1260846 玖、發明說明： 一、 發明所屬之技術領域 本發明係關於一種過電流保護元件，特別是關於一種可 提南工作電流之過電流保護元件。 二、 先前技術 ^ 知之正溫度係數（Positive Temperature Coefficient， PTC ) 7C件之電阻值對溫度變化的反應相當敏銳。當PTC 元件於正常使用狀況時，其電阻可維持極低值而使電路得 以正常運作。但是當發生過電流或過高溫的現象而使溫度 上升至一臨界溫度時，其電阻值會瞬間彈跳至一高電阻狀 一（例如10 ohm以上）而將過量之電流反向抵銷，以達到 保護電池或電路元件之目的。因此該PTC元件已見整合於 各式電路元件中，以防止過電流的損害。 <專、充之過笔/;,L保濩元件係包含一電流感測元件及兩印刷 電路私層板（Pre_preg，p/p)。該印刷電路積層板係利用壓 合製程疊設於該電流感測元件之表面，作為該電流感測元 牛之外。[M呆濩材料，以防止水氣滲入或刮傷，且亦具絕緣 的效果。 般义印刷電路積層板之玻璃轉換溫度（glass switching $⑽咖代’ Tg)約在130至140°C之間5而所謂高Tg之 P刷電路積層板之玻璃轉換溫度則約在17(M8(TC之間。印 路積層板在與過電流保護元件壓合時需一併考慮印刷 i路積層板之固化所需溫度，故壓合之製程溫度必需大於 i路積層板之玻螭轉換溫度約30-50°C之間。然而，此 R &她1卜她_咖4 d〇c 1260846 高熱製程將使得電流感測元 千中之咼分子正溫度係數材料 膨脹變形’甚至於印刷電路 电峪積層板的表面產生皺折，進而 影響到過電流保護元件的最 刃取、冬尺寸。另外，過電流保讀元 件經高熱壓合後，1當能+ ，、吊心兒阻值往往彈升至壓合前的 倍以上，而大幅限制其應用範圍。 此外’過電流保護元件的使料因應未來元件設計之微 小化趨勢’使得元件的散熱變成一重要的設計考量因子。 傳統印刷電路積層板的散熱料約在㈣.5戰,， 其並：法有效散熱’因而降低過電流保護元件之使用壽命 及可#度。因&，^：可提高印刷電路積層板 即可使得過電流保護元件呈有更，'、、遣辜 又。丨卞_男更铋疋的性能，且可擴大並 應用範圍。 〃 三、發明内容 本發明之目的係提供—種過電流保護元件，其可減低於 壓合製程前後的電阻彈升率，且增進元件的散熱效率以提 南工作電流，進而擴大其應用範圍。 分別疊設於該電流感測元件之上、下表面 為達到上述目的，本發明揭示一種過電流保護元件，其 包含一電流感測元件、兩絕緣層及兩電極層。該電流感測 元件包含兩電極落及一疊設於該兩電極間之電流感測 層。該電流感測層係由正溫度係數材料組成。該兩絕緣層 且其玻璃轉換 溫度介於9(M20°C或散熱效率介於1-7W/〇C ,。該兩電極 層分別連接於該電流感測元件之兩端。 該兩電極層一般係由銅金屬、鋁金屬或鋁鋼合金組成， a ^W〇m\H(^4 doc 1260846 其較易產生氧化作用。該過 罢受认分二+， 又几彳千」另包含兩分別 十復於，亥兩％極層表面之銲接 文电往嘈其係由較不易氧化 之錫錯合金或錫金屬組成， 刁防止，亥兩電極層與外界直接 接觸而氧化。 四、實施方式 請參照圖i及圖2,目i係本發明之第一較佳實施例之 過電流保護元件10之立體示意圖，而圖2則為圖丨中沿 1-1剖面線之剖面圖。該過電流保護元件1〇包含一電漭感 測元件13、兩絕緣層14、兩防銲劑（s〇lderMask，s/M) 層15及兩電極層16。該電流感測元件13係由一電流感測 層U豐設於兩電極箔12之間組成，其中該電流感測層i i 係採用高分子正溫度係數材料。該絕緣層14可由印刷電路 積層板、樹脂（resin )或環氧塑膠（epoxy )組成，且其玻 璃轉換溫度係介於90-120°C。該兩電極層16分置於該電流 感測元件1 3、兩絕緣層14及兩防銲劑層1 5的左右兩端。 相較於習知之過電流保護元件之絕緣層，本發明之該過 電流保護元件1 〇之絕緣層14之玻璃轉換溫度較低，故於 進行壓合製程時對過電流保護元件1 〇所造成的尺寸改變 較小，且可降低壓合前後之電阻彈升率。 參照表一，經由測試發現，本發明之過電流保護元件10 (具有較低玻璃轉換溫度之絕緣層）之電阻值較低，也就 是說可提供較大的工作電流。 表- __ —_ 元件尺寸過電流保護_ H MuMvs>!if； ΐ>ί\Η6884\86Κ84 doc 1260846 本發明 (90°C <Tg<120°C ) 習知 (130°C <Tg<140°C ) 0603 1.07 1.31 0805 1.01 1.30 1206 1.00 1.22 過電流保護元件的散逸功率（p〇wer Dissipatl〇n，pd ) 可以下列通式表不：Pd:I2R，其中為工作電流，R為電 阻值◦由上述通式可知，當散逸功率愈高，工作電流愈高。 就物理意義而t，較佳的散熱效率可將因高電流所產生的 高熱快速散發。即具有較大的散逸功率，其相當於可增加 元件於觸發（tnP)前對於電流的承受度。因此，具有較高 散熱效率之過電流保護元件亦可應用於較大工作： 況。 j 將該過電流保護元件10之絕 <、、巴、、彖層14選用散裁 l-7W/°C-m之印刷電路積層板 …、迓羊J万； 、 树肊或環氧塑膠，並舍-私 測試結果如表二所示。由表二可知 ’'、貝于、 功率均較習知者為高。 ㈢之工作電流及散逸 元件尺寸0805 元件10Γ豆古鈐古搿為L十―、口’本發明之過電流保護 兀件10 (具有較问政熱效率之絕緣屑 又1260846 BRIEF DESCRIPTION OF THE INVENTION 1. Field of the Invention The present invention relates to an overcurrent protection component, and more particularly to an overcurrent protection component that can extract current from a working current. Second, the prior art ^ Know the positive temperature coefficient (PTC) 7C parts of the resistance value is very sensitive to temperature changes. When the PTC component is in normal use, its resistance can be maintained at a very low value to allow the circuit to function properly. However, when an overcurrent or overheating occurs and the temperature rises to a critical temperature, the resistance value will instantaneously bounce to a high resistance (for example, 10 ohm or more) and the excess current is reversely offset to achieve The purpose of protecting batteries or circuit components. Therefore, the PTC element has been integrated into various circuit components to prevent damage from overcurrent. <Specialized, overfilled/; L-protected components include a current sensing component and two printed circuit private boards (Pre_preg, p/p). The printed circuit laminate is stacked on the surface of the current sensing element by a pressing process as the