, due to the demand of the emerging market (emerging consumer electronics, wearable devices, integrated Circuits (ICs), overcurrent and overtemperature protection applications of power charging wires) for power and assembly space, the overcurrent protection element also tends to be smaller and thinner, the demand for small-sized protection devices is increasing, and the conventional package size of 1206, 0805 and the like is gradually unable to meet the application demand. However, small-sized components (such as 0603, 0402, 0201, and even 01005) cannot be realized if the design structure and processing technology similar to the large-sized components are adopted, the stability of the structure of the small-sized product is poor, and the thermal process (such as reflow soldering, coating thermosetting, and injection molding temperature) in assembly and application is easy to cause structural deformation, thereby affecting the performance of the product. Due to the relatively small size, the temperature and humidity of the product are also liable to affect the structure of the product and the material, thereby affecting the reliability of the product in long-term use.
Therefore, small-sized surface mount devices, which are processed based on the above techniques, have to solve three problems: the new structure is machinable; thermal stability problems of the structure; the influence of environmental factors causes the problem of product reliability.
Chinese patent document CN111640548a discloses a small-sized surface-mounted polymer PTC overcurrent protection device, which includes a PTC chip, an insulating layer, a terminal electrode, and at least one conductive element, wherein a first conductive electrode is divided into a gap to form a first conductive region and a second conductive region, and the conductive element is disposed at the edge or at least one corner of the first conductive region of the PTC chip; the dividing gap of the first conductive electrode includes a major portion parallel to the longitudinal direction of the first terminal electrode and the second terminal electrode. However, the PTC chip disclosed in the document is exposed to the environment and is not isolated from the external environment, so that the conductive characteristics of the PTC chip can be influenced by the influence of environmental factors such as temperature and humidity due to the adoption of some tungsten carbide and titanium carbide-like ceramic conductive materials, and further the conductive characteristics and reliability of the PPTC material can be influenced; moreover, this document is a conventional design, which cannot be achieved if a product of ultra small size (e.g. 0201, 01005) is made.
Chinese patent document CN111681845a discloses a surface-mounted overcurrent protection element, which includes at least one resistance positive temperature effect conductive composite material core material, and at least one surface of the core material is directly covered with a metal electrode; at least one conductive lead member having one end electrically connected to a portion of the core material and the other end electrically connected to a metal electrode; at least one part of the conductive composite material core material and one part of the conductive lead component are wrapped by plastic package and isolated from the external environment. However, this document is limited to the manufacturing process limitation in particular in the problem of downsizing of products, and cannot satisfy the manufacturing of small-sized 0402, 0201 and smaller-sized surface mount products.
Disclosure of Invention
The invention aims to provide a small-size surface-mounted circuit protection component and a preparation method thereof, which aim to solve the problems of structural thermal stability of a small-size protection product, long-term reliability reduction of the product due to the influence of environmental factors and the like.
The purpose of the invention is solved by adopting the following technical scheme.
The invention relates to a small-size surface-mounted circuit protection component, which comprises the following parts: a flat plate-shaped insulating base material; the upper electrode and the lower electrode are respectively attached to the upper surface and the lower surface of the insulating base material;
it is characterized in that the upper electrode is composed of a left upper polar plate and a right upper polar plate which are respectively provided with 2-4 finger-shaped intersections and are insulated with each other; the lower electrode consists of a left lower polar plate and a right lower polar plate which are respectively arranged at two ends of the insulating base material; the left conductive film connects the left upper polar plate and the left lower polar plate together to form a left electrode, and the right conductive film connects the right upper polar plate and the right lower polar plate together to form a right electrode; a PPTC film made of polymer positive temperature coefficient material is attached to the finger-shaped cross region of the upper electrode, and the left electrode and the right electrode are connected together to form a device with overcurrent and overtemperature protection functions; the insulating protective layer is attached to the upper surface of the PPTC film.
Preferably, the uncovered parts of the left upper polar plate and the right upper polar plate are provided with a left upper bonding pad and a right upper bonding pad, and the outer surfaces of the left lower polar plate and the right lower polar plate are provided with a left lower bonding pad and a right lower bonding pad.
Preferably, the insulating base material is made of an insulating composite resin or a ceramic sheet. The insulating composite resin is one or more of phenolic resin, epoxy resin, polyimide resin, polytetrafluoroethylene resin, bismaleimide triazine resin, thermosetting polyphenylene ether resin and polyester resin.
