JPH02278608A - Superfine enamel wire - Google Patents
Superfine enamel wireInfo
- Publication number
- JPH02278608A JPH02278608A JP10130689A JP10130689A JPH02278608A JP H02278608 A JPH02278608 A JP H02278608A JP 10130689 A JP10130689 A JP 10130689A JP 10130689 A JP10130689 A JP 10130689A JP H02278608 A JPH02278608 A JP H02278608A
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- oxygen
- wire
- tensile strength
- silver
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 210000003298 dental enamel Anatomy 0.000 title abstract 2
- 239000004020 conductor Substances 0.000 claims abstract description 47
- 239000010949 copper Substances 0.000 claims abstract description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 26
- 229910052802 copper Inorganic materials 0.000 claims abstract description 26
- 229910052709 silver Inorganic materials 0.000 claims abstract description 18
- 239000004332 silver Substances 0.000 claims abstract description 18
- 239000012535 impurity Substances 0.000 claims abstract description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 16
- 229920002635 polyurethane Polymers 0.000 abstract description 12
- 239000004814 polyurethane Substances 0.000 abstract description 12
- 238000000034 method Methods 0.000 abstract description 7
- 239000003973 paint Substances 0.000 abstract description 5
- 229920003055 poly(ester-imide) Polymers 0.000 abstract description 2
- 229920000728 polyester Polymers 0.000 abstract description 2
- 238000007796 conventional method Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 18
- 238000004804 winding Methods 0.000 description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 7
- 229910052760 oxygen Inorganic materials 0.000 description 7
- 239000001301 oxygen Substances 0.000 description 7
- 239000012790 adhesive layer Substances 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005491 wire drawing Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- CBECDWUDYQOTSW-UHFFFAOYSA-N 2-ethylbut-3-enal Chemical compound CCC(C=C)C=O CBECDWUDYQOTSW-UHFFFAOYSA-N 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000009749 continuous casting Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- -1 evoquin Polymers 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- JTHNLKXLWOXOQK-UHFFFAOYSA-N n-propyl vinyl ketone Natural products CCCC(=O)C=C JTHNLKXLWOXOQK-UHFFFAOYSA-N 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 208000017520 skin disease Diseases 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、導体径か４０μｍ程度以下の極細エナメル
線に関し、特にフロノピーティスク装置、ハードティス
フ装置等の磁気ティスフ装置の磁気ヘッド用コイルとし
て好適な極細エナメル線に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an ultrafine enameled wire with a conductor diameter of approximately 40 μm or less, and is particularly applicable as a coil for a magnetic head of a magnetic tissue device such as a phronoptic device or a hard tissue device. This invention relates to a suitable ultrafine enameled wire.
磁気ディスク装置の磁気ヘット用コイルに用いられるエ
ナメル線としては、従来タフピッチ銅からなる導体径５
０〜５５ ｉｔ ｍの導体に厚さ３〜５μｍのポリウレ
タンなどからなる絶縁層を設けたものか用いられている
。The enameled wire used in the magnetic head coil of a magnetic disk device has traditionally been made of tough pitch copper and has a conductor diameter of 5.
A conductor having a diameter of 0 to 55 it m and an insulating layer made of polyurethane or the like having a thickness of 3 to 5 μm is used.
しかしなから、近時磁気ティスフ装置の小９−１ｊ化が
要求され、磁気ヘット自体も小！−ｔ、’！化する必要
か生し、コイル用エナメル線も導体径を３０〜４０１１
ｍとさらに極細化することか要求されている。However, recently there has been a demand for smaller 9-1J magnetic disk devices, and the magnetic head itself is also smaller! -t,'! Due to the need to change the conductor diameter of enamelled wire for coils from 30 to 4011
There is a demand for further miniaturization to m.
一方、磁気ヘットへのエナメル線の巻線加−Ｌ方法も、
従来の顕微鏡下での低速手巻き加工から高速自動巻線機
による加圧へと転換されつつある。On the other hand, the method of winding enamelled wire on the magnetic head is also
The conventional low-speed manual winding process under a microscope is being replaced by high-speed automatic winding machines.
