JPH02292848A - Formation of polyimide film for lead frame - Google Patents
Formation of polyimide film for lead frameInfo
- Publication number
- JPH02292848A JPH02292848A JP11391089A JP11391089A JPH02292848A JP H02292848 A JPH02292848 A JP H02292848A JP 11391089 A JP11391089 A JP 11391089A JP 11391089 A JP11391089 A JP 11391089A JP H02292848 A JPH02292848 A JP H02292848A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- film
- lead frame
- die pad
- polyimide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920001721 polyimide Polymers 0.000 title claims abstract description 42
- 230000015572 biosynthetic process Effects 0.000 title description 2
- 239000009719 polyimide resin Substances 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims abstract description 8
- 239000007788 liquid Substances 0.000 claims abstract description 6
- 238000010438 heat treatment Methods 0.000 claims abstract description 4
- 239000011347 resin Substances 0.000 abstract description 16
- 229920005989 resin Polymers 0.000 abstract description 16
- 238000007789 sealing Methods 0.000 abstract description 12
- 238000010521 absorption reaction Methods 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 2
- 238000010008 shearing Methods 0.000 abstract description 2
- 230000006835 compression Effects 0.000 abstract 1
- 238000007906 compression Methods 0.000 abstract 1
- 239000006185 dispersion Substances 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000013464 silicone adhesive Substances 0.000 description 3
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、樹脂封止型パッケージで用いられるリードフ
レームのポリイミド被膜形成方法に関する．
従来の技術
樹脂封止型パッケージに使用するリードフレームは、鉄
とニッケルの合金，銅系の合金などが用いられている．
そしてリードフレームは、半導体チップを固着するダイ
パッドと、半導体チップの電気信号入出力端子を金属細
線で接続するインナーリードと、パッケージ実装部分と
電気的接続を行う，インナーリードの延長部であるアウ
ターリードとから構成される。インナーリードの先端部
とダイバッドの表面は、金属細線でワイヤーをボンディ
ングしたり，半導体チップを固着したりするために、金
もしくは銀の１〜５μｍ程度のメッキがほどこされてい
るが、ダイパッド裏面は，何もほどこされていないか、
ポリイミド樹脂をボツティングして硬化されていたり、
ポリイミド樹脂シートをダイパッド裏面にシリコーン接
着剤で接着されていたりする。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for forming a polyimide film on a lead frame used in a resin-sealed package. Conventional technology Lead frames used in resin-sealed packages are made of iron-nickel alloys, copper-based alloys, etc.
The lead frame consists of a die pad that fixes the semiconductor chip, an inner lead that connects the electrical signal input/output terminals of the semiconductor chip with thin metal wires, and an outer lead that is an extension of the inner lead that makes electrical connection to the package mounting part. It consists of The tips of the inner leads and the surface of the die pad are plated with gold or silver approximately 1 to 5 μm in thickness for bonding wires with thin metal wires and fixing semiconductor chips, but the back surface of the die pad is plated with gold or silver to a thickness of 1 to 5 μm. ，Nothing has been done,
It is hardened by bottling polyimide resin,
A polyimide resin sheet is bonded to the back of the die pad with silicone adhesive.
このような構造をしたリードフレームが封止樹脂中に半
導体チップや金属細線と一緒に封じ込まれる．
発明が解決しようとする課題
従来の構造のダイ．パッドを有するリードフレームで樹
脂封止型パッケージを形成した場合において，
ダイパッド裏面に何もほどこさないものは、線膨張係数
の違い（鉄ニッケル合金”−５Ｘ１０−’／℃封止樹脂
’−２Ｘ１０−’／’Ｃ）から、熱衝撃によりダイパッ
ド裏面と封止樹脂界面の剥離を誘発し、高温多湿、吸湿
後熱衝撃の環境で不良発生の原因となる．
ダイパッド裏面にポリイミド樹脂をポッティングして硬
化させたものは、被膜の膜厚が不均一になるため、残留
応力分布も不均一になり、ダイパッド裏面とポリイミド
被膜との界面で剥離を誘発し、高温多湿、吸湿後熱衝撃
の環境で不良発生の原因となる．
さらに、ポリイミド樹脂シートをダイバッド裏面にシリ
コーン接着剤で接着したものは、高温多湿環境でダイパ
ッドとポリイミド樹脂間のシリコーン接着剤が吸湿し、
不良発生の原因となる。A lead frame with this structure is encapsulated together with a semiconductor chip and thin metal wires in a sealing resin. Problems to be Solved by the Invention Dies with conventional structure. When a resin-sealed package is formed using a lead frame with a pad, the difference in linear expansion coefficient (iron-nickel alloy"-5X10-'/℃ sealing resin'-2X10 -'/'C), thermal shock induces separation between the back surface of the die pad and the sealing resin interface, causing defects in environments of high temperature, high humidity, and thermal shock after moisture absorption.Potting polyimide resin on the back surface of the die pad When cured, the thickness of the coating becomes uneven, resulting in uneven residual stress distribution, which induces peeling at the interface between the back surface of the die pad and the polyimide coating. In addition, when a polyimide resin sheet is bonded to the back of the die pad with silicone adhesive, the silicone adhesive between the die pad and the polyimide resin absorbs moisture in a high-temperature and humid environment.
