JPH0226677Y2 - - Google Patents
Info
- Publication number
- JPH0226677Y2 JPH0226677Y2 JP1984197951U JP19795184U JPH0226677Y2 JP H0226677 Y2 JPH0226677 Y2 JP H0226677Y2 JP 1984197951 U JP1984197951 U JP 1984197951U JP 19795184 U JP19795184 U JP 19795184U JP H0226677 Y2 JPH0226677 Y2 JP H0226677Y2
- Authority
- JP
- Japan
- Prior art keywords
- ink supply
- substrate
- holding member
- nozzle plate
- supply hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 43
- 229920003002 synthetic resin Polymers 0.000 claims description 4
- 239000000057 synthetic resin Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910052580 B4C Inorganic materials 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Ink Jet (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Description
【考案の詳細な説明】
〔考案の利用分野〕
本考案はインクジエツトプリンタの記録ヘツド
に係り、特に記録ヘツドのインク供給穴に関する
ものである。[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to a recording head of an inkjet printer, and particularly relates to an ink supply hole of the recording head.
第２図及び第３図は従来例を示し、第２図は分
解斜視図、第３図は第２図のＡ−A′線の断面図
である。
2 and 3 show a conventional example, with FIG. 2 being an exploded perspective view and FIG. 3 being a sectional view taken along line A-A' in FIG.
第２図において２１はニツケル、ステンレス等
よりなるノズル板、２２は該ノズル板２１に設け
たインクを吐出するための吐出口、３１は第３図
に示す如く、ノズル板２１の周縁に形成されたリ
ブで、該リブ３１は、ノズル板２１の表面２１ａ
よりハーフパンチ等の方法により裏面２１ｂに突
出形成されている。２４はガラス、セラミツク等
より成る基板で、該基板２４の一面には薄膜、半
導体製造等の技術により窒化タンタル等の抵抗層
が形成され、その上に電気信号を加えるための配
線パターン２７がアルミ、ニツケル等により形成
され、前記抵抗層の一部がパターン２７から露出
して発熱部２６を形成している。また基板２４の
表面はパターン２７を保護するために二酸化ケイ
素、シリコンカーバイト等による保護膜が形成さ
れている。２５は基板２４を貫通して形成された
インク供給穴である。２８はフレキシブル配線板
で、前記配線パターン２７は該フレキシブル配線
板２８に導出され、ここから電気信号を加えるよ
うになつている。 In FIG. 2, 21 is a nozzle plate made of nickel, stainless steel, etc., 22 is an ejection port provided on the nozzle plate 21 for ejecting ink, and 31 is formed on the periphery of the nozzle plate 21, as shown in FIG. The rib 31 has a surface 21a of the nozzle plate 21.
It is formed protrudingly on the back surface 21b by a method such as half punching. Reference numeral 24 denotes a substrate made of glass, ceramic, etc. A resistive layer of tantalum nitride or the like is formed on one surface of the substrate 24 by thin film or semiconductor manufacturing techniques, and a wiring pattern 27 for applying an electric signal is formed on the substrate using aluminum. , nickel, etc., and a portion of the resistive layer is exposed from the pattern 27 to form a heat generating portion 26 . Further, a protective film made of silicon dioxide, silicon carbide, or the like is formed on the surface of the substrate 24 to protect the pattern 27. 25 is an ink supply hole formed through the substrate 24. 28 is a flexible wiring board, and the wiring pattern 27 is led out to the flexible wiring board 28, from which an electric signal is applied.
前記基板２４には、前記ノズル板２１が重合さ
れ、この際、リブ３１によつて両者間に空隙が形
成され、該空隙は周囲を接着剤で適宜密閉するこ
とによつてインク供給室が形成され、また基板２
４の発熱部２６はノズル板２１に対向するように
なつている。 The nozzle plate 21 is superimposed on the substrate 24, and at this time, a gap is formed between them by the ribs 31, and an ink supply chamber is formed by appropriately sealing the periphery of the gap with an adhesive. and also board 2
The heat generating part 26 of No. 4 is arranged to face the nozzle plate 21.
