JPH02291199A - Chip component supply device - Google Patents

Abstract

PURPOSE:To select arbitrarily various kinds of chip components in a small space and to supply them by a method wherein sticks are arranged at prescribed intervals in the form of a matrix in parallel to the upper and lower directions. CONSTITUTION:If a supply command from a control device 60 is issued, a pulse motor 34 is driven and a suction nozzle 31 is moved to the position directly over a stick mounted with specified components. The nozzle 31 is made to descend, a negative pressure is supplied in a state that the nozzle 31 is abutted on a chip component 2 of the uppermost part of the components and the nozzle sucks the component 2 and is made to ascend. After the nozzle is made to progress to the position of a stage 41 and is made to descend, the suction of the component 2 is released and the component 2 is put on the stage 41. After that, the nozzle 31 is made to return to its starting point and a supply completion signal is outputted to the device 60. By this signal, the device 60 controls a component mounting device 40 to move a chip mounter 43 to X and Y directions, makes a suction nozzle 42 of the mounter 43 suck the component 2 on the stage 41 and makes the component mount at a prescribed position on a substrate 70. Thereby various kinds of chip components are housed in a narrow space and can be selectively supplied at any time.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a chip component supply device that supplies a large number of chip components stored in a stacked state in a cylindrical stick one by one.

[Conventional technology]

For example, surface mount ICs (QFP, PLCC, MS
For packaging of chip parts such as
There are those arranged vertically and horizontally on a tray, those arranged horizontally in a row inside a cylindrical stick, and the ones stored in a stacked state inside a cylindrical stick.

Among these, the one that is stored in the stick in a stepped state allows for the largest number of chip parts per unit volume of the stick, and it is possible to store a large number of chip parts in a narrow and smooth space, making it easy to handle. Since it is easy to use, it is widely used as a chip component supply device in a component mounting device.

As such a chip component supply device, one as shown in FIG. 11 is generally used.

To explain this simply, a plurality of sticks 1 arranged side by side and inclined in rows each house a large number of chip components 2 in a stacked state in the same direction, and the stick 1 in the forefront Insert the push-up rod from the bottom of the holder, push up one chip part 2, and suck the pushed-up uppermost chip part 2 with a suction nostle (not shown) to make it slope as shown by arrow A. 4. Supply 2 parts.

The chip component 2 supplied to the slope 4 slides down the slope to a predetermined position, and is suctioned by a suction nozzle on the component mounting device side and mounted on the substrate.

When all the chip parts in the sticks in the front row are gone, the push-up bar 3 descends to the bottom, the empty sticks are ejected to the side, and the sticks in the next row move to the front row by gravity, and then The subsequent sticks follow this and move one step at a time to prepare for the next supply of chip components.

[Problem to be solved by the invention]

However, with such a conventional chip component supply device, the number of types of chip components that can be supplied is limited to 11 types. large units as shown in FIG. 11 must be arranged in parallel.

Therefore, the chip component supply device occupies a large space, and the installation space for other electronic component supply devices is reduced, resulting in the problem that it is no longer possible to supply many types of electronic components within a limited space. Ta.

An object of the present invention is to solve such conventional problems and provide a chip component supply device that can arbitrarily select and supply many types of chip components within a small space.

[Means for deciding issues]

In order to achieve the second object, the chip component supply device according to the present invention pushes the chip components stored in a stacked state in a cylindrical stick from below, and sequentially suctions the chip components with a suction nozzle to a predetermined position. In this device, sticks are arranged downwardly and parallel to each other at predetermined intervals in a 71-rick shape.

[For production]

By configuring as described in Section 2, different types of chip components can be stored in each row of the sticks arranged in a 71~ricks shape, and a large number of types of chip components can be stored arbitrarily with a simple configuration. You can choose and supply.

〔Example〕

Embodiments of the present invention will now be described with reference to the accompanying drawings.

FIG. 1 is a perspective view showing a schematic structure of an embodiment of the present invention.

The chip component supplying device of this embodiment is a component feeding device in which square tube-shaped sticks 1 containing a large number of chip components in a finely stacked state with the directions aligned are arranged in a rick shape and are fed to a predetermined position. a device 10, a component pushing device 20 for pushing the chip component from the fed stick 1; a component pushing device 20;
In other words, the stage 411 provided in the component mounting device 40
- and a control device 50 that controls the components.

Then, the stage 41 is
] - The component mounting device 40 mounts the supplied chip components onto a required position on the board 70 . 6
0 is a control device for the component mounting device 40, and each of these devices is mounted on a common base plate 5.