This may cause defects.
以上のようにいずれの場合も樹脂封止型パッケージにお
いて不良発生のおそれがある。As described above, in either case, there is a risk of defects occurring in the resin-sealed package.
本発明は上記問題を解決するもので、吸湿による不良発
生のおそれがない樹脂封止型パッケージを得ることので
きるリードフレームのポリイミド被膜形成方法を提供す
ることを目的とするものである。The present invention is intended to solve the above-mentioned problems, and aims to provide a method for forming a polyimide film on a lead frame, which makes it possible to obtain a resin-sealed package that is free from defects due to moisture absorption.
課厘を解決するための手段
上記問題を解決するために本発明は、被膜形成型のキャ
ビティに液状のポリイミド樹脂を流し込み，その上にリ
ードフレームを、ダイパッド裏面が上記ポリイミド樹脂
上に接触するようにセットし，加熱により上記ポリイミ
ド樹脂を硬化させてポリイミド被膜を形成するものであ
る。Means for Solving the Problems In order to solve the above problems, the present invention pours liquid polyimide resin into the cavity of a film forming mold, and places a lead frame on top of it so that the back surface of the die pad is in contact with the polyimide resin. The polyimide resin is cured by heating to form a polyimide film.
作用
上記構成により、ダイバソド裏面に均一な膜厚のポリイ
ミド被膜を形成できて被膜中の残留応力が小さくなると
ともに，ポリイミド被膜を介してダイバッド裏面と封止
樹脂とが密着してダイバッドと封止樹脂との間に生ずる
、剪断、圧縮、引張り応力の分散と緩和を実現できて剥
離が防止される．
実施例
以下に本発明の一実施例に係るリードフレームのポリイ
ミド被膜形成法について第１図、第２図を参照して説明
する．
第１図（ａ）〜（ｄ）は、ポリイミド樹脂を用いてダイ
パッドの裏面に，被膜形成型で被膜を形成する手順を記
す。Effect: With the above configuration, a polyimide film with a uniform thickness can be formed on the back surface of the die pad, reducing residual stress in the film, and the back surface of the die pad and the sealing resin are in close contact with each other through the polyimide film, so that the die pad and the sealing resin are tightly bonded. It is possible to disperse and alleviate the shear, compressive, and tensile stress that occurs between the two and prevent peeling. EXAMPLE A method for forming a polyimide film on a lead frame according to an example of the present invention will be described below with reference to FIGS. 1 and 2. FIGS. 1(a) to 1(d) show the procedure for forming a film using a film forming mold on the back surface of a die pad using polyimide resin.
（１）先ず被膜形成型４のキャビティ６に液状のポリイ
ミド樹脂３を流し込む．このとき、ポリイミド樹脂３の
流し込み量は、リードフレーム１のダイパッド２の面積
に応じて定め、その厚みは、完成時に５０〜３００μｍ
になる量に定める。(1) First, liquid polyimide resin 3 is poured into the cavity 6 of the film forming mold 4. At this time, the amount of polyimide resin 3 poured is determined according to the area of the die pad 2 of the lead frame 1, and its thickness is 50 to 300 μm upon completion.
Set the amount to be
（２）次に，ダイパッド２真面にポリイミド樹脂３の被
膜を形成するべく，リードフレーム１を被膜形成型４に
セットする。このとき、ダイパッド２裏面はポリイミド
樹脂３液面に接触する高さにセットする。(2) Next, the lead frame 1 is set in the film forming mold 4 in order to form a film of polyimide resin 3 directly on the die pad 2 . At this time, the back surface of the die pad 2 is set at a height such that it contacts the liquid level of the polyimide resin 3.
（３） このリードフレーム１を被膜形成型４にセッ
トした状態で，２００〜４００℃の温度でポリイミド樹
脂３を約１〜２時間の間硬化させる．
（４）最後に，ポリイミド樹脂３がダイパッド２真面に
密着したリードフレーム１を被膜形成型４から外し、本
発明のダイパッド２裏面へのポリイミド樹脂３の被膜の
形成が完了する．
本発明で用いられる被膜形成型４の材質は、ポリイミド
樹脂３との離型を阻止しないために、発水性の４弗化樹
脂を使用する。(3) With this lead frame 1 set in the film forming mold 4, the polyimide resin 3 is cured at a temperature of 200 to 400°C for about 1 to 2 hours. (4) Finally, the lead frame 1 with the polyimide resin 3 in close contact with the die pad 2 is removed from the coating mold 4, and the formation of the polyimide resin 3 coating on the back surface of the die pad 2 of the present invention is completed. As the material of the film forming mold 4 used in the present invention, a water-repellent tetrafluoride resin is used so as not to prevent mold release from the polyimide resin 3.