Preferably, the left upper polar plate, the right upper polar plate, the left lower polar plate and the right lower polar plate are all made of metal foils; the metal foil is copper foil or silver foil.
Preferably, the left conductive film and the right conductive film are planar, semi-circular hole-shaped, semi-elliptical hole-shaped, rectangular hole-shaped or square hole-shaped and are formed by metal plating layers.
The thickness of the PPTC film is 0.05-0.15 mm.
Preferably, the polymeric positive temperature coefficient material comprises a high molecular polymer matrix, and a conductive filler and a non-conductive filler which are dispersed in the high molecular polymer matrix; the high molecular polymer is more than two or more than two of crystalline or semi-crystalline polyolefin, ethylene-ester copolymer and fluorine-containing polymer; the conductive filler is one or more of carbon black, graphene powder, carbon nano tube micro powder and conductive ceramic powder; the non-conductive filler is a composition of nano silica and an inorganic flame-retardant filler. The polyolefin may be exemplified by polyethylene, polypropylene, or a copolymer of ethylene and propylene; the ethylene-ester copolymer may be exemplified by ethylene-vinyl acetate copolymer, ethylene-vinyl alcohol copolymer, ethylene-methyl acrylate copolymer, ethylene-ethyl acrylate copolymer, ethylene-acrylic acid copolymer, ethylene-butyl acrylate copolymer; the fluoropolymer may be, for example, polyvinylidene fluoride or ethylene/tetrafluoroethylene copolymer.
The insulating protective layer is made of epoxy resin, polyamide resin, polytetrafluoroethylene resin or polyester resin.
The invention relates to a method for producing a small-size surface-mounted circuit protection component, which is characterized by comprising the following steps of:
(1) The insulating composite resin or ceramic sheet is used as an insulating base material, and metal foils are adhered to the upper surface and the lower surface of the insulating base material in a hot pressing or bonding mode to form a composite sheet;
(2) The metal foil on the upper surface of the composite sheet is made into a left upper polar plate and a right upper polar plate which are respectively provided with 2-4 finger-shaped intersections and are mutually insulated by etching, laser engraving or mechanical cutting, and the metal foil on the lower surface of the composite sheet is separated into a left lower polar plate and a right lower polar plate;
(3) Sticking a PPTC film made of a polymer composite conductive material in a finger-shaped cross region of the upper electrode by a hot pressing or printing method, and conducting a left upper polar plate and a right upper polar plate through the PPTC film to form a device with overcurrent and overtemperature protection functions;
(4) Coating an insulating protective layer on the outer surface of the PPTC film in a printing or spraying mode, and curing the PPTC film on the PPTC film through heat or ultraviolet light;
(5) Respectively processing through holes at corresponding positions of the left end and the right end of the composite sheet in a drilling or stamping mode;
(6) Plating copper on the surface of the upper electrode which is not covered by the insulating protective layer, the surface of the lower electrode and the inner wall surfaces of the through holes on the left side and the right side respectively; a left conductive film is formed in the left through hole to connect the left upper polar plate and the left lower polar plate together to form a left electrode respectively, and a right conductive film is formed in the right through hole to connect the right upper polar plate and the right lower polar plate together to form a right electrode respectively;
(7) Continuously and respectively electroplating nickel tin or nickel gold on the copper plating surfaces of the upper electrode and the lower electrode to form an upper bonding pad and a lower bonding pad to obtain a composite board;
(8) And (4) cutting the composite board obtained in the step (7) according to a specified unit to obtain a final product.
Further, the order of completion of the step (5) and the steps (3-4) may be reversed.
Compared with the product structure in the prior art, the invention has the following advantages:
the small-size surface-mounted circuit protection component has the advantages that the current and the conductive direction are changed from a vertical structure to a horizontal structure, the small-size surface-mounted circuit protection component is more suitable for miniaturization and microminiaturization of products, and 0201 and smaller-size surface-mounted products can be produced; in addition, the polymer positive temperature coefficient material (PPTC material) in the product is protected in the insulating protective layer, is free from the influence of environmental factors, and has better weather resistance.
Drawings
Fig. 1 is a structural sectional view of a circuit protection device of the present invention.