従来の記録ヘツドは上述の如き構造を有し、フ
レキシブル配線板２８のパターン２７から電気信
号を加えることにより、発熱部２６に熱エネルギ
ーが発生し、発熱部２６に接触しているインク中
に気泡が発生し、発熱部２６に対向するノズル板
２１の吐出口２２よりインクが吐出し図示省略せ
る記録紙に印字されるようになつている。 The conventional recording head has the above-described structure, and by applying an electric signal from the pattern 27 of the flexible wiring board 28, thermal energy is generated in the heat generating part 26, and air bubbles are generated in the ink that is in contact with the heat generating part 26. is generated, and ink is ejected from the ejection openings 22 of the nozzle plate 21 facing the heat generating portion 26 and printed on recording paper (not shown).
ところで、基板２４に形成されるインク供給穴
２５は、基板２４がガラス等よりなることから従
来超音波加工、若くはエツチング等の方法が使用
されていた。 Incidentally, since the substrate 24 is made of glass or the like, methods such as ultrasonic processing and etching have conventionally been used to form the ink supply holes 25 formed in the substrate 24.
前者の超音波加工により形成した場合は、基板
２４にチツピング等が発生しやすく、また、加工
に使用するボロンカーバイト等の砥粒により、基
板２４上に形成された発熱部２６及び配線パター
ン２７等を破損したりする欠点があり、後者のエ
ツチングにより形成した場合は、基板２４が0.3
mm〜１mm程度の厚さであることにより、サイドエ
ツヂが発生し、インク供給穴２５の穴径がばらつ
くという欠点があつた。 If the former is formed by ultrasonic processing, chipping etc. are likely to occur on the substrate 24, and the heating portions 26 and wiring patterns 27 formed on the substrate 24 may be damaged by the abrasive grains such as boron carbide used in the processing. If the latter etching is used, the substrate 24 may be damaged by 0.3
Due to the thickness of approximately 1 mm to 1 mm, side edges occur and the diameter of the ink supply hole 25 varies.
本考案は上記従来の欠点を解消せんとするもの
であり、本考案の目的はインク供給穴の製造工程
が簡単で製造コストが安く、且つインク供給穴の
形状寸法が安定な記録ヘツドを提供せんとするも
のである。
The present invention aims to solve the above-mentioned conventional drawbacks, and the purpose of the present invention is to provide a recording head in which the manufacturing process of the ink supply hole is simple, the manufacturing cost is low, and the shape and dimensions of the ink supply hole are stable. That is.
本考案は上記目的を達成するために、合成樹脂
材よりなる基板保持部材にインク供給穴を設ける
ことによつて、インク供給穴の製造工程が簡単と
なつて製造コストが安くなり、且つインク供給穴
の形状寸法を安定にし得るという特徴を有するも
のである。
In order to achieve the above object, the present invention provides an ink supply hole in a substrate holding member made of a synthetic resin material, which simplifies the manufacturing process of the ink supply hole and reduces manufacturing costs. It has the feature that the shape and dimensions of the hole can be stabilized.
第１図は本考案の実施例を示す分解斜視図であ
る。図面において１はニツケル、ステンレス等よ
りなるノズル板、２はインクを吐出するための吐
出口、３はガラス等から成る基板で、該基板３の
一面には薄膜、半導体製造技術等の技術により窒
化タンタル等の抵抗層が形成され、その上に電気
信号を加えるための配線パターン４がアルミ、ニ
ツケル等により形成され、前記抵抗層の一部がパ
ターン４から露出して発熱部５を形成している。。
６は基板３の端部に接合されたフレキシブル配線
板で、前記配線パターン４は該配線板６に導出さ
れ、、ここから電気信号を加えるようになつてい
る。７は合成樹脂材から成る基板保持部材、８は
該部材７の一面の上半部に形成された凹部、９は
該凹部８から基板保持部材７の下半部に渉つて設
けられた基板３と略同型の基板嵌合用凹部で、該
凹部９の深さは、基板３の厚さと略同寸法に設定
されている。１０は凹部８の周縁に斜線で示した
ノズル板接合部、１１は基板保持部材６の前記凹
部８内において基板保持部材７を貫通して設けた
インク供給穴である。次に組立てについて述べ
る。
FIG. 1 is an exploded perspective view showing an embodiment of the present invention. In the drawing, 1 is a nozzle plate made of nickel, stainless steel, etc., 2 is an ejection port for ejecting ink, and 3 is a substrate made of glass, etc. One surface of the substrate 3 is coated with a thin film, which is nitrided using a technique such as semiconductor manufacturing technology. A resistive layer made of tantalum or the like is formed, and a wiring pattern 4 for applying an electric signal is formed thereon of aluminum, nickel, etc., and a part of the resistive layer is exposed from the pattern 4 to form a heat generating part 5. There is. .
