JPH02271649A - Resin sealed semiconductor device - Google Patents

Abstract

PURPOSE:To enable the title item to be replaced with a normal one even if failures such as improper marking and marking failure occur and to be used without disposing of it by forming a recessed part at the upper part of a resin package into another body and fitting a resin plate for printing which is printed by laser machining. CONSTITUTION:A resin plate for printing 11 which is formed separately from a resin package 13 within a recessed part 15 of the resin package 13 and which is printed by laser machining is fitted. Thus, when a character 12, symbol, etc., other than those specified are printed for producing improper marking or the printed character 12, symbol, etc., are partially unclear leading to mark failure, or the resin plate for printing 11 is attached to the resin package 13, this resin plate for improper printing 11 is removed and is replaced by a normal one. Thus, a semiconductor device with improper marking and marking failure can be used as a product.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a resin-sealed semiconductor device on which characters, symbols, etc. are printed by laser processing.

[Conventional technology]

A conventional resin-sealed semiconductor device of this type was constructed as shown in FIG.

FIG. 3 is a perspective view showing a conventional resin-sealed semiconductor device.
In the figure, reference numeral 1 indicates a resin package as the main body of the resin-sealed semiconductor device, and a plurality of beams 2 are provided protruding from the side of the resin package 1. 3 is a character indicating the brand name, product number, etc. of this resin-sealed semiconductor device, and this character 3 is printed on the upper surface of the resin package 1 by laser processing. Normally, in order to print the above-mentioned characters 3, symbols (not shown), etc. on the resin package 1, a laser beam emitted from a laser oscillator is passed through a mask on which a pattern of characters, symbols, etc. is formed, and then the resin is printed. This is done by irradiating the package. When the resin pan cage 1 is irradiated with laser light, its surface becomes approximately 5 to 10
Character 3. Burnt to a depth of μm. Symbols, etc. are printed.

[Problem to be solved by the invention]

However, in such a resin-sealed semiconductor device on which characters 3, symbols, etc. are printed by laser processing, characters 3. other than the predetermined ones may be accidentally printed. Symbols, etc. are printed, causing incorrect marks, or printed characters 3. If the symbol etc. is partially unclear and there is a defective mark, please use the character 3
．． Since the symbols and the like are carved and printed on the surface of the resin package 1, it is difficult to modify them. A resin-sealed semiconductor device with such erroneous marks or defective marks cannot be used as a product.

[Means to solve the problem]

In the resin-sealed semiconductor device according to the present invention, a recess is formed in the upper part of the resin package, and a resin plate for printing, which is formed separately from the resin package and is printed by laser processing, is fitted into the recess. It is something.

[For production]

When a printing resin board with an erroneous mark or mark defect is attached to a resin package, the printing resin board can be removed and replaced with a normal one.

〔Example〕

Hereinafter, one embodiment of the present invention will be described in detail with reference to FIGS. 1 and 2.

FIG. 1 is a perspective view showing a resin-sealed semiconductor device according to the present invention, and FIG. 2 is an exploded perspective view showing the resin plate for printing removed. In these figures, reference numeral 11 denotes a printing resin board for writing characters and symbols such as the brand of the semiconductor device and the product number. , and characters 12 are printed on the upper surface thereof by laser processing.

Further, this printing resin plate 11 is fitted into a recessed portion of a resin package, which will be described later, with the printing surface facing upward.

A laser mark device (not shown) is used to print the characters 12 on this printing resin board 11, and the laser beam emitted from the laser oscillator of this laser mark device is used to print the characters,
This is done by irradiating the printing resin plate 11 through a mask on which a pattern such as a symbol is formed.

Reference numeral 13 denotes a resin package as the main body of the resin-sealed semiconductor device according to the present invention, and this resin package 13 is integrally made of resin with emphasis on protection performance in order to protect the built-in semiconductor element (not shown). Leads 14 connected to an external device F (not shown) are protruded from both sides thereof, and a recess 15 is formed at the top for attaching a resin plate for printing, which will be described later. . The recess 15
The opening size is such that the printing resin plate 11 is placed inside this recess 15.
It is set to be slightly smaller than the external dimensions of the printing resin plate 11 so that the resin package 13 is press-fitted. is filled into a mold (not shown),
This resin is cured, and a molding die provided with a protrusion for forming the recess 15 is used. That is, the recess 15 is formed at the same time as the resin package 13 is molded.

The resin-sealed semiconductor device constructed in this way is assembled by fitting the resin plate 11 for printing onto the resin package 13, and the resin plate 11 for printing is used on which characters 12 are printed in advance. During normal use, the printing resin plate 11 is press-fitted into the recess 15, so it will not fall off from the resin package 13;
Since it is simply fitted inside, it can be removed if necessary. Therefore, in the resin-sealed semiconductor device configured as described above, characters 12, symbols, etc. other than the predetermined ones may be printed by mistake, resulting in erroneous marks, or the printed characters 12. When a resin plate 11 for printing on which symbols, etc. are partially unclear and defective marks are attached to the resin package 13, it is possible to remove the resin plate 11 for printing defective and replace it with a normal one. can.

Note that if the printing resin board 11 is formed separately from the resin package 13 as described above, dyes or the like can be added to the raw resin of the printing resin board 11 without affecting the reliability of the semiconductor device. It is also possible to improve the coloring properties by mixing them as a resin for laser marks. In this way, characters, symbols, etc. are printed clearly, and easy-to-read characters, symbols, etc. can be obtained. Furthermore, since the printing resin plate 11 is manufactured in a separate process from the main body of the semiconductor device, it is possible to protect the semiconductor device main body from the surrounding environment, static electricity, etc. during laser processing. This simplifies the handling of the workpiece because the semiconductor device becomes unnecessary and the effort of handling the semiconductor device carefully to prevent bending or deformation of the leads.Furthermore, printing When handling a resin-sealed semiconductor device that has been assembled with the printing resin board 11 installed, even if scratches or the like occur on the top surface of the resin buff cage 13 and the characters 12 become unclear, the printing resin board 11 It can be fixed by replacing.

〔Effect of the invention〕

As explained above, according to the present invention, a recess is formed in the upper part of the resin package, and a printing resin plate formed separately from the resin package and printed by laser processing is fitted into the recess. When a printing resin board with an erroneous mark or mark defect is attached to a resin package, the printing resin board can be removed and replaced with a normal one. Therefore, even if a problem occurs with characters, symbols, etc. due to laser processing, it can be easily corrected by replacing the printing resin plate, and expensive resin-sealed semiconductor devices can be used without being discarded. It is possible to keep costs low.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing a resin-sealed semiconductor device according to the present invention, FIG. 2 is an exploded perspective view showing the resin plate for printing removed, and FIG. 3 is a conventional resin-sealed semiconductor device. FIG. 11... Resin plate for printing, 12... Characters, 13...
...resin package, 15...recess.

Claims (1)

[Claims] In a resin-sealed semiconductor device that has a resin package and is printed by laser processing, a recess is formed in the upper part of the resin package, and in this recess, markings are formed separately from the resin package and printed by laser processing. A resin-sealed semiconductor device characterized by having a resin plate for printing attached thereto.