current sensing element. [M is a dull material to prevent moisture from infiltrating or scratching, and also has an insulating effect. The glass transition temperature (glass switching $(10)Cai 'Tg) of the printed circuit laminate is about 130 to 140 ° C. The so-called high Tg P brush circuit laminate has a glass transition temperature of about 17 (M8). (Between TC. When the printed circuit board is pressed with the overcurrent protection component, the temperature required for curing the printed i-layer laminate should be considered together, so the process temperature of the press-fit must be greater than the glass transition temperature of the i-layer laminate. Between 30-50 ° C. However, this R & her 1 Bu _ _ 4 d 〇 c 1260846 high heat process will make the current sensing element 千 咼 molecular positive temperature coefficient material expansion deformation 'even the printed circuit Wrinkles are formed on the surface of the electro-deposited laminate, which affects the most advanced and winter size of the overcurrent protection component. In addition, after the overcurrent protection component is pressed by high heat, 1 can be +, and the value of the suspension is It often rises to more than double the pressure before pressing, and greatly limits its application range. In addition, the 'interference of overcurrent protection components in response to the trend of miniaturization of future component design' makes the heat dissipation of components become an important design consideration factor. Traditional printed circuit Laminated plate It is expected to be in (4).5, and its: effective heat dissipation' thus reduces the service life of the overcurrent protection component and can be #度. Because &, ^: can improve the printed circuit laminate to make the overcurrent protection component There are more, ',, and 辜 丨卞 男 _ male more 铋疋 performance, and can be expanded and applied. 〃 Third, the invention The object of the present invention is to provide an overcurrent protection component, which can be reduced below The resistance rise rate before and after the manufacturing process, and the heat dissipation efficiency of the component is increased to boost the working current of the device, thereby expanding the application range. The above and the lower surface of the current sensing element are respectively stacked to achieve the above purpose, and the present invention discloses a The current protection component comprises a current sensing component, two insulating layers and two electrode layers. The current sensing component comprises two electrodes and a current sensing layer stacked between the two electrodes. The current sensing layer It consists of a positive temperature coefficient material. The two insulating layers have a glass transition temperature of 9 (M20 ° C or heat dissipation efficiency of 1-7 W/〇C. The two electrode layers are respectively connected to the two current sensing elements. The end The electrode layer is generally composed of copper metal, aluminum metal or aluminum steel alloy, a ^W〇m\H (^4 doc 1260846, which is more prone to oxidation. This is recognized by two +, several thousand) It consists of two kinds of solder joints, which are composed of two layers of the surface of the two layers, which are composed of tin alloy or tin metal which is less susceptible to oxidation, and which prevents the two electrode layers from being directly in contact with the outside and oxidized. 