このため、導体径か３０〜４０ ｔｔ ｍの極細エナメ
ル線を用いると、高速自動巻線機による巻線加工の際に
エナメル線が異常に伸びて導体抵抗か増加したり、ある
いは断線する不都合か生しる。また、導体径か細いため
に、磁気ヘットのアセンブリ加工時にエナメル線端末を
引き回して半田イ」けする過程で断線する欠点もある。For this reason, if an ultra-fine enameled wire with a conductor diameter of 30 to 40 ttm is used, the enameled wire may stretch abnormally during the winding process using a high-speed automatic winding machine, increasing the conductor resistance or causing wire breakage. Live. Furthermore, because the diameter of the conductor is small, there is a drawback that the wire may break during the process of routing and soldering the end of the enameled wire during assembly of the magnetic head.
これらは、導体径か３０〜４０ ｉｔ ｍ程度となると
、導体自体の引張強度か極めて低くなるために生じるも
のであって、例えば導体径５０μｍのポリウレタン線で
は引張強度か５６ｇ、伸びか２３％であるのに対し、導
体径４０１１ｍのポリウレタン線では引張強度か３５ｇ
、伸ひか２１％、導体径３０μｍでは引張強度か２１ｇ
、伸びか２０％となる。These occur because the tensile strength of the conductor itself becomes extremely low when the conductor diameter is about 30 to 40 it m. For example, a polyurethane wire with a conductor diameter of 50 μm has a tensile strength of 56 g and an elongation of 23%. In contrast, a polyurethane wire with a conductor diameter of 4011 m has a tensile strength of 35 g.
, tensile strength is 21g at 21% elongation and 30μm conductor diameter.
, the elongation is 20%.
よって、この発明は、導体径を３０〜４０μｍ程度とし
ても引張強度か高く、かつ導体抵抗の増加かない極細エ
ナメル線を提供することを目的とする。Therefore, an object of the present invention is to provide an ultrafine enameled wire that has high tensile strength and no increase in conductor resistance even when the conductor diameter is about 30 to 40 μm.
この発明では、導体として０．０３〜０．５重量％の銀
（Ａｇ）を含有する無酸素銅からなり、伸びか７％以上
のものを用いることにより」―記課題を解決するように
した。In this invention, the problem described above is solved by using oxygen-free copper containing 0.03 to 0.5% by weight of silver (Ag) and having an elongation of 7% or more. .
以下、この発明の詳細な説明する。The present invention will be explained in detail below.
この発明の極細エナメル線における導体は、ＯＯ３〜０
．５重量％の銀（Ａｇ）を含有する）ｊ！（酸素鋼から
作られている。この導体は、純度９９９９％以」二の無
酸素銅に−１−記規定ＩＩ（となる銀を添加して得られ
た銅合金から作られる。ここで、無酸素銅の純度か９９
．９９％未満ては導体抵抗か大きくなったり、軟化温度
か高くなるなとの問題かある。銀は導体の引張強度を高
めるためのもので、銀の含有率が０．０３重量％未満て
は、引張強度増加効果か得られず、また０ ５重量％を
越えると導体抵抗か大きくなるとともにコスＩ・か高く
なって不都合となる。また、ここでの無酸素銅の酸素含
有率は重量比で３０ ｐｐｍ以下とされ、３０ ｐｐｍ
を越えると酸化物からなる非金属介在物量か増大し、伸
線時に断線しやすい問題がある。さらに、この発明での
無酸素銅においては不可避の不純物か含まれていてもよ
いが、これら不可避不純物の総量は０．００９重量％以
下とすることか好ましい。The conductor in the ultrafine enameled wire of this invention is OO3~0
．． Contains 5% by weight of silver (Ag))j! (Made from oxygen steel. This conductor is made from a copper alloy obtained by adding silver to oxygen-free copper with a purity of at least 9999%. Here, The purity of oxygen-free copper is 99
．． If it is less than 99%, there are problems such as increased conductor resistance and increased softening temperature. Silver is used to increase the tensile strength of the conductor. If the silver content is less than 0.03% by weight, no effect of increasing the tensile strength can be obtained, and if it exceeds 0.5% by weight, the conductor resistance increases and The cost will be high, which is inconvenient. In addition, the oxygen content of the oxygen-free copper here is 30 ppm or less in terms of weight ratio, and 30 ppm
If it exceeds this, the amount of non-metallic inclusions made of oxides will increase, causing the problem that the wire is likely to break during wire drawing. Furthermore, although the oxygen-free copper of the present invention may contain unavoidable impurities, it is preferable that the total amount of these unavoidable impurities be 0.009% by weight or less.
