JPH0227768U - - Google Patents
Info
- Publication number
- JPH0227768U JPH0227768U JP10557788U JP10557788U JPH0227768U JP H0227768 U JPH0227768 U JP H0227768U JP 10557788 U JP10557788 U JP 10557788U JP 10557788 U JP10557788 U JP 10557788U JP H0227768 U JPH0227768 U JP H0227768U
- Authority
- JP
- Japan
- Prior art keywords
- holes
- filled
- conductive
- hole conductors
- conductive resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 230000001681 protective effect Effects 0.000 claims 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988105577U JPH0547485Y2 (US20090163788A1-20090625-C00002.png) | 1988-08-10 | 1988-08-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988105577U JPH0547485Y2 (US20090163788A1-20090625-C00002.png) | 1988-08-10 | 1988-08-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0227768U true JPH0227768U (US20090163788A1-20090625-C00002.png) | 1990-02-22 |
| JPH0547485Y2 JPH0547485Y2 (US20090163788A1-20090625-C00002.png) | 1993-12-14 |
Family
ID=31338318
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988105577U Expired - Lifetime JPH0547485Y2 (US20090163788A1-20090625-C00002.png) | 1988-08-10 | 1988-08-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0547485Y2 (US20090163788A1-20090625-C00002.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101055516B1 (ko) * | 2003-04-02 | 2011-08-08 | 가부시기가이샤 후지고오키 | 전동 밸브 |
| JP2018170506A (ja) * | 2017-03-29 | 2018-11-01 | 京セラ株式会社 | 回路基板およびこれを備える電子装置 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58219796A (ja) * | 1982-06-15 | 1983-12-21 | 松下電器産業株式会社 | 導体層接続装置 |
| JPS60167489A (ja) * | 1984-02-10 | 1985-08-30 | 富士通株式会社 | セラミツク回路基板の製造方法 |
| JPS627194A (ja) * | 1985-07-04 | 1987-01-14 | 旭化成株式会社 | スル−ホ−ル回路 |
| JPS6265496A (ja) * | 1985-09-18 | 1987-03-24 | 日本シイエムケイ株式会社 | プリント配線板の製造法 |
| JPS6411397A (en) * | 1987-07-03 | 1989-01-13 | Hokuriku Elect Ind | Manufacture of circuit board |
| JPH0171465U (US20090163788A1-20090625-C00002.png) * | 1987-10-30 | 1989-05-12 |
-
1988
- 1988-08-10 JP JP1988105577U patent/JPH0547485Y2/ja not_active Expired - Lifetime
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58219796A (ja) * | 1982-06-15 | 1983-12-21 | 松下電器産業株式会社 | 導体層接続装置 |
| JPS60167489A (ja) * | 1984-02-10 | 1985-08-30 | 富士通株式会社 | セラミツク回路基板の製造方法 |
| JPS627194A (ja) * | 1985-07-04 | 1987-01-14 | 旭化成株式会社 | スル−ホ−ル回路 |
| JPS6265496A (ja) * | 1985-09-18 | 1987-03-24 | 日本シイエムケイ株式会社 | プリント配線板の製造法 |
| JPS6411397A (en) * | 1987-07-03 | 1989-01-13 | Hokuriku Elect Ind | Manufacture of circuit board |
| JPH0171465U (US20090163788A1-20090625-C00002.png) * | 1987-10-30 | 1989-05-12 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101055516B1 (ko) * | 2003-04-02 | 2011-08-08 | 가부시기가이샤 후지고오키 | 전동 밸브 |
| JP2018170506A (ja) * | 2017-03-29 | 2018-11-01 | 京セラ株式会社 | 回路基板およびこれを備える電子装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0547485Y2 (US20090163788A1-20090625-C00002.png) | 1993-12-14 |
