JPH02276214A - Electronic part - Google Patents
Electronic partInfo
- Publication number
- JPH02276214A JPH02276214A JP1098257A JP9825789A JPH02276214A JP H02276214 A JPH02276214 A JP H02276214A JP 1098257 A JP1098257 A JP 1098257A JP 9825789 A JP9825789 A JP 9825789A JP H02276214 A JPH02276214 A JP H02276214A
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- lead
- electronic component
- wire
- electrolytic capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000003990 capacitor Substances 0.000 abstract description 18
- 230000008961 swelling Effects 0.000 abstract 3
- 239000000758 substrate Substances 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 11
- 239000011888 foil Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000007743 anodising Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は一般電子機器に用いられる電子部品に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to electronic components used in general electronic equipment.
従来の技術
以下、−例としてアルミ電解コンデンサを例にとって説
明する。2. Description of the Related Art The following describes an aluminum electrolytic capacitor as an example.
従来のアルミ電解コンデンサは第３図に示すように高純
度アルミニウム箔を粗面化して表面積を拡大し、陽極酸
化により誘電体酸化皮膜を形成してなる陽極箔６と陰極
箔６に引出リード線２のリード板７を接続し、セパレー
タ８と共に巻回し、駆動用電解液を含浸してコンデンサ
素子４を形成している。その後、第４図に示すようにコ
ンデンサ素子４を有底筒状金属ケース９に収納し、開放
端を封口部材１０を用いて封口し絶縁チューブ１１を装
着して完成品としている。As shown in Fig. 3, conventional aluminum electrolytic capacitors are made by roughening high-purity aluminum foil to increase its surface area, and forming a dielectric oxide film by anodizing.The anode foil 6 and cathode foil 6 are connected to lead wires. The capacitor element 4 is formed by connecting two lead plates 7, winding them together with a separator 8, and impregnating them with a driving electrolyte. Thereafter, as shown in FIG. 4, the capacitor element 4 is housed in a bottomed cylindrical metal case 9, the open end is sealed using a sealing member 10, and an insulating tube 11 is attached to complete the product.
この電解コンデンサを使用する一例として第６図に示す
ように引出リード線２を折り曲げて印刷基板１２に挿入
しリード先端を半田付けする。この際、電解コンデンサ
本体１と印刷基板１２との間にスペーサー１３により空
隙１４を設け、印刷基板１２の配線との絶縁及び他の電
子部品を取り付けるスペースとして利用されているのが
多い。As an example of using this electrolytic capacitor, as shown in FIG. 6, the lead wire 2 is bent and inserted into the printed circuit board 12, and the tip of the lead is soldered. At this time, a gap 14 is provided between the electrolytic capacitor body 1 and the printed circuit board 12 by a spacer 13, and is often used as insulation from the wiring of the printed circuit board 12 and as a space for attaching other electronic components.
１６は半田である。16 is solder.
発明が解決しようとする課題
しかし、引出リード線を出来る限り封口部材近くで折り
曲げようとすれば、第６図に示すように封口部材内の人
を支点としてコンデンサ素子内部にもストレスが加わり
、特性を損なう恐れがある。Problems to be Solved by the Invention However, if you try to bend the lead wire as close to the sealing member as possible, stress is applied to the inside of the capacitor element using the person inside the sealing member as a fulcrum, as shown in Figure 6, and the characteristics may be damaged.
また、印刷基板との間に空隙を設ける場合、印刷基板の
孔に挿入する引出リード線が所定の位置で止まる必要が
有り、一般的には第７図ａ −ｃに示す様なフォーミン
グ１６を必要とする。In addition, if a gap is provided between the printed circuit board and the printed circuit board, it is necessary for the lead wire inserted into the hole in the printed circuit board to stop at a predetermined position. I need.
本発明はこれらの問題点を同時に解決し、しかも容易に
生産出来る電子部品を提供するものである。The present invention solves these problems at the same time and provides an electronic component that can be easily produced.
課題を解決するだめの手段
この問題点を解決するための本発明の手段は、引出リー
ド線を所定の寸法に切断すると同時に、電子部品本体近
くと、これより電子部品外径の１／２以上間隔を開けた
引出リード線の先端部分の２箇所をリード線径より大き
くなるように押しつぶしたものである。Means for Solving the Problem The means of the present invention for solving this problem is to cut the lead wire to a predetermined size, and at the same time cut the lead wire to a predetermined size, and at the same time cut the lead wire to a part near the electronic component main body and from this point to a part of the electronic component that is at least 1/2 of the outer diameter of the electronic component. Two parts of the distal ends of the lead wires spaced apart are crushed so as to be larger than the diameter of the lead wires.
作用
本発明の電子部品によれば、引出リード線を電子部品の
本体近くで容易に折り曲げることが出来、電子部品内部
に加わるストレスを軽減することが出来るため、特性を
損なうことはない。また、印刷基板に挿入する際も、先
端部分のふくらみによシ印刷基板の孔を通過することは
なく、所定の位置で止まることになる。According to the electronic component of the present invention, the lead wire can be easily bent near the main body of the electronic component, and the stress applied to the inside of the electronic component can be reduced, so that the characteristics are not impaired. Also, when inserting it into a printed circuit board, the bulge at the tip prevents it from passing through the hole in the printed circuit board, and it stops at a predetermined position.
実施例 以下、本発明の一実施例につき図面を用いて説明する。Example Hereinafter, one embodiment of the present invention will be described using the drawings.