この組成の無酸素銅からの導体の製造は、通常の線引方
法で行われる。また、導体の径は特に限定されることは
ないが、５０μｍ以下、好ましくは４０μｍ以下とする
ことか発明の目的からして望ましい。The manufacture of conductors from oxygen-free copper of this composition is carried out by conventional wire drawing methods. Further, the diameter of the conductor is not particularly limited, but it is desirable for the purpose of the invention to be 50 μm or less, preferably 40 μm or less.
このような無酸素銅からなる導体」二には絶縁層が設け
られて極細エナメル線とされる。絶縁層はポリエステル
、ポリウレタン、ポリエステルイミド、ポリアミドイミ
ド、ポリアミド、ボリヒタン！・イン、ポリイミド、ポ
リビニルポルマール、ボＪビニルブチラール、エボキン
、シリコーンなとの絶縁塗料を常θ、によって塗布、焼
付して形成することかできるが、半Ｅｌ’ｌ （”Ｉけ
性の点からはポリウレタンか最も好ましい。この絶縁層
の厚さは、特に限定されないが、本発明の目的から薄い
方か好ましく、通常］ Ｑ μｍ以下、好ましくは５μ
ｍ以下とされる。An insulating layer is provided on such a conductor made of oxygen-free copper to form an ultrafine enamelled wire. The insulation layer is made of polyester, polyurethane, polyesterimide, polyamideimide, polyamide, polyhythane!・It can be formed by applying and baking insulating paints such as insulating paint, polyimide, polyvinyl polymer, vinyl butyral, evoquin, silicone, etc., but it has a semi-el'l ("I" point Polyurethane is most preferable.The thickness of this insulating layer is not particularly limited, but from the purpose of the present invention, it is preferably thinner, and usually] Q μm or less, preferably 5 μm
m or less.
また、この絶縁層」−には、必要に応してナイロンなと
からなる自己潤滑層やポリビニルブチラールなとからな
る自己接着層を設けることができる。Further, this insulating layer may be provided with a self-lubricating layer made of nylon or a self-adhesive layer made of polyvinyl butyral, if necessary.
さらに、自己潤滑層と自己接着層とを設けることもてき
、絶縁層を樹脂の種類を変えて２層以゛−１−とするこ
ともてきる。Furthermore, a self-lubricating layer and a self-adhesive layer can be provided, and the insulating layer can be made of two or more layers by changing the type of resin.
このような極細エナメル線にあっては、導体径か細いに
もかかわらず、その引張強度が高く、自動巻線時やアセ
ンブリ加工時なとにおい−Ｃ断線することがない。また
、導体径が細いにもかかわらず、導体抵抗か増加かなく
、巻回数を増加しても直流抵抗の増加がない。さらに、
無酸素銅であることから、高周波特性か良好であり、］
ＯＭＩＩｚ程度まての信号を低損失で伝送できる。In spite of the small conductor diameter, such ultra-fine enameled wire has high tensile strength and does not cause wire breakage during automatic winding or assembly processing. Furthermore, even though the conductor diameter is small, the conductor resistance does not increase, and even if the number of turns is increased, the DC resistance does not increase. moreover,
Since it is oxygen-free copper, it has good high frequency characteristics.]
Signals up to OMIIz level can be transmitted with low loss.
以下、具体例を示してこの発明の作用効果を明確にする
。Hereinafter, specific examples will be shown to clarify the effects of this invention.