As shown in FIG. 2, a square tube-shaped stater 1 stores a large number of chip components 2 such as ICs in a stacked state with the orientation aligned, and can be obtained in this packaging form.

11.1 The parts feeding device 10 supplies a plurality of (four in the figure) cassettes 1 in which a plurality of stick storage portions into which sticks 1 can be inserted are arranged in a predetermined bit 1].
2.13.14 and this 1)) cassette 1-1 1=+
It has a holder 15 for storing the cassettes 1-4 in a parallel state so as to be slidable in the direction of the arrow X, and a calling mechanism (described later) for moving each of the cassettes l-11 to 14 in the direction of the arrow X. , Component Pusher 20 has a push-up mechanism (details will be described later) that pushes the chip component 2 in the stick 1 located at the tip of the cassette holder 15 in the X direction from below to one side. are doing.

The parts feeding device 10 and the parts pushing device 1 20 are provided for each cassette h, and their configurations are the same. Explain.

3 and 4 show the configuration of the parts feeding device 10 and the parts pushing device 20.

The cassette 11 has a flat block shape, and as shown in FIG.
Square hole-shaped stick storage parts 11a extending in the vertical direction for storing the sticks are arranged in a row, and a through hole 11b is provided at the bottom of each of them.
is formed.

Further, a rack 11c is integrally formed on the lower surface of the cassette 11.

This rack portion 11G meshes with a pinion 16 that is pivotally supported inside the cassette holder 15, and this pinion 16 can be rotated in forward and reverse directions by a pulse motor 18 shown in FIG. 6, which will be described later. By rotating, the cassette 11 can be moved to the left in the figure by a pitch P, and by rotating in the 1 direction, the cassette 11 can be returned to its original position.

As schematically shown in FIG. 4, the cassette 11 is guided and held by a linear guide mechanism 17 such as a linear bearing provided between the partition wall 15a provided inside the cassette 1 to the holder 15 and the side surface of the cassette. 3, so that it can reciprocate in the direction of the arrow X in FIG. 3 with almost no frictional force, and these components constitute the parts feeding device w10.

On the other hand, the parts pushing device 20, as shown in FIG. A push-1 rod 21 inserted through the through hole 11b, a timing belt 22 to which the lower end of the push-up rod 21 is fixed, and timing pulleys 23a and 23b that tension the timing heals 1 to 22 in the vertical direction. , and a pulse motor 24 that drives one timing pulley 23a in reciprocating rotation.

Furthermore, when the sensor plate I/25 protruding from the timing bell 1-22 and the pusher L support 21 reach the -1-rising end and descending end, the optical path is blocked by the sensor play 1-25, respectively. It has an upper limit sensor 2B and an upper limit sensor 27 based on an interrupter that becomes OFF.

As shown in FIGS. 4 and 5, a photo interrupter is installed on both sides of the tip of the holder 15 for the cassette 1 to detect the presence or absence of the stick 1 and the presence or absence of the chip component 2 in the stick 1. The first and second sensors 6
, 7 is fixed to a frame 37 (FIG. 4) of a component conveying device 30, which will be described later.

The light emitting parts 6a and 7a of the first and second sensors 6 and 7 are attached to one side plate 8a of the sensor support frame 8, and the light receiving parts 6b and 7b are attached to the other side plate 8b, respectively.
The cassette 11 advances and the stick 1 moves to the first sensor 6.
The presence or absence of the stick 1 is detected depending on whether or not the light emitting part 6a and the light receiving part 6b of the second sensor 7 are interrupted. The presence or absence of the chip component 2 is detected depending on whether or not the connection between the light receiving section 7a and the light receiving section 7b is interrupted.

Further, as shown in FIG. 1, the component conveyance device 60 includes a nozzle holder 32 on which a suction nozzle 31 connected to a negative pressure source (not shown) is mounted so as to be movable upward in the direction of arrow Z, and A pair of guide shafts 33 supported slidably in the direction indicated by the arrow Y orthogonal to the direction indicated by the arrow X. 33 and l! ili
dynamic motor 34 and timing pulleys 35a, 3i51]
, the nozzle holter 62 is aligned parallel to the guide shaft 33 as shown by the arrow Y.
It is equipped with a timing bell 1-36 that swings in the direction.

Although not shown in FIG. 1, this component transport device 30 has a frame 37 shown in FIG. [
The chip part 2 pushed up to the top of the stick 1 by the stick 21 is sucked by the dropping of the suction nozzle 31 which is driven by the timing bell I-36 and moved directly above the chip part 2. After raising it, the timing bell l-36 is rotated again to move it in the Y direction, and the component mounting device 4 is moved.
0, and the suction by the suction nozzle 31 is released.

