JPH0228921A - Device for removing resist - Google Patents

Abstract

PURPOSE:To uniformly remove resist at a high speed by decomposing ozone into oxygen molecules and oxygen radicals on a hot plate having a plurality of holes and mounted on the top of a sample while cooling the sampler and removing the resist by means of radiation heat from the plate at a high speed. CONSTITUTION:Ozone gas having approx. 10% of concentration generated by an zone generator is introduced from a gas inlet, and brought into contact with a hot plate heated to approx. 400 deg.C to be thermally decomposed into oxygen radical. The radical is diffused from a gas diffuser 7 to arrive at a sample 8, and reacted with the resist. The resist is heated by radiation heat from the plate to improve the resist removing speed, and a plurality of holes each having 3-5mm of diameter are formed at the plate to uniformly remove the resist. A cooling water hole 9 is formed at a sample table 1, cooling water of 20 deg.C or lower is fed to eliminate the temperature rise of the sample. Accordingly, the sample is not contaminated with heavy metal or the like contained in the resist, and the resist can be removed.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a resist removal apparatus capable of removing resist at high speed with little damage to semiconductor devices.

2. Description of the Related Art Conventionally, this type of resist removing apparatus has had a configuration as shown in FIG. In Figure 2, 1 is the sample table, 2
is an exhaust boat, 3 is a chamber cover, 4 is a gas inlet for introducing ozone which is a reaction gas, 8 is a resist sample, 11 is a sample processing chamber, and 10 is a heater for heating a sample table. , 3001::. Ozone gas is obtained by introducing 02 gas into an ozone generator, and the ozone concentration in the o2 gas is about 1Q%.
The total flow rate of gas and ozone gas is 600cc-7Ain.

Ozone introduced into the sample processing chamber is decomposed into oxygen radicals and oxygen molecules when it reaches the heated sample. Oxygen radicals react with the resist, decomposing the resist into volatile compounds such as hydrocarbons or water, and removing the resist.

Problems to be Solved by the Invention This configuration has the drawback that the semiconductor device is likely to be damaged because the sample reaches a high temperature with the resist attached.

Means for Solving the Problems In order to solve all the problems, the present invention decomposes ozone into oxygen molecules and oxygen radicals using a hot plate with a plurality of holes installed above the sample while completely cooling the sample. , and the resist is removed at high speed using radiant heat from the hot plate.

Function: If such a resist removal device is used, the resist can be removed without increasing the temperature of the sample, so the resist can be removed at high speed without damaging the semiconductor device. Furthermore, since the radicals are diffused through the plurality of holes formed in the hot plate, the resist can be removed at a uniform rate.

Embodiment An embodiment of the resist removing apparatus according to the present invention is shown in FIG. In Fig. 1, 1 is an aluminum sample pull that is cooled to below 20°C with cooling water, 2 is an exhaust port for exhausting reaction products, and 3 is a chamber cover 4 forming a sample chamber. 6 is a gas inlet for introducing ozone gas, 6 is a hot plate having a plurality of holes with a diameter of 2 to 10 JlIII, and has a built-in heater and heated to about 400°C; 6 supports the hot plate; and a support part for diffusing ozone gas; 7 is a gas outlet;
8 is a sample, and 9 is a cooling water hole for cooling the sample stage.

Ozone gas with a concentration of about 10% generated by an ozone generator is introduced from a gas inlet, and when the ozone comes into contact with a hot plate heated to about 400° C., it is thermally decomposed and oxygen radicals are generated.

The oxygen radicals diffused through the gas blowing lower part, resulting in sample 8.
reach and react with the resist. In order to enhance the reaction between the resist and ozone, the distance between the hot plate and the sample should be 3~3.
By heating the resist with radiant heat from a hot plate, the resist removal speed is improved, and by providing a plurality of holes with a diameter of 3 to 5 M11 in the hot plate, the resist can be removed uniformly. .

A cooling water hole 9 is formed in the sample table 1, and cooling water of 20°C or lower is flowed through it to prevent the temperature of the sample from rising, allowing the resist to be removed without contaminating the sample with heavy metals contained in the resist. can do.

Effects of the Invention According to the present invention, it is possible to reduce damage to semiconductor devices due to heavy metal contamination and the like, and to remove resist more quickly and uniformly.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of a device according to an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional device. 1...Sample table, 2...Exhaust port, 3...Chamber cover, 4...
Gas inlet, 6. Old support part, 6. Hot plate, 7. Gas outlet, 8.
...Sample, 9...Cooling water hole, 1o...
...Heater, 11...Sample processing chamber. Name of agent: Patent attorney Shigetaka Awano and one other person Figure (・-8 Mr. r1 Toble 1!-40 ki 3--f?si 11+-kad-7---γs D 8・-Sample 4m-4 Knee 11 +02

Claims (1)

[Claims] It is equipped with an inlet for gas containing ozone and a heating plate having a plurality of holes supported above the sample placed on the surface of the sample stage, and the sample is uniformly heated by radiant heat from the heating plate. In addition, the sample stage is equipped with a cooling mechanism,
A resist removing apparatus characterized in that the ozone introduced from the inlet is decomposed by a thermal reaction with the hot plate, and oxygen radicals generated are supplied to the sample through holes in the hot plate.