〔試験例１〜１４〕 酸素含有量８ｐｐｍ、不可避不純物路ｆｆ１ｏ、ｏ。[Test Examples 1 to 14] Oxygen content 8 ppm, inevitable impurity path ff1o, o.
６重量％の無酸素銅に銀を種々の割合で添加し、デイプ
ホーミング法によって荒引線としたのら、連続伸線機に
よって径３０ ｉｔ ｍおよび７′ｌＯμｒｎの導体と
した。Silver was added in various proportions to 6% by weight of oxygen-free copper, and the wire was roughly drawn by a deep homing method, and then made into a conductor with a diameter of 30 it m and 7'lOμrn by a continuous wire drawing machine.
これらの導体について、その導体抵抗、引張強ｊ良およ
び（中ひを乙用定した。For these conductors, their conductor resistance, tensile strength, and medium strength were determined.
結果を第１表に示す。The results are shown in Table 1.
〔試験例１５〜２２〕
酸素含有ｆ、７ｔ２００ｐｐｍ、純度９９９８％のタフ
ピッチ銅に銀を種々の割合て添！Ｉｌ’ｌ Ｌ、連続鋳
造圧延ｔにによって伸線し、径３０μｍおよび／ＩＯμ
ｍの導体とした。[Test Examples 15 to 22] Various proportions of silver were added to tough pitch copper with an oxygen content of f, 7t, 200 ppm, and a purity of 9998%! Il'l L, drawn by continuous casting and rolling, diameter 30μm and /IOμ
m conductor.
これらの導体についてその導体抵抗、引張強度および伸
ひを測定した。The conductor resistance, tensile strength and elongation of these conductors were measured.
結果を第２１くに示す。The results are shown in the 21st column.
第１表および第２表の結束から銀を０．０３〜０５重量
％含有する無酸素銅から得られた導体は、従来の−・般
用電気銅（タフピッチ銅）およびこれに銀を少ｊｉ１′
添加した銀入り銅に比へて電気抵抗か少なく、かっ引張
強度か高いことかわかる。Conductors obtained from oxygen-free copper containing 0.03 to 05% by weight of silver from the bundles shown in Tables 1 and 2 are conventional electric copper for general use (tough pitch copper) and a small amount of silver added thereto. ′
It can be seen that the electrical resistance is lower and the tensile strength is higher than that of copper containing added silver.
また、銀を含有しない無酸素銅に比較しても電気抵抗か
ほぼ同効で、かつ引張強度か高いこともわかる。It can also be seen that compared to oxygen-free copper that does not contain silver, it has almost the same electrical resistance and higher tensile strength.
〔実施例１〜４〕
銀角イ■量０１重量％、酸素含イｆ晴８ｐｐｍ、不可避
不純物０００６小１１ｔ％の１１！℃酸素銅から導体径
３０ ノｌ ｍ、 ３５ ノｔ ｍ、
４ ０ μ ｍ、 ４ ５７１ ｍ の 導体
を得たのら、ポリウレタン塗料を塗布、焼イー・１して
厚さ／１１１ｍのポリウレタンの絶縁層を１１３成して
極ｒｔｎ エナメル線どした。[Examples 1 to 4] 11% by weight of silver square, 8 ppm of oxygen, and 11 t% of unavoidable impurities! Conductor diameter from ℃ oxygen copper: 30 nol m, 35 nom,
After obtaining a conductor of 40 μm and 4571 m, it was coated with polyurethane paint, baked to form an insulating layer of polyurethane with a thickness of 111 m, and then made into a RTN enamelled wire.
これらの極細エナメル線について、絶縁層のピンポール
個数、絶縁破壊電圧、引張強度、沖ひ、’１４ ＩＴ＋
（τｊけ性を４［す定した。ピノポール個数はＩｔｓ
Ｏ−３００３Ｋに準処してエナメル線５ ｍ ”’）た
りの個数で表した。また、半１’ｌＪイー・ｊけ性は１
１１１Ｉ〆１１１１１−丸か３８０°Ｃて、２秒間て半
田てｊ’：ｈ’れたものを良とした。Regarding these ultra-fine enameled wires, the number of pinpoles in the insulating layer, dielectric breakdown voltage, tensile strength, Okihi, '14 IT+
(τj resistance was set to 4. The number of pinopoles is
In accordance with O-3003K, it is expressed as the number of pieces per 5 m of enameled wire.Also, the half 1'lJ E・j sharpness is 1
111I〆11111-Those soldered at 380°C for 2 seconds were considered good.