Fig. 2 is an exploded view of the circuit protection device according to the present invention (upper and lower pads are omitted).
Fig. 3 is a structural combination diagram of the circuit protection device of the present invention (upper and lower pads are omitted).
Fig. 4 is a schematic structural diagram of the upper electrode of the present invention.
Fig. 5 is a schematic structural diagram of the lower electrode of the present invention.
Detailed Description
It should be understood by those skilled in the art that the present embodiment is only for illustrating the present invention and not for limiting the present invention, and the changes and modifications of the embodiment can be made within the scope of the claims of the present invention.
As shown in fig. 1-5. An ultra-small-size surface-mounted circuit protection component comprises the following parts: a flat plate-shaped insulating base material 1 made of an insulating composite resin or ceramic sheet; the upper electrode 2 and the lower electrode 3 are made of metal foils and are respectively attached to the upper surface and the lower surface of the insulating base material 1;
the upper electrode 2 is composed of a left upper polar plate 21 and a right upper polar plate 22 which respectively have 2-4 finger-shaped intersections 23 and are insulated from each other; the lower electrode 3 is composed of a left lower polar plate 31 and a right lower polar plate 32 which are respectively arranged at two ends of the insulating base material 1; the left conductive film 4 connects the left upper polar plate 21 and the left lower polar plate 31 together to form a left electrode respectively, and the right conductive film 5 connects the right upper polar plate 22 and the right lower polar plate 32 together to form a right electrode respectively;
a PPTC film 6 made of polymer positive temperature coefficient material is attached to the finger-shaped cross 23 area of the upper electrode 2, and the left electrode and the right electrode are connected together to form a device with overcurrent and overtemperature protection functions;
the insulating protective layer 7 is attached to the upper surface of the PPTC film 6, and the polymer positive temperature coefficient material is protected from the influence of the external environment, temperature, humidity and sensitive gas of the positive temperature coefficient material, so that the device is ensured to have better weather resistance;
left and right upper pads 81 and 82 are provided on the uncovered portions of the left and right upper plates 21 and 22, and left and right lower pads 91 and 92 are provided on the outer surfaces of the left and right lower plates 31 and 32.
Example 1
A small-size surface-mounted circuit protection component can be prepared by the following method:
(1) An insulating composite resin sheet is used as an insulating base material 1, a layer of roughened metal foil is respectively stacked on the upper surface and the lower surface of the insulating base material 1 to be used as an upper first conductive film and a lower first conductive film, the rough surfaces of the metal foils face inwards, and then the metal foils and the upper first conductive film are hot-pressed and compounded together to form a composite sheet;
(2) Removing the gaps on the metal foil on the upper surface of the composite sheet by etching, so that the metal foil becomes a left upper polar plate 21 and a right upper polar plate 22 which respectively have 2 finger-shaped intersections 23 and are insulated from each other; removing the middle part of the metal foil on the lower surface of the composite sheet as shown in fig. 5, so that the metal foil becomes a left lower polar plate 31 and a right lower polar plate 32 which are separated from each other left and right;
(3) Coating polymer positive temperature coefficient paint on the finger-shaped cross area of the upper electrode 2 in a printing mode, and then curing in a thermosetting mode to form a PPTC film 6 with the thickness of 0.05mm, wherein the PPTC film is used for conducting a left upper polar plate and a right upper polar plate through the PPTC film, so that a device with overcurrent and overtemperature protection functions is formed; the polymer positive temperature coefficient material is prepared from crystalline polyethylene, tungsten carbide conductive ceramic powder filler dispersed in the polyethylene, nano silicon dioxide and aluminum hydroxide flame-retardant filler;
(4) Epoxy resin insulation protective layers 7 are formed on the left side, the right side and the upper surface of the PPTC film 6 in a printing or spraying mode, and the PPTC film 6 is wrapped and protected;
(5) Respectively processing elongated through holes at corresponding positions of the left end and the right end of the composite sheet in a drilling or stamping mode;
(6) Plating copper on the parts of the surfaces of the left upper polar plate 21 and the right upper polar plate 22 which are not covered, the surfaces of the left lower polar plate 31 and the right lower polar plate 32, and the inner wall surfaces of the through holes on the left side and the right side respectively; a left conductive film 4 is formed in the left through hole to connect the left upper polar plate 21 and the left lower polar plate 31 together to form a left electrode respectively, and a right conductive film 5 is formed in the right through hole to connect the right upper polar plate 22 and the right lower polar plate 32 together to form a right electrode respectively;
(7) Continuously electroplating nickel tin or nickel gold on the copper plating surfaces of the left upper polar plate 21, the left lower polar plate 31, the right upper polar plate 22 and the right lower polar plate 32 to form an upper bonding pad and a lower bonding pad, so as to obtain a composite plate;
(8) And (4) cutting the composite board obtained in the step (7) according to a specified unit to obtain a final product.
