JPS58116796A - Printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a printed wiring board in which first and second wiring patterns are laminated on the outer surface of a substrate to which a large number of electronic components are attached.

A conventional printed wiring board will be explained using FIG. 1.

In the figure, (1) is a substrate, and as shown in Figure 2, gold foil (3) is applied to both the front and back surfaces of an insulating plate (2) formed in the shape of #i. A noble hole (4) is formed through it, and the outer surface thereof is coated with chemical copper plating and electrolytic copper plating as shown in FIG. A copper coating (5) is formed.

(6) is the first mask, in which a photosensitive agent is applied to both the front and back surfaces of the substrate (1) in the fourth manner, and the outside is
) First a) By shining side light through the first film on which the pattern has been printed, parts of the bean paste other than the pattern are exposed to light and formed on the plating stopper film, forming the first pattern. It is formed by removing the 1+ photosensitive area within the range of 1+ with a solvent.

(7) is the first wiring, and the first mask (6) is connected to the outside of the temporarily stacked substrate (1) in the first pot! 4+ where the first plating process is applied using I4 material! Nyoshi, Genshu (I)
A first metal material is formed on the outside of I in the shape of a car. This first agonizing C line
1) - After fixing the first mask (6) to the surface, remove it with a solvent so that it protrudes from the surface of the board (1), and insulate it from each other in the first wiring (7). Copper plate between the wiring @(
By etching and removing 5), a predetermined current is applied to each electronic component electrically connected to each part of the surface of this first wiring (7). This makes it possible to form the first wiring (7) that can be fed.

The conventional mark 111J Ific line method uses the first gold material having the same composition in every part on the surface of the substrate (1) as described above, and only the first plating of (B) is performed. A first arrangement (7) of a first pattern shape was deposited and formed by processing.

For this reason, if the surface area of the substrate (IJ) is wide and the first pattern has a shape that extends over a wide range, there will be unevenness in the thickness of each part of the first wiring # (7). It was difficult to form the first wiring (7) with a uniform thickness.

In addition, if the shape of the ptrw ship pattern requires a complicated shape, each part of the first wiring (7)
9'r constant first pattern, and the error size between them was large due to a large error on each member of the board (1). It was difficult to form with high precision.

Also, during the first plating process, the first wiring (7)
Since it was not possible to change the energization time depending on the different parts of the first wiring (7), it was not possible to form the first wiring (7) with different wall thicknesses only at specific parts of the first wiring (7).

Since conventional printed wiring boards were subject to these manufacturing constraints, it was not possible to form the first wiring (7), which required a complicated shape, with perfect dimensional accuracy.

Furthermore, since all parts of the conventional first wiring (7) were made of the same first metal material, only certain parts of the first wiring (7) were made of the first metal material. It is impossible to give different material properties to specific parts by containing different components.

Conventional printed wiring boards use the same metal material over the entire surface of the wiring as described above, and have a uniform plating treatment applied to all parts. ! It is difficult to form a wiring having a rough shape, and it is impossible to make different material functions at different locations in the wiring.

This invention was made to eliminate the above-mentioned drawbacks of conventional printed wiring boards, and is formed by using a first metal material on the outside of the board and loosening the first plating process. By applying a second plating process using a second gold R14 material to the part of the board to which the first wiring is energized, and making the second wiring visible, it becomes more complicated. The object of the present invention is to provide a printed wiring that can produce a skewer that consistently forms wiring having a unique shape, and that exhibits different material characteristics depending on different treatments during the wiring.

An embodiment of the present invention will be described above with reference to FIG.

In the figure, (1) to (7) have the same symbols as the conventional ones.

(In August, a second mask was applied, and a photosensitive agent was applied covering both surfaces of the substrate (1) and the outer surface of the first pattern (7), and a second pattern was applied from the outside. By exposing the printed film to light through the second film, parts other than the second pattern quickly reach the plating prevention film, and the exposed areas within the second pattern are removed with a solvent. It is formed by

(9) is a second wiring, and a second gold #1i11'#
By applying a second plating process using the base material,
It is formed by fixing a second gold material in a second pattern shape to the outer surface of (1). This second distribution #! After (9) is fixed, remove the second mask (8) with a solvent and remove the unnecessary portion of the copper plate film (5) between the second wiring <9) and the first wiring (7). 1- on the surface of the substrate (1) with a skewer.
A skewer is produced in which the first wiring NM (7) having the pattern shape and the second wiring (9) having the second pattern shape form a non-lighting stamp wiring #M.