結果を第３表に示す。The results are shown in Table 3.
〔比較例１〜３〕
酸素含有量２００ｐｐｍ、純度９９９８％のタフピッチ
銅から導体径３０μｍ、４０μｒｎ、５Ｑ７１ ｍの導
体を得たのら、ポリウレタン塗料を塗イ１−Ｊ、焼イ・
１して厚さ４ノｚｍのポリウレタンの絶縁層を）ｌニ成
して極細エナメル線を得た。[Comparative Examples 1 to 3] After obtaining a conductor with a conductor diameter of 30 μm, 40 μrn, and 5Q71 m from tough pitch copper with an oxygen content of 200 ppm and a purity of 9998%, a polyurethane paint was applied.
Then, an insulating layer of polyurethane having a thickness of 4 nm was formed to obtain an ultrafine enameled wire.
これらについて、実施例と同様にしてピンポール個数、
絶縁Ｇ皮壊電圧、引張強度、伸ひ、半田付は性を１１１
１定し、第４表に示した。Regarding these, the number of pin poles,
Insulation G skin breakdown voltage, tensile strength, elongation, soldering properties are 111
1 and shown in Table 4.
〔実施例５〕
銀含有量０１市ｈ１％、酸素こ町有量８ｐｐｍ、不可避
不純物０００６重Ｉτｔ％の無酸素銅から径４０μｍの
導体を得たのち、厚さ３５μｍのポリウレタンの絶縁層
を設け、この上に厚さ０５μｍのナイロンの１′１己潤
謂層を設けて極細エナメル線を得た。このものについて
ピンポール個数、絶縁破壊電圧、引張強度、伸ひ、半田
（：Ｉけ性を求めた。[Example 5] A conductor with a diameter of 40 μm was obtained from oxygen-free copper with a silver content of 01 h1%, an oxygen content of 8 ppm, and an inevitable impurity of 0006 wt%, and then an insulating layer of polyurethane with a thickness of 35 μm was provided. A 1'1 self-lubricating layer of nylon having a thickness of 05 μm was provided on this to obtain an ultrafine enameled wire. The number of pin poles, dielectric breakdown voltage, tensile strength, elongation, and solderability were determined for this product.
結果を第３表に（１： ｔｊて示す。The results are shown in Table 3 (1:tj).
〔実施例６〕
実施例５て用いた導体上に厚さ３５μｍのボッウレタン
の絶縁層を設け、この上に厚さ０５７１ ｍのリーイロ
ンの自己潤謂層を設け、さらにこの上に厚さ１μｍのポ
リビニルフチラールの自己接着層を設けて極細エナメル
線を得た。このものについてピンポール個数、絶縁破壊
電圧、引張強度、仲ひ、半１’１１１（τｊは性を求め
た。[Example 6] On the conductor used in Example 5, an insulating layer of urethane with a thickness of 35 μm was provided, a self-lubricating layer of Leeron with a thickness of 0571 m was provided on this, and a layer of self-lubricating iron with a thickness of 1 μm was further applied on this. An ultrafine enameled wire was obtained by providing a self-adhesive layer of polyvinyl phthyral. Regarding this material, the number of pin poles, dielectric breakdown voltage, tensile strength, thickness, and half 1'111 (τj is the property) were determined.
結果を第３表に併＝Ｕて示す。The results are shown in Table 3 with =U.