1 and 2 are a perspective view of an overcurrent protection device 10 according to a first preferred embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along line 1-1 of the figure. The overcurrent protection component 1 includes an electrical sensing component 13, two insulating layers 14, two solder resist layers s/M, and two electrode layers 16. The current sensing element 13 is composed of a current sensing layer U between the two electrode foils 12, wherein the current sensing layer i is made of a polymer positive temperature coefficient material. The insulating layer 14 may be composed of a printed circuit laminate, resin or epoxy, and has a glass transition temperature of 90-120 °C. The two electrode layers 16 are disposed on the left and right ends of the current sensing element 13 and the two insulating layers 14 and the two solder resist layers 15. Compared with the conventional insulating layer of the overcurrent protection component, the insulating layer 14 of the overcurrent protection component 1 of the present invention has a low glass transition temperature, so that the overcurrent protection component 1 is caused during the pressing process. The dimensional change is small and the resistance rise rate before and after the pressing can be reduced. Referring to Table 1, it has been found through testing that the overcurrent protection element 10 (insulation layer having a lower glass transition temperature) of the present invention has a lower resistance value, that is, a larger operating current can be supplied. Table - __ -_ Component size overcurrent protection _ H MuMvs>!if;ΐ> ί\Η6884\86Κ84 doc 1260846 The present invention (90 ° C < Tg < 120 ° C) Conventional (130 ° C < Tg < 140°C ) 0603 1.07 1.31 0805 1.01 1.30 1206 1.00 1.22 The dissipation power of the overcurrent protection component (p〇wer Dissipatl〇n, pd ) can be expressed by the following formula: Pd: I2R, where is the operating current, R is the resistance value From the above formula, the higher the dissipation power, the higher the operating current. In terms of physical meaning, the better heat dissipation efficiency can quickly dissipate the high heat generated by the high current. That is, it has a large dissipation power, which is equivalent to increasing the tolerance of the component to the current before the trigger (tnP). Therefore, overcurrent protection components with higher heat dissipation efficiency can also be applied to larger operations: j The layer 14 of the overcurrent protection element 10 is selected from the printed circuit laminate of l-7W/°Cm, the 迓 sheep Jwan; the tree 肊 or the epoxy plastic, and The results of the house-private test are shown in Table 2. It can be seen from Table 2 that '', Beiyu, and power are higher than those of the prior art. (3) Working current and dissipating component size 0805 component 10 Γ 钤 古 古 古 L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L L
電阻（ohm) 元件 本發明 —----------〜__ 0.248 習知 0,5W/°r —-------------------二一、 0.245 科忮中 ;^86SH4\86884.doc 1260846 工作電流（A) 1.10 0.95 散逸功率（W) 0.66 0.54 圖3係本發明之第二較佳實施例之過電流保護元件 之示意圖。該過電流保護元件3〇包含一電流感測元件33、 兩絕緣層34、兩防銲劑層35、兩電極層36及兩銲接電極 層37。該電流感測元件33係由一電流感測層3】疊設於兩 電極箔32之間形成，其中該電流感測層3 1係採用高分子 正溫度係數材料。該絕緣層34可由玻璃轉換溫度介於 9〇-120°C或散熱效率介於uw/它,之印刷電路積層板、 树脂、環氧塑膠組成。該兩電極層36分置於該電流感測元 件33、兩絕緣層34及兩防銲劑層35的左右兩端。該兩銲 接電極層37罩覆於該電極層36之表面，用以外接導線（未 圖示）連接。 該過電流保護元件30相較於圖2之過電流保護元件 1 0，相當於增加兩銲接電極層3 7於該電極層3 6之表面。 為增加導電性，一般之電極層36係由銅金屬、鋁金屬及鋁 鋼合金組成。若由該電極層36直接銲接導線，將使得該電 極層36暴露於外界而可能發生氧化。該銲接電極層”係 由杈不易氧化之錫鉛合金或錫金屬組成，藉由其罩覆於該 電極層36表面，以防止該電極層36與外界直接接觸。 