All of the following operations are performed at predetermined timings based on instructions from a microcomputer (CPU) built into the control device 50.

On the other hand, the component mounting device 40 includes a suction nozzle 42 and
, a well-known chip mounter 43 that can move in the Y direction, and openings 44a and 44b through which a substrate 70 transported by a substrate transport device (not shown) is carried into a predetermined position in the device and discharged.
The chip mounter 43 mounts the chip component 2 transferred onto the stage 41 to a desired position on the substrate 70.

The operation of this component mounting device 40 is performed by instructions from a microcomputer (CPtJ) built in the control section 60.

FIG. 6 is a diagram showing the control device W50 of the chip component supply device and its input/output relationship.

This control device 50 is constituted by a microcomputer or the like, and receives detection signals from the first sensor 6, second sensor 7, upper limit sensor 26, and lower limit sensor 27 described above. Incidentally, in reality, each of these sensors is provided for each of the four cassettes 1-11 to 1-14, so there are four sensors, and each detection signal is inputted.

In addition, as output signals from the control device 50, the pulse motor 24 (hereinafter, the pulse motor is simply referred to as "motor J") for lifting and lowering the push rod, the motor 18 for moving the cassette, etc.
, and the motor 34 for moving the nostle holder, respectively, outputting drive signals that instruct forward and reverse rotation depending on the polarity. In addition,
Since the motors 24 and 18 are respectively provided for each of the cassettes 1-11 to 1-14, each motor is individually controlled.

Furthermore, a suction nozzle negative pressure control signal that controls the negative pressure supplied to the suction nozzle 31 is also output, such as the suction nozzle elevation control signal that controls the free lowering of the suction nozzle 31 shown in FIG.

Further, a supply command signal (including chip component designation data) and a termination command signal instructing the end of component supply are manually inputted from the control unit 60 of the component mounting device 40, and a supply completion signal is output to the control unit 60.

Next, the control processing according to the present invention performed by the microcomputer of the control device 50 will be explained using flowcharts 1 to 10 shown in FIGS. 7 to 10.

111- When a plurality of sticks 1 each containing the required chip parts 2 stored in a stack are inserted into the cassettes 11 to 14 and the power is turned on, the main routine shown in FIG. 7 starts from 1 to 1.

First, each component feeding device 10 of the cassettes 11 to 14 is
Then, an initialization process is executed to sequentially initialize the component push-up device 20.

When this is completed, a component supply process is executed according to a command from the control unit w60 of the component mounting device 40, and when that is completed, an end process is executed to complete all processes.

The initialization process for each cassette 1-11-14 is performed by the subroutine shown in FIG.

That is, first, it is determined whether or not the first sensor 6 is OFF (detecting the stick 1), and if it is OFF, the motor 24 is rotated in the normal direction to raise the push-up bar 21.

If the second sensor 7 turns OFF (detects the chip component 2), the process returns to the main routine shown in FIG.
If it is ON, the second sensor 21 is raised by -4 and repeated until the second sensor 7 is turned OFF.

If the second sensor 7 remains ON (not detecting the chip component 2) and the second limit sensor 2B becomes ○F"F, there is no longer a chip component 2 in that stick 1, so
The lower limit sensor 27 turns off the motor 24 (push-up rod 2
After rotating the motor 18 in the forward direction until the lower limit of 1 is detected, the motor 18 is rotated forward to move the cassettes 1 to 1 pitch P (see Fig. 3) as indicated by the arrow X.
move forward in a direction. This cassette advance processing is also performed when the first sensor 6 is not OFF in the first judgment of this subroutine.

As a result, if the first sensor 6 turns OFF, the state returns to A, but if it remains ON, it is determined that there are no more sticks (of course, there are no chip parts), and an alarm is issued and a display (not shown) is activated. After displaying ``No parts'', the motor 18 is reversed to return to power set 1, and the process returns to the main routine.

By performing such an initialization process on each cassette, it becomes possible to supply chip components (ICs) from the stick 1 placed in the set 1 to any cassette.

Next, a subroutine for parts supply processing will be explained with reference to FIG.

Here, the system waits for a supply command from the control device 60, and when there is a supply command (including the specification of a part), the motor 34 is actuated to move the suction nozzle 31 to a position directly 2' above the stick of the specified part. move it.

In this state, the suction nozzle 61 is lowered, and while it is in contact with the uppermost chip component 2, negative pressure is supplied from a negative pressure source to attract the chip component into two parts and raise the chip component. Then, after moving to the right (FIG. 1) to the position of the stage 41 and lowering it to 1, the supply of negative pressure is cut off, the suction of the chip component 2 is removed, and the chip component is placed on the stage 41.