Reference numeral 6 denotes a flexible wiring board bonded to the end of the substrate 3, and the wiring pattern 4 is led out to the wiring board 6, from which electrical signals are applied. 7 is a substrate holding member made of a synthetic resin material, 8 is a recess formed in the upper half of one surface of the member 7, and 9 is a substrate 3 provided extending from the recess 8 to the lower half of the substrate holding member 7. The depth of the recess 9 is set to be approximately the same size as the thickness of the substrate 3. Reference numeral 10 denotes a nozzle plate joint indicated by diagonal lines around the periphery of the recess 8, and numeral 11 represents an ink supply hole provided within the recess 8 of the substrate holding member 6, penetrating the substrate holding member 7. Next, let's talk about assembly.
先づ基板保持部材７の基板嵌合用凹部９に基板
３を嵌合し、接着剤により接合する。而る時は、
基板３の表面と基板保持部材７の凹部８の底面８
ａとは面一となり、フレキシブル配線板６は基板
保持部材７の下半部に垂下される。次に基板保持
部材７の凹部８の周縁のノズル板接合部１０及び
該接合部１０に連続して設けた基板３のノズル板
接合部１２に接着剤を塗布して、前記両接合部１
０，１２上に接着剤の平面を形成後、該平面にノ
ズル板１を当接して、ノズル板１を基板保持部材
７の上半部に接着する。而る時は、基板３の発熱
部５とノズル板１の吐出口２は一致し、且つノズ
ル板１と基板３間、及びノズル板１と基板保持部
材７の凹部８の底面８ａとの間にはギヤツプが形
成され、このギヤツプがインク供給室となる。一
方インク供給穴１１は、基板保持部材７の裏面に
おいて図示省略せるインクタンクに接続され、イ
ンク供給室にはインク供給穴１１を介してインク
が充填される。 First, the substrate 3 is fitted into the substrate fitting recess 9 of the substrate holding member 7 and bonded with an adhesive. When that happens,
The surface of the substrate 3 and the bottom surface 8 of the recess 8 of the substrate holding member 7
a, and the flexible wiring board 6 is suspended from the lower half of the board holding member 7. Next, an adhesive is applied to the nozzle plate joint 10 on the periphery of the recess 8 of the substrate holding member 7 and the nozzle plate joint 12 of the substrate 3 provided continuously to the joint 10, so that both the joints 1
After forming a flat surface of adhesive on 0 and 12, the nozzle plate 1 is brought into contact with the flat surface to adhere the nozzle plate 1 to the upper half of the substrate holding member 7. At that time, the heat generating part 5 of the substrate 3 and the discharge port 2 of the nozzle plate 1 are aligned, and the space between the nozzle plate 1 and the substrate 3 and between the nozzle plate 1 and the bottom surface 8a of the recess 8 of the substrate holding member 7 is A gap is formed in the ink supply chamber, and this gap becomes an ink supply chamber. On the other hand, the ink supply hole 11 is connected to an ink tank (not shown) on the back surface of the substrate holding member 7, and the ink supply chamber is filled with ink through the ink supply hole 11.
上記の如くに組立てられた記録ヘツドは、フレ
キシブル配線板６の配線パターン４より電気信号
を任意の発熱部５に加えることにより、発熱部５
に熱エネルギーが発生し、発熱部５に接触してい
るインク中に気泡が発生し、発熱部５に対向する
ノズル板１の吐出口２よりインクが吐出し、記録
紙に印字される。 The recording head assembled as described above is constructed by applying an electric signal to any heat generating part 5 from the wiring pattern 4 of the flexible wiring board 6.
Thermal energy is generated, bubbles are generated in the ink that is in contact with the heat generating part 5, and the ink is ejected from the ejection port 2 of the nozzle plate 1 facing the heat generating part 5, thereby printing on the recording paper.
