JPH02264495A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPH02264495A
JPH02264495A JP8596989A JP8596989A JPH02264495A JP H02264495 A JPH02264495 A JP H02264495A JP 8596989 A JP8596989 A JP 8596989A JP 8596989 A JP8596989 A JP 8596989A JP H02264495 A JPH02264495 A JP H02264495A
Authority
JP
Japan
Prior art keywords
semiconductor device
recognition mark
mark
thick film
conductor pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8596989A
Other languages
Japanese (ja)
Inventor
Hajime Kato
肇 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP8596989A priority Critical patent/JPH02264495A/en
Publication of JPH02264495A publication Critical patent/JPH02264495A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

Landscapes

  • Structure Of Printed Boards (AREA)

Abstract

PURPOSE:To improve components in accuracy of mounting position and to miniaturize a device of this design by a method wherein a part of a conductor pattern formed on a semiconductor board is used as a recognition mark. CONSTITUTION:A conductor pattern 2 is formed on a thick film board 1, and a recognition mark 4 is formed on the part of the pattern 2. Therefore, the mark 4 can be lessened in space as compared with a conventional one, so that the board 1 can be made small in size.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、導体パターンの一部をアライメントマーク
として使用した半導体装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor device using a part of a conductive pattern as an alignment mark.

〔従来の技術〕[Conventional technology]

第２図は従来の半導体装置の例としての厚膜基板の上面
図であり、図にお込て＋ｌｌは厚膜基板。FIG. 2 is a top view of a thick film substrate as an example of a conventional semiconductor device, and +ll in the figure indicates a thick film substrate.

２１は厚膜基板…に形成した導体パターン、　１３１は
認識マークである。21 is a conductive pattern formed on a thick film substrate, and 131 is a recognition mark.

次に動作ＶＣついて説明する。厚膜基板山上に。Next, the operational VC will be explained. On top of the thick film substrate.

半導体素子やその他部品を塔載する時、２ポイントの認
識マーク（３：に対し部品の〃補正をしている。When mounting semiconductor devices and other parts, the parts are corrected for the 2-point recognition mark (3).

〔＠明が解決しようとする課題〕[@Issues that Ming is trying to solve]

従来の半導体装置は１以上のように構成されているので
、厚膜基板上の有効スペース１に認識マーク；３１によ
り制限され、小型化の弊害となっていた。Since a conventional semiconductor device has one or more configurations, the effective space 1 on the thick film substrate is limited by the recognition mark 31, which has been an impediment to miniaturization.

この発明は上記のような問題点を解決するためになされ
たもので、導体パターンの一部に認識マークを設け、小
型化された半導体装置を得ることを目的とする。The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a recognition mark on a part of a conductor pattern to obtain a miniaturized semiconductor device.

〔課題を解決するための手段〕[Means to solve the problem]

この発明〆係る半導体装置は半導体基板上の導体パター
ンの一部ヤ使用して、認識マークとしたものである。A semiconductor device according to the present invention uses a portion of a conductor pattern on a semiconductor substrate as a recognition mark.

〔作用〕[Effect]

この発明ＶＣおける半導体装置のＡｉ！！識マークは従
来に比べ半導体基板上の対角の位１１Ｋｇ織マークを形
成し易くなるため、小型化とともに塔械楕度を向上する
働きもする。Ai! of the semiconductor device in this invention VC! ! The identification mark is easier to form as a diagonal 11 kg weave mark on a semiconductor substrate than in the past, so it also works to reduce the size and improve the ellipticity of the structure.

〔実施例） 第１図は、この発明の一実施例である半導体！ｆｌの上
面図である。[Example] Figure 1 shows a semiconductor that is an example of this invention! It is a top view of fl.

図において田は厚膜基板、（２１は導体・（ターン。In the figure, 21 is a thick film substrate, and 21 is a conductor (turn).

４：は認識マークである。4: is a recognition mark.

認識マーク＋４１ｔｌｌｊ、４体パターン＋２１の一部
へ形収し九ものである。The recognition mark +41tllj is a part of the 4-body pattern +21.

久に動作ＹＣついて説明する。I will explain the operation YC soon.

認識マーク蒐４１の部分の導体パターン１２１の間隔は
、認識マーク＋４１の部分がＲＧＯｐｍ、導体パターン
（！１とのスペースが２００＃ｍなので、最小８ＳＯμ
ｍとな・る。The distance between the conductor patterns 121 in the part of the recognition mark 41 is RGOpm in the part of the recognition mark +41, and the space with the conductor pattern (!1) is 200#m, so the minimum is 8SOμ.
m and na・ru.

一方、第２図に示す従来の認１ｆｌ−ｔ−りＩｌ＋の位
置では導体パターン１對の間隔は最小？００５ｍを・〃
する。On the other hand, in the conventional recognition 1fl-t-Il+ position shown in FIG. 2, is the distance between each conductor pattern the minimum? 005m.
do.

以上により、この発明では認識マーク１４１０部分のス
ペースが少なくてすむため厚膜基板中の小型化ができる
。As described above, in the present invention, the space required for the recognition mark 1410 portion can be reduced, so that the size of the thick film substrate can be reduced.

〔発明の効果〕 以上のように、この発明によれば半導体装置の半導体基
板が小型化でき、塔載位置精度の向上が行なえる。[Effects of the Invention] As described above, according to the present invention, the semiconductor substrate of a semiconductor device can be downsized and the mounting position accuracy can be improved.

【図面の簡単な説明】[Brief explanation of drawings]

第１図汀この発明の一実施例における半導体装置の、上
面図、第２図に従来の半導体装置を示す上面図である。 図において、・４１は厚膜基板、１２）は導体パターン
、（４１はｒｈｇｍマークである。 なお１図中、同一符号は向−ま九は相当部分？示す。FIG. 1 is a top view of a semiconductor device according to an embodiment of the present invention, and FIG. 2 is a top view of a conventional semiconductor device. In the figure, 41 is a thick film substrate, 12 is a conductor pattern, and 41 is a rhgm mark. In the figure, the same reference numerals indicate corresponding parts.

Claims (1)

【特許請求の範囲】[Claims] 半導体基板において、部品塔載のための認識マークを上
記半導体基板の導体パターンの一部に形成することで半
導体基板を小型化したことを特徴とする半導体装置。1. A semiconductor device, wherein a semiconductor substrate is miniaturized by forming a recognition mark for mounting components on a part of a conductive pattern of the semiconductor substrate.
JP8596989A 1989-04-05 1989-04-05 Semiconductor device Pending JPH02264495A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8596989A JPH02264495A (en) 1989-04-05 1989-04-05 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8596989A JPH02264495A (en) 1989-04-05 1989-04-05 Semiconductor device

Publications (1)

Publication Number Publication Date
JPH02264495A true JPH02264495A (en) 1990-10-29

Family

ID=13873557

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8596989A Pending JPH02264495A (en) 1989-04-05 1989-04-05 Semiconductor device

Country Status (1)

Country Link
JP (1) JPH02264495A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009026823A (en) * 2007-07-17 2009-02-05 Toshiba Corp Printed wiring board, and electronic device
JP2009206367A (en) * 2008-02-28 2009-09-10 Hitachi Ltd Wiring board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009026823A (en) * 2007-07-17 2009-02-05 Toshiba Corp Printed wiring board, and electronic device
JP2009206367A (en) * 2008-02-28 2009-09-10 Hitachi Ltd Wiring board

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