Example 2
A small-size surface-mounted circuit protection component can be prepared by the following method:
(1) The method comprises the following steps of (1) taking an insulating ceramic sheet as an insulating base material 1, and attaching metal foils to the upper surface and the lower surface of the insulating base material 1 in a thermal bonding mode to form a composite sheet;
(2) Removing gaps on the metal foil on the upper surface of the composite sheet material in a laser engraving manner, wherein the gaps are shown in the part shown in figure 4, so that the metal foil becomes a left upper polar plate 21 and a right upper polar plate 22 which respectively have 3 finger-shaped intersections 23 and are mutually insulated; removing the middle part of the metal foil on the lower surface of the composite sheet as shown in fig. 5, so that the metal foil becomes a left lower polar plate 31 and a right lower polar plate 32 which are separated from each other left and right;
(3) Respectively processing oval through holes at corresponding positions of the left end and the right end of the composite sheet in a drilling or stamping mode;
(4) A film made of polymer positive temperature coefficient coating is divided into specified sizes and shapes, and then the film is attached to the finger-shaped cross 23 area of the upper electrode 2 in a hot pressing mode to form a PPTC film 6 with the thickness of 0.10mm, and the PPTC film is used for conducting a left upper polar plate and a right upper polar plate through the PPTC film, so that a device with overcurrent and overtemperature protection functions is formed; the polymer positive temperature coefficient material is prepared from crystalline polyvinylidene fluoride, titanium carbide (TiC) conductive ceramic powder filler dispersed in polyethylene, nano silicon dioxide and aluminum hydroxide flame-retardant filler;
(5) Epoxy resin insulation protective layers 7 are formed on the left side, the right side and the upper surface of the PPTC film 6 in a printing or spraying mode, and the PPTC film 6 is wrapped and protected;
(6) Plating copper on the parts of the surfaces of the left upper polar plate 21 and the right upper polar plate 22 which are not covered, the surfaces of the left lower polar plate 31 and the right lower polar plate 32, and the inner wall surfaces of the through holes on the left side and the right side respectively; a left conductive film 4 is formed in the left through hole to connect the left upper polar plate 21 and the left lower polar plate 31 together to form a left electrode respectively, and a right conductive film 5 is formed in the right through hole to connect the right upper polar plate 22 and the right lower polar plate 32 together to form a right electrode respectively;
(7) Continuously and respectively electroplating nickel tin or nickel gold on the copper plating surfaces of the left upper polar plate 21, the left lower polar plate 31, the right upper polar plate 22 and the right lower polar plate 32 to form an upper bonding pad and a lower bonding pad to obtain a composite plate;
(8) And (4) cutting the composite board obtained in the step (7) according to a specified unit to obtain a final product.
Claims (10)
1. A small-size surface-mounted circuit protection component comprises the following parts: a flat plate-shaped insulating base material; the upper electrode and the lower electrode are respectively attached to the upper surface and the lower surface of the insulating base material; it is characterized in that the preparation method is characterized in that,
the upper electrode is composed of a left upper polar plate and a right upper polar plate which are respectively provided with 2-4 finger-shaped intersections and are mutually insulated; the lower electrode consists of a left lower polar plate and a right lower polar plate which are respectively arranged at two ends of the insulating base material; the left conductive film connects the left upper polar plate and the left lower polar plate together to form a left electrode, and the right conductive film connects the right upper polar plate and the right lower polar plate together to form a right electrode; a PPTC film made of polymer positive temperature coefficient material is attached to the finger-shaped cross region of the upper electrode, and the left electrode and the right electrode are connected together; the insulating protective layer is attached to the upper surface of the PPTC film.
2. A small-sized surface-mounted circuit protection component as claimed in claim 1, wherein a left upper pad and a right upper pad are provided on the uncovered surface of said upper electrode, and a left lower pad and a right lower pad are provided on the surface of said lower electrode.