本發明之技術内容及技術特點已揭示如上，然而熟系本 項 背 及揭示而作種種不 本發明之保護範圍 技術之人士仍可能基於本發明之教示 離本發明精神之替換及修飾。因此， 滞科技中說\86884\86884 doc 1260846 應不限於實施例所揭示者，而應包括各種不背離本發明之 替換及修飾，並為以下之申請專利範圍所涵蓋。 五、圖式簡要說明 圖 係本發明之第— 體圖 較佳實施例之過電流保護元件之立 圖2係圖1中沿 圖3係本發明之 意圖。 六、元件符號說明 -剖面線之剖面圖；以及 第一較佳實施例之過電流保護元件之示Resistance (ohm) component of the present invention -----------~__ 0.248 Conventional 0, 5W / °r --------------------- 1. 0.245 忮 中; ^86SH4\86884.doc 1260846 Operating Current (A) 1.10 0.95 Dissipated Power (W) 0.66 0.54 FIG. 3 is a schematic diagram of an overcurrent protection element according to a second preferred embodiment of the present invention. The overcurrent protection element 3A includes a current sensing element 33, two insulating layers 34, two solder resist layers 35, two electrode layers 36, and two solder electrode layers 37. The current sensing element 33 is formed by stacking a current sensing layer 3 between the two electrode foils 32. The current sensing layer 31 is made of a polymer positive temperature coefficient material. The insulating layer 34 may be composed of a glass transition temperature of 9 〇 - 120 ° C or a heat dissipation efficiency of uw / it, a printed circuit laminate, a resin, and an epoxy plastic. The two electrode layers 36 are disposed on the left and right ends of the current sensing element 33, the two insulating layers 34 and the two solder resist layers 35. The two soldering electrode layers 37 are overlaid on the surface of the electrode layer 36, and are connected by an external lead (not shown). The overcurrent protection component 30 corresponds to the overcurrent protection component 10 of FIG. 2, which corresponds to the addition of two solder electrode layers 37 to the surface of the electrode layer 36. In order to increase conductivity, the electrode layer 36 is generally composed of a copper metal, an aluminum metal, and an aluminum steel alloy. If the wire is directly soldered by the electrode layer 36, the electrode layer 36 will be exposed to the outside and oxidation may occur. The solder electrode layer is composed of a tin-lead alloy or tin metal which is not easily oxidized, and is covered on the surface of the electrode layer 36 to prevent the electrode layer 36 from directly contacting the outside. The technical content and technical features of the present invention It is to be understood that those skilled in the art, without departing from the scope of the invention, may be substituted and modified in the spirit of the present invention based on the teachings of the present invention. Therefore, in the technology, \86884\86884 Doc 1260846 is not limited to the embodiments disclosed, but includes various alternatives and modifications that do not depart from the invention, and is covered by the following claims. V. Brief description of the drawings is the first embodiment of the present invention. Figure 2 is an illustration of the overcurrent protection device of the preferred embodiment. Figure 3 is a schematic view of the present invention along the line of Figure 3. VI. Description of the elements - a cross-sectional view of the section line; and the overcurrent protection element of the first preferred embodiment Show
30 32 過電流保護元件 電極箔 31 電流感測層 34 絕緣層 33 電流感測元件 36 電極層 35 防銲劑層 37 ~接電極層30 32 Overcurrent protection element Electrode foil 31 Current sensing layer 34 Insulation layer 33 Current sensing element 36 Electrode layer 35 Solder resist layer 37 ~ Electrode layer
rf\HuUys''欠科技中說伽884\_84 d沉 -10-Rf\HuUys''Under technology, said gamma 884\_84 d sinking -10-