以」二説明したように、この発明の極細エナメル線は０
０３〜０．５重量％の銀（Δｇ）をｆηイ１し、残部か
銅（Ｃｕ）である無酸素銅（（ｌ”ｊ Ｌ、不「」避的
不純物を含む）からなり、かっ沖ひか７％以上の導体」
二に絶縁層を設けたちのであるので、導体抵抗を増加す
ることなくその引７１Ｎ強度を大幅に向上させることか
でき、よって導体径／ＩＯμｍ程度以下どしても高速［
１動巻線加り時やアセンフｊ−加工時なとに発生ずる断
線事故を皆無とすることかできる。また、引張強度か１
・分高いので、更に極細化か可能であり、例えば３０μ
ｆｆｌ以１′：の超極細エナメル線としても断線の恐れ
かなく、磁気ヘット等のコイルに適用可能となる。As explained below, the ultrafine enameled wire of this invention has a
03 to 0.5% by weight of silver (Δg) is mixed with fη, and the remainder is copper (Cu), which is oxygen-free copper ((l''j L, including unavoidable impurities). Conductor with 7% or more
Second, since an insulating layer is provided, the tensile strength of 71N can be greatly improved without increasing the conductor resistance.
It is possible to completely eliminate wire breakage accidents that occur when applying the first moving winding or when assembling the winding. Also, the tensile strength is 1
・Since it is expensive, it is possible to make it even finer, for example, 30 μ
Even as an ultra-fine enameled wire of ffl to 1', there is no risk of wire breakage, and it can be applied to coils of magnetic heads, etc.
Claims (3)
残部か銅（Ｃｕ）である無酸素銅（但し、不可避的不純
物を含む）からなる伸び７％以上の導体上に絶縁層を設
けたことを特徴とする極細エナメル線。(1) Contains 0.03 to 0.5% by weight of silver (Ag),
An ultrafine enameled wire characterized in that an insulating layer is provided on a conductor having an elongation of 7% or more and made of oxygen-free copper (including inevitable impurities), the remainder of which is copper (Cu).
添加して得られたものである請求項（１）記載の極細エ
ナメル線。(2) The ultrafine enameled wire according to claim (1), wherein the conductor is obtained by adding silver to oxygen-free copper having a purity of 99.99% or more.
の極細エナメル線。(3) The ultrafine enameled wire according to claim (1), wherein the conductor diameter is 40 μm or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1101306A JP2602546B2 (en) | 1989-04-20 | 1989-04-20 | Extra fine enameled wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1101306A JP2602546B2 (en) | 1989-04-20 | 1989-04-20 | Extra fine enameled wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02278608A true JPH02278608A (en) | 1990-11-14 |
| JP2602546B2 JP2602546B2 (en) | 1997-04-23 |
Family
ID=14297128
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1101306A Expired - Fee Related JP2602546B2 (en) | 1989-04-20 | 1989-04-20 | Extra fine enameled wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2602546B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6627009B1 (en) * | 1999-11-19 | 2003-09-30 | Hitachi Cable Ltd. | Extrafine copper alloy wire, ultrafine copper alloy wire, and process for producing the same |
| US6674011B2 (en) * | 2001-05-25 | 2004-01-06 | Hitachi Cable Ltd. | Stranded conductor to be used for movable member and cable using same |
| JP2010218927A (en) * | 2009-03-18 | 2010-09-30 | Autonetworks Technologies Ltd | Vehicular electric wire conductor for automobile, and vehicular electric wire |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6062009A (en) * | 1983-09-14 | 1985-04-10 | 日立電線株式会社 | Composite superconductor stabilized by ag-filled oxygenless copper |
-
1989
- 1989-04-20 JP JP1101306A patent/JP2602546B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6062009A (en) * | 1983-09-14 | 1985-04-10 | 日立電線株式会社 | Composite superconductor stabilized by ag-filled oxygenless copper |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6627009B1 (en) * | 1999-11-19 | 2003-09-30 | Hitachi Cable Ltd. | Extrafine copper alloy wire, ultrafine copper alloy wire, and process for producing the same |
| US6674011B2 (en) * | 2001-05-25 | 2004-01-06 | Hitachi Cable Ltd. | Stranded conductor to be used for movable member and cable using same |
| JP2010218927A (en) * | 2009-03-18 | 2010-09-30 | Autonetworks Technologies Ltd | Vehicular electric wire conductor for automobile, and vehicular electric wire |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2602546B2 (en) | 1997-04-23 |
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