After that, the suction nozzle 31 is returned to the starting point and a supply completion signal is output to the control device 60. , Based on this signal, the control device 60 controls the component mounting device 40 to move the chip mounter 43 in the X and Y directions, and causes the suction nozzle 42 to suck the chip component 2 on the stage 41 onto the substrate 70. mount it in the designated position.

On the other hand, if the control unit W50 receives a termination command from the control device 60, it returns to the main routine shown in FIG. 7, but if there is no termination command, it performs a standby process and waits for the next supply command.

The standby process is similar to the initialization process shown in FIG. 8, and as the chip component 2 at the top of the stick 1 is conveyed and disappears, the second sensor 7 is turned on, so the motor 24 is rotated in the forward direction. Then, the push-up plate 21 is raised by -1, and the next chip component 2 is raised and the second sensor 7 is turned off.
When set to F, the motor 24 is stopped and enters a standby state.

After that, chip part 2 is supplied to Jlffi and pressed.
When the upper end of the stick 21 reaches the upper end of the stick 1, the third
The sensor plate 1 to 25 in the figure cuts off the upper limit sensor 2, and its output is turned off.

-]6 At this time, if the output of the second sensor 7 remains ON, it is determined that the chip part 2 in the stick 1 is gone, and the push-up holder 21 is moved to the lower limit position on the F side of the stick 1. Then, the pinion 16 of the cassette 1-11 into which the stick 1 is inserted is rotated by normal rotation of the motor 18, and the cassette 11 is advanced by one pitch P in the direction of the arrow X and then stopped.

At this position, the chip parts 2 are fed by pushing the rod 21 up again.

By moving the cassette h 1 1 in the direction of the arrow X, the cassette 1
Chip parts 2 in all sticks inserted in ~11
If the stick 1 is not present when moving one pitch of 11 to the cassette 1, the output of the first sensor remains ON, so a warning is issued with an alarm sound, etc. The cassette 1 is returned to the state shown in FIG.

When a termination command is received from the control device 60, the termination process shown in FIG. 7 is performed to terminate all processes, but the subroutine of the termination process is as shown in FIG. 27 until it turns OFF. Press and hold the cassettes 1 to 11 to 14 to lower the second cassette 21.
are executed sequentially.

In addition, in the above-mentioned embodiment, the case where four types of chip components are supplied by providing four cassettes 1 was explained, but the number of cassettes 1 is not limited to this, and the chip components may be for surface mounting. [Effects of the Invention] As described below, according to the present invention, sticks storing chip components in a stacked manner are arranged vertically in parallel at predetermined intervals in a matrix shape. Since it is arranged in a narrow space, it is possible to store many kinds of chip parts in a narrow space and selectively supply them at any time.

In addition, since the chip component supply device is a single unit,
Other electronic component supply devices can be placed in other spaces, making it possible to supply a wide variety of electronic components.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing a schematic structure of an embodiment of the present invention, FIG. 2 is a perspective view showing the shape of the stick, FIG. 3 is a vertical sectional view of the parts feeding and pushing device, and FIG. 5 is a perspective view showing the relationship between the sensor section and the stick, FIG. 6 is a block diagram showing the relationship between the control device 50 and its input and output, and FIGS. FIG. 10 is a flow diagram of control processing by the microcomputer of the control device 50, and FIG. 11 is a perspective view illustrating a conventional chip component supply device. 1 Stick 2 Chip component 6 - First sensor 7 - Second sensor 10 - Component feeding device 11 - 14 - Cassette 1 - 15 - Cassette 1 - Holder 17 - Linear guide mechanism 18 - Cassette 1 - movement Pulse motor for use 20 Parts pushing device 21 Dosing 2
4.Pulse motor 25 for two-bar lifting and lowering sensor brake 1-. 2B-1 second limit sensor 27 Lower limit sensor 30 Parts conveyance device 31 Suction nozzle Filter 2 Nozzle holder 33, guide shaft 34, pulse motor 40 for moving the nozzle holder, component mounting device 41 Stage 42, suction nozzle
43 Chip mounter 50, chip component supply device control device 60, component mounting device control device 70 Board book

Claims (1)

[Scope of Claims] 1. A chip component supply device that pushes up chip components stacked in a cylindrical stick from below, suctions them one by one with a suction nozzle, and conveys them to a predetermined position, comprising: A chip component supply device characterized in that the chip components are arranged in a matrix in parallel in the vertical direction with an interval of .