第１図ａ −ｃに本発明の一実施例によるアルミ電解コ
ンデンサを示しているように引出リード線２を電解コン
デンサ本体１近くにリード線径より大きくなるように押
しつぶしたふくらみ３を設け、さらに外径りの１／２以
上間隔を開けた箇所にも同様のふくらみ３′を設けてい
る。同時に引出リード線２は所定の寸法に切断しである
。このリード線に設けたふくらみ３の部分を直角に折シ
曲げ、第２図ａ、ｂに示すように印刷基板１２に実装す
る。As shown in FIGS. 1a to 1c, an aluminum electrolytic capacitor according to an embodiment of the present invention, a bulge 3 is provided near the electrolytic capacitor main body 1 in which the lead wire 2 is pressed to be larger than the diameter of the lead wire. Similar bulges 3' are also provided at locations spaced apart by 1/2 or more of the outer diameter. At the same time, the lead wire 2 is cut to a predetermined size. The bulge 3 provided on this lead wire is bent at right angles and mounted on the printed circuit board 12 as shown in FIGS. 2a and 2b.
第２図は、印刷基板に挿入した図を示している。FIG. 2 shows a view inserted into a printed circuit board.
引出しリード線２のふくらみ３′が印刷基板１２の孔を
通過せず、所定の位置で止まっている。The bulge 3' of the lead wire 2 does not pass through the hole in the printed circuit board 12, but remains at a predetermined position.
発明の効果
以上のように本発明によれば、電子部品の引出リード線
の折り曲げによるストレスが電子部品本体に加わるのを
軽減し特性を損なう心配がなく、また従来のフォーミン
グと同機能を持たせたものを容易に生産出来る。Effects of the Invention As described above, according to the present invention, the stress caused by bending the lead wire of an electronic component is reduced from being applied to the electronic component body, there is no fear of damaging the characteristics, and the same function as conventional forming is achieved. can be easily produced.
第１図ａ −ｏは本発明の一実施例によるアルミ電解コ
ンデンサの上面図、正面図及び側面図、第２図ａ、ｂは
本発明アルミ電解コンデンサの使用例を示した正面図及
び側面図、第３図はアルミ電解コンデ、ンサ素子を示す
分解斜視図、第４図はアルミ電解コンデンサの断面図、
第６図はアルミ電解コンデンサの一般的使用例を示す正
面図、第６図はアルミ電解コンデンサのリードを折９曲
げた断面図、第７図ａ −Ｃはアルミ電解コンデンサの
フォーミング例の正面図である。
１・・・・・・電解コンデンサ本体、２・・・・・・引
出しリード線、３．３′・・・・・・プレスによるふく
らみ。
代理人の氏名 弁理士 粟 野 重 孝 はが１名１ｘ
１図 （Ｕ
（ｂ）
（Ｃ）
第 ２ 図
（α）
（ｂ）
／Ｚ
ｌど
宵
図
第
図
第
第
図
図
びり
（ｂ）
（Ｑ）Figures 1a-o are top views, front views, and side views of an aluminum electrolytic capacitor according to an embodiment of the present invention, and Figures 2a and b are front views and side views showing examples of use of the aluminum electrolytic capacitor of the present invention. , Figure 3 is an exploded perspective view showing the aluminum electrolytic capacitor and sensor element, Figure 4 is a cross-sectional view of the aluminum electrolytic capacitor,
Figure 6 is a front view showing a typical usage example of an aluminum electrolytic capacitor, Figure 6 is a cross-sectional view of an aluminum electrolytic capacitor with the lead bent 9, and Figure 7 a-C is a front view of an example of forming an aluminum electrolytic capacitor. It is. 1... Electrolytic capacitor body, 2... Lead wire, 3.3'... Bulge due to press. Name of agent: Patent attorney Shigetaka Awano 1 person 1x
Figure 1 (U (b) (C) Figure 2 (α) (b) /Z
Claims (2)
出リード線を所定の寸法に切断するとともに、電子部品
本体近くとリード線の先端部分の２箇所をリード線の直
径より大きくなるように押しつぶしたことを特徴とする
電子部品。(1) At least two lead wires drawn out from the electronic component body were cut to a predetermined size, and two parts, one near the electronic component body and the tip of the lead wire, were crushed to be larger than the diameter of the lead wire. An electronic component characterized by:
隔は、電子部品外径の１／２以上としたことを特徴とす
る請求項１記載の電子部品。(2) The electronic component according to claim 1, wherein the distance between the two places where the lead wire is crushed larger than the diameter thereof is 1/2 or more of the outer diameter of the electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1098257A JPH02276214A (en) | 1989-04-18 | 1989-04-18 | Electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1098257A JPH02276214A (en) | 1989-04-18 | 1989-04-18 | Electronic part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02276214A true JPH02276214A (en) | 1990-11-13 |
Family
ID=14214906
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1098257A Pending JPH02276214A (en) | 1989-04-18 | 1989-04-18 | Electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02276214A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5719806A (en) * | 1980-07-09 | 1982-02-02 | Toyota Central Res & Dev Lab Inc | Fluctuation driving device |
| JPS61196819A (en) * | 1985-02-25 | 1986-09-01 | Omron Tateisi Electronics Co | Shading blind motion controller for car rear window |
| JPS6449594U (en) * | 1987-09-18 | 1989-03-28 |
-
1989
- 1989-04-18 JP JP1098257A patent/JPH02276214A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5719806A (en) * | 1980-07-09 | 1982-02-02 | Toyota Central Res & Dev Lab Inc | Fluctuation driving device |
| JPS61196819A (en) * | 1985-02-25 | 1986-09-01 | Omron Tateisi Electronics Co | Shading blind motion controller for car rear window |
| JPS6449594U (en) * | 1987-09-18 | 1989-03-28 |
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