第２図は，本発明のリードフレーム１を用いて半導体チ
ップ７を搭載した封止樹脂８によるパッケージの断面図
を示した。FIG. 2 shows a cross-sectional view of a package with a sealing resin 8 on which a semiconductor chip 7 is mounted using the lead frame 1 of the present invention.
第１図（ａ）〜（ｄ）および第２図に示すように、上記
方法により，ダイパッド２の裏面に均一な膜厚のポリイ
ミド樹脂３の被膜を形成できて被膜中の残留応力が小さ
くなるとともに，ダイバッド２の裏面と封止樹脂８とが
ポリイミド樹脂３の被膜を介して密着されてダイパッド
２と封止樹脂８との間に生ずる剪断，圧縮、引張り応力
の分散と緩和がなされ、ダイバッド２裏面と封止樹脂８
との剥離は防止される。As shown in FIGS. 1(a) to (d) and FIG. 2, by the above method, a film of polyimide resin 3 with a uniform thickness can be formed on the back surface of the die pad 2, and the residual stress in the film is reduced. At the same time, the back surface of the die pad 2 and the sealing resin 8 are brought into close contact with each other through the coating of the polyimide resin 3, and the shearing, compressive, and tensile stresses occurring between the die pad 2 and the sealing resin 8 are dispersed and relaxed, and the die pad 2 Back side and sealing resin 8
This prevents peeling.
なお、ダイバッド２の裏面は平坦な構成に限るものでは
なく、複数の窪みを有するように構成してもよい。Note that the back surface of the die pad 2 is not limited to a flat configuration, and may be configured to have a plurality of depressions.
発明の効果
以上のように、樹脂封止型パッケージに本発明によりポ
リイミド被膜を形成したリードフレームを用いることで
、耐湿性、耐吸湿半田熱性の信頼性の改善が図れる。Effects of the Invention As described above, by using a lead frame on which a polyimide film is formed according to the present invention in a resin-sealed package, reliability in moisture resistance, moisture absorption resistance, and soldering heat resistance can be improved.
第１図（ａ）〜（ｄ）は、それぞれ本発明の一実施例に
係るリードフレームにポリイミド被膜を形成する手順を
示す断面図、第２図は上記リードフレームを用いた樹脂
型パッケージの断面図である。
１・・・リードフレーム、２・・・ダイパッド、３・・
・ポリイミド樹脂、４・・・被膜形成型、６・・・キャ
ビティ、７・・・半導体チップ、８・・・封止樹脂。
代理人 森 本 義 弘FIGS. 1(a) to (d) are cross-sectional views showing the steps for forming a polyimide film on a lead frame according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view of a resin-type package using the above lead frame. It is a diagram. 1...Lead frame, 2...Die pad, 3...
- Polyimide resin, 4... Film forming mold, 6... Cavity, 7... Semiconductor chip, 8... Sealing resin. Agent Yoshihiro Morimoto
Claims (1)
流し込み、その上にリードフレームを、ダイパッド裏面
が上記ポリイミド樹脂上に接触するようにセットし、加
熱により上記ポリイミド樹脂を硬化させてポリイミド被
膜を形成するリードフレームのポリイミド被膜形成方法
。1. Pour liquid polyimide resin into the cavity of the film forming mold, set the lead frame on top of it so that the back side of the die pad is in contact with the polyimide resin, and harden the polyimide resin by heating to form a polyimide film. A method for forming a polyimide film on a lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11391089A JPH02292848A (en) | 1989-05-06 | 1989-05-06 | Formation of polyimide film for lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11391089A JPH02292848A (en) | 1989-05-06 | 1989-05-06 | Formation of polyimide film for lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02292848A true JPH02292848A (en) | 1990-12-04 |
Family
ID=14624249
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11391089A Pending JPH02292848A (en) | 1989-05-06 | 1989-05-06 | Formation of polyimide film for lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02292848A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020138187A (en) * | 2019-03-01 | 2020-09-03 | 大日本印刷株式会社 | Vessel for film production and production method of film |
-
1989
- 1989-05-06 JP JP11391089A patent/JPH02292848A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020138187A (en) * | 2019-03-01 | 2020-09-03 | 大日本印刷株式会社 | Vessel for film production and production method of film |
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