このように、インク供給穴１１は樹脂よりなる
基板保持部材７に設けられているので、基板保持
部材７をモールド等の絶縁物で成型する際同時に
形成出来、従つて、製造工程は簡単で製造コスト
は安く出来、またインク供給穴１１の形状、寸法
等を安定に維持することが出来る。 In this way, since the ink supply holes 11 are provided in the substrate holding member 7 made of resin, they can be formed at the same time when the substrate holding member 7 is molded with an insulating material such as a mold, and therefore the manufacturing process is simple and easy to manufacture. The cost can be reduced, and the shape, dimensions, etc. of the ink supply hole 11 can be stably maintained.
〔考案の効果〕
以上説明したように、本考案によれば、発熱部
を有する基板に対してインク供給穴を加工する必
要がなくなり、合成樹脂製の基板保持部材を成形
する際、該基板保持部材にインク供給穴を同時に
形成できるため、その製造工程は簡単で、製造コ
ストの低減が可能であり、またインク供給穴の形
状、寸法を安定に維持することが出来るという効
果を有する。[Effects of the invention] As explained above, according to the invention, it is no longer necessary to form an ink supply hole in a substrate having a heat generating part, and when molding a substrate holding member made of synthetic resin, the substrate holding member is Since the ink supply hole can be formed in the member at the same time, the manufacturing process is simple, the manufacturing cost can be reduced, and the shape and dimensions of the ink supply hole can be stably maintained.
第１図は本考案の実施例の分解斜視図、第２図
及び第３図は従来例を示し、第２図は分解斜視
図、第３図は第２図のＡ−Ａ線における断面図で
ある。
１……ノズル板、２……吐出口、３……基板、
５……発熱部、７……基板保持部材、８……凹
部、８ａ……底面、９……基板嵌合用凹部、１
０，１２……ノズル板接合部、１１……インク供
給穴。
Fig. 1 is an exploded perspective view of an embodiment of the present invention, Figs. 2 and 3 show a conventional example, Fig. 2 is an exploded perspective view, and Fig. 3 is a sectional view taken along line A-A in Fig. 2. It is. 1...Nozzle plate, 2...Discharge port, 3...Substrate,
5... Heat generating part, 7... Board holding member, 8... Recessed part, 8a... Bottom surface, 9... Recessed part for board fitting, 1
0, 12... Nozzle plate joint, 11... Ink supply hole.
Claims (1)
ンク供給穴を有する合成樹脂製の基板保持部材
と、前記基板嵌合用凹部内に配設された発熱部を
有する基板と、少なくとも前記インク供給穴と前
記発熱部を覆うように前記基板保持部材に接合さ
れたインク吐出口を有するノズル板とを備え、前
記ノズル板と前記基板保持部材および前記基板と
の間にインク供給室となるギヤツプを形成し、前
記インク供給穴を通つて前記インク供給室にイン
クが充填されるように構成したことを特徴とする
記録ヘツド。 a substrate holding member made of synthetic resin having a board fitting recess and an ink supply hole bored around the board fitting recess, a board having a heat generating part disposed in the board fitting recess, and at least the ink supply hole. a nozzle plate having an ink ejection port joined to the substrate holding member so as to cover the heat generating part, and a gap serving as an ink supply chamber is formed between the nozzle plate, the substrate holding member, and the substrate. . A recording head characterized in that the ink supply chamber is filled with ink through the ink supply hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984197951U JPH0226677Y2 (en) | 1984-12-29 | 1984-12-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984197951U JPH0226677Y2 (en) | 1984-12-29 | 1984-12-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61115643U JPS61115643U (en) | 1986-07-22 |
| JPH0226677Y2 true JPH0226677Y2 (en) | 1990-07-19 |
Family
ID=30756529
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984197951U Expired JPH0226677Y2 (en) | 1984-12-29 | 1984-12-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0226677Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60219061A (en) * | 1984-04-17 | 1985-11-01 | Canon Inc | Liquid injection recording head |
-
1984
- 1984-12-29 JP JP1984197951U patent/JPH0226677Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60219061A (en) * | 1984-04-17 | 1985-11-01 | Canon Inc | Liquid injection recording head |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61115643U (en) | 1986-07-22 |
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