JPH02288391A - Manufacture of printed circuit substrate - Google Patents

Abstract

PURPOSE:To make it possible to control accurately a production process or the classification of products without calling for an additional process in a production process by indicating the classification of type by the use of bar codes in terms of a printed circuit substrate and performing this bar code indication in the production process of said printed circuit substrate. CONSTITUTION:A etching resist layer 3a is adhered and formed on a conductive metal layer 1 laid out on the main side of an insulated substrate 2 so that a specified circuit pattern may be produced while an etching resist layer 3b equivalent to bar codes for classification indication is adhered and formed on a non-circuit pattern section. Then, the conductive metal layer 1 is subjected to etching-process so that a specified pattern formation and classification indication bar codes formation may be produced simultaneously, which eliminates the need for additional process to provide classification indication bar codes. Specifically, this construction makes it possible to provide a bar coded printed circuit substrate for classification indication with ease without complicating the production process. Moreover, since the classification is indicated based on the bar codes, it can be detected by a bar code reader with ease and accuracy.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a method of manufacturing a printed circuit board, and particularly to a method of manufacturing a printed circuit board with a type indication.

(Prior Art) As is well known, printed circuit boards are widely used in various electronic devices and electrical devices for the purpose of simplifying circuit configurations. Therefore, there are many types of printed circuit boards that are put into practical use, and operations such as production, manufacturing management, and shipping management have become complicated. In response to the complexity of such work, it is possible to display the type by printing letters or numbers for the type on a predetermined area (non-circuit forming area) of the printed circuit board during the manufacturing process of the printed circuit board or after the manufacturing is completed. is being attempted.

(Problem to be solved by the invention) However, printing the letters or numbers for the above types requires an additional process, which not only complicates the manufacturing process but also Since the operator visually recognizes the letters and numbers, there is a problem in that this discrimination requires a large number of man-hours. Moreover, the above-mentioned visual recognition by the operator tends to make errors, for example, when it is performed continuously. In other words, visual inspection by the worker requires a lot of time and is problematic in terms of speed.
It cannot be said that this is a sufficient response in terms of accuracy.

[Structure of the Invention] (Means for Solving the Problems) The present invention has been made in response to the above-mentioned circumstances, and the type of the printed circuit board is displayed by a bar code, and the bar code is displayed on the printed circuit board. The gist is that the process is carried out at the same time during the manufacturing process. In other words,
An etching resist layer is deposited on the conductive metal layer disposed on the main surface of the insulating substrate in the form of a desired circuit pattern, and an etching resist layer corresponding to the type display barcode is applied to the non-circuit pattern area. The conductive metal layer is deposited and etched to form a bar code for type display at the same time as a required circuit pattern is formed.

(Function) As described above, according to the present invention, the conductive metal layer disposed on the main surface of the insulating substrate is subjected to a so-called photoetching process to form a type display bar at the same time as a desired circuit pattern is formed. Since a code is also formed, there is no need to add a separate process for attaching a barcode for type display. In other words, a printed circuit board with a desired type display barcode can be easily obtained without complicating the manufacturing work or process.

Moreover, since the type display is a barcode, it can be easily identified and detected with a barcode reader with high accuracy.

(Example) The present invention will be described in detail below with reference to the accompanying drawings. 1 to 2 schematically show an embodiment of the manufacturing method according to the present invention. First, an insulating substrate 2 having a conductive metal layer 1 disposed on its main surface, for example, a copper foil-clad revoxy resin Prepare a multilayer board.

Next, for example, a photoresist film 3 is disposed on the copper foil layer 1 of this copper foil-covered epoxy resin laminated board (FIG. 1). Thereafter, the photoresist film 3 is exposed to light through a predetermined mask. Note that the mask used here is capable of selectively exposing regions in which the required circuit pattern shape and type display barcode shape are respectively formed. After the above-mentioned exposure treatment, development treatment is carried out to form an etching resist layer 3a on the copper foil layer 1 in the shape of a desired circuit pattern, and an etching resist layer corresponding to a bar code for type display on the non-circuit pattern portion. 3b is deposited (FIG. 2). After performing the required etching treatment on the conductive metal layer (copper foil layer) 1 on which the etching resist layers 3a and 3b have been deposited in the form of a required circuit pattern and type display barcode in this manner, By performing post-processes such as washing with water and drying using conventional methods, a printed circuit board with a type display barcode is obtained.

In the above example, a photoresist film was used to deposit and form the etching resist layer, but the etching resist layer may also be deposited and formed by applying a photoresist solution, drying method, silk screen method, or the like. Further, the selective exposure may be performed by scanning with an electron beam, for example, without using a mask. Furthermore, the insulating substrate is rfJ:c! The substrate is not limited to an epoxy resin substrate, but may be a phenol resin substrate, for example, and the conductive metal layer is not limited to a copper foil layer, but may be, for example, aluminum.

[Effects of the Invention] As described above, in the present invention, in the step of etching a conductive metal layer to form a desired circuit pattern, a bar code indicating the type of printed circuit board obtained in this step is created. formed at the same time. Since the type display barcode can be easily and accurately read by a barcode reader, it is also possible to manually classify and manage printed circuit boards by type, for example, by manually using a computer. In other words, without adding any additional steps to the manufacturing process, the manufacturing process and product type management can be performed without error and at high speed.

[Brief explanation of drawings]

FIG. 1 and Ts2 are for explaining one embodiment of the manufacturing method according to the present invention, and FIG. 1 is a perspective view showing a state in which a photoresist film is disposed on a conductive metal layer;
FIG. 2 is a perspective view showing a state in which an etching resist layer made of photoresist is formed on a conductive metal layer in the shape of a required circuit pattern and a bar code for type display. 1...Conductive metal layer 2...Insulating substrate 3...Photoresist layer 3a...Circuit pattern etching resist layer 3b... ...Barcode-like etching resist layer for type display Applicant: Toshiba Corporation

Claims (1)

[Claims] An etching resist layer is deposited on the conductive metal layer disposed on the main surface of the insulating substrate in the form of a desired circuit pattern, and a bar code for type display is formed on the non-circuit pattern portion. 1. A method for manufacturing a printed circuit board, comprising the steps of: depositing a corresponding etching resist layer; and etching the conductive metal layer on which the etching resist layer is deposited.