JPH0228308A - Manufacture of chip-type electrolytic capacitor - Google Patents

Abstract

PURPOSE:To improve labor effectiveness by a method wherein a part of external resin is removed in a hardened state to form a flat portion. CONSTITUTION:A plurality of aluminum electrolytic capacitors 5 are chained and an external resin layer 6 is formed by the dipping method. Leads 7, 8 are cut to bend the leads 7, 8. Then a part of the external resin layer 6 where the leads 7, 8 are not present is removed to form a flat portion 11. This enables a large number of chip-type electrolytic capacitors to be obtained by a simple process. The flat portion on the upper face of the external resin layer 6 is suitable for adsorbing a chip-type electrolytic capacitor 1A so that it can be securely mounted on a board or the like.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method of manufacturing a chip-type electrolytic capacitor.

[Prior Art] The applicant of the present application has published Japanese Patent Application Laid-Open No. 57-20425,
-20426 and JP-A-57-45221 (baka), both of which are named "chip type electrolytic capacitors" [incorporating a capacitor element in which at least an anode foil and a cathode foil are wound through a separator in an aluminum case; The first aluminum electrolytic capacitor sealed with a sealing body
proposed a chip-type electrolytic capacitor in which a first metal terminal plate is fixed to the lead wire, a second metal terminal plate is fixed to the second lead wire, and the entire aluminum electrolytic capacitor is covered with resin. . However, conventionally, the transfer molding method or the casting method using a silicone-based mold release agent was used for exterior packaging with resin, and the transfer molding method resulted in high product prices due to factors such as resin loss and limited number of pieces. In addition, the casting method also had the disadvantage of poor workability and high product prices. Furthermore, first and second metal terminal plates had to be prepared and fixed to the first and second lead wires of the electrolytic capacitor, which also resulted in poor workability and increased product prices. .

In order to solve these problems, the applicant of the present application has already proposed a chip type electrolytic capacitor l as shown in FIG. This chip type electrolytic capacitor l has at least a capacitor element 3 built into an aluminum case 2, an aluminum electrolytic capacitor 5 sealed with a rubber sealing body 4, and the entire aluminum electrolytic capacitor 5 covered with a resin layer 6. The lead wires 7 and 8 of the capacitor element 3 are bent to form external terminals. The applicant has also disclosed a method for manufacturing a chip-type electrolytic capacitor suitable for manufacturing a large quantity of such chip-type electrolytic capacitors in Japanese Patent Laid-Open No. 60-2.
Proposed by No. 36208.

[Problems to be Solved by the Invention] Incidentally, since the aluminum case 2 of this chip type electrolytic capacitor I is cylindrical, the outer shape of the resin layer 6 is also cylindrical. For this reason, when mounting a chip-type electrolytic capacitor l on a printed wiring board or the like using a mounting device equipped with suction means, there is no flat part (surface), so in some cases it may not be suctioned, making the work easier. was bad.

[Means for Solving the Problems] However, in order to solve the above-mentioned problems, the present invention provides a method for manufacturing a chip-type electrolytic capacitor that is suitable for manufacturing a large amount of chip-type electrolytic capacitors having a flat portion. Specifically, a flat portion is formed by removing a portion of the exterior resin when it is in a hardened state.

[Example] The manufacturing method according to the present invention will be described below with reference to the drawings.

First, a plurality of aluminum electrolytic capacitors 5 shown in FIG. 9 are prepared and arranged in a series. Note that the method of manufacturing the aluminum electrolytic capacitor 5 is the same as the conventional method. There are the following three methods for continuous formation.

In the first method, as shown in FIG. 1, the lead wires 7.8 of the aluminum electrolytic capacitor 5 are welded to the iron hoop material 9 to form a continuous wire. The lead cotton 7 and 8 may be in an unformed state as shown in FIG. 1, or may be in a crank formed state in advance.
In the method described above, the leads 117.8 are fixed to a paper mount with hot melt tape to form a chain. The third method is to connect the lead wires 7.8 by fixing them to a jig that can be chucked differently.