This tentative printing pattern #L is created by dividing all the wiring on the electrode plate (1) into the first pattern and the second pattern as described above. By performing two plating processes, a plating process and a second plating process using a second gold material, a wiring having a shape that is a combination of the first and second patterns is formed.

Therefore, if the wiring shape is complex, it can be divided into a simpler first pattern and a second pattern to create a more powerful pattern.
By easily forming the first and second wirings (7) and (9) with accurate shapes, the drawback of conventional printed wiring boards, where it was difficult to manufacture island wiring with dimensions of m degrees, has been improved. However, even if the shape is complex, it is possible to form a button with high dimensional accuracy and a second composite wiring.

In addition, if a thin part and a thick part are required in the wiring, these can be divided into the first and second patterns, respectively, and the first and second metal materials can be made of the same gold 11X material. For example, when using copper, during the first and second plating treatments,
1. This technology changes time into long hours, and eliminates the drawback of conventional wiring where it was not possible to form wires with different wall thicknesses at specific points. A fist forms a composite wire.

Furthermore, if it is necessary to change the material characteristics of the wiring due to the positioning on the board (1), for example, if copper wiring is problematic and requires copper wiring in a specific part, copper wiring may be used. The first plating process is performed using copper as the first metal material, with the wiring part as the first pattern, and the part requiring copper wiring is divided into the second pattern, and the edge is used as the second gold plate. By applying the second plating treatment, the drawbacks that conventionally did not occur when the #I formation gold acid component was changed due to the cage in the wiring are eliminated, and specific parts of the wiring can be used to improve the different material functions of copper wiring. It is possible to form a composite wiring using copper and string.

In addition, in the above explanation, we used the case where all the wiring on the electrode plate was divided into 2 types of wiring, 1st and 2nd, but this number of divisions is limited to just 2 types of wiring. For example, in the other example shown in Fig. 6, the first, second, and third gold wires Copper and silver are used as materials.

The triad of steel, bride, and gold is formed by using gold and applying copper-1 second and third plating treatments, respectively! What wiring should I do next?Print layout f3! Demonstrate teaching. As shown in FIG. 7, this third interconnection, the gold interconnection, is attached to the outer surface of the base & (1) on which the first copper interconnection (7) and the second interconnection (9) are formed. A third plating process is performed using a third mask 011 which is formed into a third pattern shape by painting a pattern.

By making the shape of this third mask 0 such that a part of the silk wiring (7) or the second wiring (9) protrudes, one of the first or second wiring A third wiring is formed when one part is removed and the other part is covered, or when the third wiring is formed.
Soguzorl! Alternatively, bundled wiring with gold plating on part of the silver can be obtained.

In this way, this printed wiring board divides all the wiring on the board into various types of wiring, so it is not only a scale that can precisely form wiring with a rough shape, but also a scale that can use gold 1r4 material of different polarity. By bundling together, it is possible to form a bundling wire with multi-shaped material functions, and it is possible to center the young fruits of Izun and @uri.

As described above, the present invention is formed by subjecting a part of the outer surface of the substrate to the first plating treatment using the metal material No. 10.
L f: The part of the board where the first wiring was exposed was subjected to a second plating process using a second gold material to allow the operator to handle the second wiring, so it was complicated. The effect of providing a printing scheme that discovers different material FFJ characteristics at different locations in the wiring is achieved, rather than a single piece of paper that forms a wiring having a unique shape.

[Brief explanation of the drawing]

Fig. 1 shows the structure of a conventional printed wiring board, Figs. 2 to 4 are explanatory diagrams explaining the manufacturing process of Fig. 1, and Fig. 5 shows the structure of an embodiment of the present invention. FIG. 6 is a sectional view of another embodiment of FIG. In the figure, (1) is a substrate, (2) is an insulating plate, (7) is a first wiring, and (9) is a second wiring. In each figure, the same reference numerals refer to the same or corresponding parts. Daikonjin Gefu Shin - Figure 1 Figure 5 Figure 0 Figure 7

Claims (3)

[Claims] (1) An insulating substrate, a first wiring pattern on which a plate layer is formed using a first metal material, and a second metal material formed on a part or the entire area of the first wiring pattern. A printed wiring board having a second wiring pattern deposited thereon. (2) The printed wiring according to item 1 of the scope of patent M, characterized in that the first metal material and the second metal material are formed using exactly the same metal component or mutually different metal components. Board. (3) The second wiring pattern is formed by a plating process using a photographic method in which a photosensitive agent is applied to the outer surface of the board and then subjected to a non-light and development process. A printed wiring board according to item 1 of the scope of demand.