3. A small-sized surface-mounted circuit protection component as claimed in claim 1, wherein said insulating base material is made of an insulating composite resin or ceramic sheet.
4. A small-sized surface-mounted circuit protection component as claimed in claim 3, wherein said insulating composite resin is one or more of phenolic resin, epoxy resin, polyimide resin, polytetrafluoroethylene resin, bismaleimide triazine resin, thermosetting polyphenylene ether resin, and polyester resin.
5. A small-sized surface-mounted circuit protection component as claimed in claim 1, wherein said upper and lower electrodes are formed of metal foil; the left conductive film and the right conductive film are planar, semi-circular hole-shaped, semi-elliptical hole-shaped, rectangular hole-shaped or square hole-shaped and are formed by metal plating layers.
6. The small-sized surface-mounted circuit protection component as claimed in claim 1, wherein the thickness of the PPTC film is 0.05-0.15 mm.
7. A small-sized surface-mounted circuit protection component as claimed in claim 1, wherein said polymeric positive temperature coefficient material comprises a high molecular polymer matrix, conductive fillers and non-conductive fillers dispersed in said high molecular polymer matrix; the high molecular polymer is one or more than two of crystalline or semi-crystalline polyolefin, ethylene-ester copolymer and fluorine-containing polymer; the conductive filler is one or more of carbon black, graphene powder, carbon nano tube micro powder and conductive ceramic powder; the non-conductive filler is a composition of nano silica and an inorganic flame-retardant filler.
8. A small-sized surface-mounted circuit protection component as claimed in claim 1, wherein said insulating protection layer is made of one or more of epoxy resin, polyamide resin, polytetrafluoroethylene resin or polyester resin.
9. A method for manufacturing a small-sized surface-mount circuit protection component according to any one of claims 1 to 8, comprising the steps of:
(1) The insulating composite resin or ceramic sheet is used as an insulating base material, and metal foils are adhered to the upper surface and the lower surface of the insulating base material in a hot pressing or bonding mode to form a composite sheet;
(2) The metal foil on the upper surface of the composite sheet is made into a left upper polar plate and a right upper polar plate which are respectively provided with 2-4 finger-shaped intersections and are mutually insulated by etching, laser engraving or mechanical cutting, and the metal foil on the lower surface of the composite sheet is separated into a left lower polar plate and a right lower polar plate;
(3) Sticking a PPTC film made of a polymer composite conductive material on the finger-shaped cross region of the upper electrode by a hot pressing or printing method;
(4) Coating an insulating protective layer on the outer surface of the PPTC film in a printing or spraying mode, and curing the PPTC film on the PPTC film through heat or ultraviolet light;
(5) Respectively processing through holes at corresponding positions of the left end and the right end of the composite sheet in a drilling or stamping mode;
(6) Plating copper on the surface of the upper electrode which is not covered by the insulating protective layer, the surface of the lower electrode and the inner wall surfaces of the through holes on the left side and the right side respectively; a left conductive film is formed in the left through hole to connect the left upper polar plate and the left lower polar plate together to form a left electrode respectively, and a right conductive film is formed in the right through hole to connect the right upper polar plate and the right lower polar plate together to form a right electrode respectively;
(7) Continuously and respectively electroplating nickel tin or nickel gold on the copper plating surfaces of the upper electrode and the lower electrode to form an upper bonding pad and a lower bonding pad to obtain a composite board;
(8) And (4) cutting the composite board obtained in the step (7) according to a specified unit to obtain a final product.
10. The production method according to claim 9, wherein the completion order of the step (5) and the steps (3-4) is reversed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111204800.1A CN115985600A (en) | 2021-10-15 | 2021-10-15 | Small-size surface-mounted circuit protection component and production method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111204800.1A CN115985600A (en) | 2021-10-15 | 2021-10-15 | Small-size surface-mounted circuit protection component and production method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN115985600A true CN115985600A (en) | 2023-04-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111204800.1A Pending CN115985600A (en) | 2021-10-15 | 2021-10-15 | Small-size surface-mounted circuit protection component and production method thereof |
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| Country | Link |
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| CN (1) | CN115985600A (en) |
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- 2021-10-15 CN CN202111204800.1A patent/CN115985600A/en active Pending
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