Next, as shown in FIG. 2, a resin layer 6 is applied to the continuous aluminum electrolytic capacitor 5.
For the exterior of the lead wire 7. as shown in FIG.
A rounded recess l is formed on the outer surface of the resin layer 6 around the resin layer 8.
If O is formed, the lead wire 7.8 will lead when bending. ! Since the stress applied to the interface between 7.8 and the resin layer 6 is dispersed, cracks that occur at the interface can be removed, so the resin for the resin layer 6 is preferably a thermosetting resin or an ultraviolet curing resin. Epoxy resin is preferable in terms of detergent resistance. Methods for forming this resin layer 6 include a liquid dipping method and a powder fluid dipping method. In the case of the liquid immersion method, the continuous aluminum electrolytic capacitor 5 is immersed in an ultraviolet curing or thermosetting resin and cured by ultraviolet irradiation or heating. In the case of powder fluidization dipping method,
This is done by heating the aluminum electrolytic capacitor 5 and immersing it in powdered resin. If the resin before hardening creeps up onto the lead wires 7.8, apply a fluorine-based resin, for example, to the required locations on the lead wires 7.8 in advance. It's good to prevent it.

Next, for the purpose of reducing leakage current and debugging, heating and energizing aging treatment is performed, and other necessary inspection items are performed.In this case, one of the lead wires 7 and 8 is connected to the hoop material 9 Separate it from (.

After that, as shown in FIG.
Bend it to 0 degrees. This first digit bending process can be omitted if the strands have already been bent at the time of continuous formation.

When bending the lead wires 7 and 8, it is preferable to perform the bending process sequentially starting from a distant part of the main body of the electrolytic capacitor 5.Then, the lead wires 7 and 8 are cut to a predetermined length as shown in FIG. Furthermore, as shown in FIG.
Perform a second bending process so that it closely follows the main body of A.

Thereafter, a portion of the exterior resin layer 6 on the side where the lead wire 7.8 is not present is removed to form a flat portion 11 as shown in FIG. Then, necessary items such as polarity, rated voltage, and capacitance are displayed on the surface of the resin layer 6 by a transfer printing method.

Manufacturing of the chip type electrolytic capacitor LA is completed through the steps described above, and the capacitor is packaged and shipped in bulk. In addition, if necessary, as shown in FIG.
2 and can be shipped in taped packaging.

In the chip type electrolytic capacitor IA shown in FIG. 6, the lead wire 7.8 is positioned along the main body, but as in the chip type electrolytic capacitor IB shown in FIG. may be positioned so as to extend from the main body.

[Effects] As described above, the present invention incorporates at least a capacitor element in an aluminum case, covers the entire aluminum electrolytic capacitor sealed with a rubber sealing body with a resin layer, and connects the aluminum electrolytic capacitor with a resin layer through the rubber sealing body. In manufacturing a chip-type electrolytic capacitor with external terminals formed by bending the lead wires from the capacitor element, the process is a process of forming a plurality of aluminum electrolytic capacitors into a series.
It consists of a process of forming an exterior resin layer using a dipping method, a process of cutting the lead wire, a process of bending the lead wire, and a process of removing a part of the exterior resin layer to form a flat part. This method has the advantage that a large quantity of chip-type electrolytic capacitors can be provided through a simple process. The upper flat part of the exterior resin layer is suitable for adsorbing the chip-type electrolytic capacitor, so that it can be reliably mounted on a substrate, etc.

[Brief explanation of the drawing]

1 to 6 are diagrams showing each step of the manufacturing method according to the present invention, FIG. 7 is a cross-sectional view showing the taped packaging of a chip type electrolytic capacitor manufactured by the method of the present invention, and FIG.
This figure shows another chip-type electrolytic capacitor of the present invention, and FIG. 9 shows a conventional chip-type electrolytic capacitor. In the figure, 1. LA, IB...Chip type electrolytic capacitor,
2... Case, 3... Capacitor element, 4... Rubber sealing body, 5... Aluminum electrolytic capacitor, 6...
...Resin layer, 7.8... Lead wire, 9... Hoop material, lO... Concave portion, 11... Flat portion, 12... Tape.

Claims (1)

[Claims] (1) A process of incorporating at least a capacitor element into an aluminum case and forming a plurality of aluminum electrolytic capacitors sealed with a rubber sealing body in a series, and a process of forming an exterior resin layer over the entire aluminum electrolytic capacitor by a dipping method, A step of cutting the lead wire from the capacitor element led out through the rubber sealing body, a step of bending the lead wire, and a step of removing a part of the exterior resin layer to form a flat part. A method for manufacturing a chip-type electrolytic capacitor.