JPH05326202A - Chip component - Google Patents

Abstract

PURPOSE:To arrange chip components which have a plurality of terminal electrodes forming an asymmetric electric circuit at an edge of a board in the same circuit direction only through an optical method without requiring any electrical measurement. CONSTITUTION:Terminal electrodes 12a, 12b, 12c, 12d are provided at four protruding or recessed parts of an insulating board 11 having four recesses or protrusions at an edge. A dielectric film 13 is formed between the terminal electrodes 12a, 12d while a resistor film 14 is formed between the terminal electrodes 12b, 12c. A white protective film 15 is then applied on the surface of a chip component whereas a black protective film 17 is applied on the rear of the chip component except the edge part at the end of terminal electrode and a black seal 17 is put locally at a point close to one edge on the white protective film 15. This constitution facilitates arrangement of circuit direction only through an optical method.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit asymmetric chip component.

[0002]

2. Description of the Related Art In recent years, chip components such as chip resistors and chip capacitors have been required to be downsized in order to reduce the circuit board area accompanying the miniaturization of electronic devices. The demand for composite chip parts formed in multiple pieces is also increasing. Conventionally, a composite chip part having a plurality of resistors and capacitors formed therein is symmetrical in terms of electric circuit. The conventional composite chip part will be described below.

FIG. 3 is a top view of a conventional composite chip part in which two film resistors are independently formed. In FIG. 3, reference numeral 1 denotes a rectangular insulating substrate made of alumina or the like, and two concave portions are provided at one edge and two concave portions are provided at the opposite edge, that is, four concave portions are provided. 2a, 2b, 2c, 2d are terminal electrodes,
It is formed from the concave portion of the insulating substrate 1 to the front and back surfaces of the substrate. Although not shown in the figure, a film resistor having the same resistance value is formed between the terminal electrodes 2a and 2d and between the terminal electrodes 2b and 2c. Reference numeral 3 is a black protective coat, which covers the surface of the substrate except the terminal edge portions of the terminal electrodes 2a, 2b, 2c and 2d.

In case of completion inspection and taping of this chip part, if a photoelectric sensor is provided in the parts feeder so that the light reflectance at a predetermined position can be measured from the reference guide, as shown in FIG. If the condition is set so that the one with low light reflectance in the central part of the substrate is a good product and the one with high light reflectance at the edge of the substrate is a good product in the second step, the substrate on the surface and with the terminal electrode The edges can be aligned in the same direction and fed to the completion inspection and taping section.

[0005]

However, in the chip component constructed as described above, it is not possible to identify either one of the two terminal electrode side edges, so that the resistance values of the two membrane resistors are different from each other. When an asymmetrical electric circuit is formed, such as different ones, or one of which is a different membrane circuit element such as a membrane capacitor, etc., as shown in FIG. However, there was a problem in that the ability to judge whether or not the product could not be supplied in a uniform manner was significantly reduced.

The present invention solves the above-mentioned conventional problems, and an object of the present invention is to align the circuit direction of a rectangular chip component having an asymmetrical electric circuit in one direction only by an optical method.

[0007]

In order to achieve the above-mentioned object, a chip composite function element of the present invention comprises a rectangular insulating substrate having a plurality of terminal electrodes at its edges and a plurality of terminal electrodes. One or a plurality of film circuit elements formed asymmetrically in an electric circuit, a white protective film that covers the surface of the insulating substrate excluding the edge portion, and the back surface of the insulating substrate with the edge portion. It is provided with a black protective film to be removed and covered, and a black stamp locally provided on the white protective film near one edge.

[0008]

With this configuration, the front and back can be judged by the difference in light reflectance as in the conventional case, and the light reflectance of the black marking part can be obtained only when a specific edge of the rectangular chip part comes to the reference guide. If the position of the photoelectric sensor is set so that it can be measured, the light reflectance of the white protective film is measured when the remaining edge comes to the reference guide. The chip parts can be aligned in the direction of the specific edge, and the circuit directions of the rectangular chip parts which are asymmetrical in terms of electric circuit can be easily aligned and supplied to the completion inspection and taping section.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The chip parts of the present invention will be described below with reference to the drawings.

1A, 1B and 1C are a front side top view, a back side top view and an equivalent circuit diagram of a chip part according to an embodiment of the present invention, respectively. In FIG. 1, 11 is a rectangular insulating substrate made of alumina or the like, which has two concave portions at one edge portion and two concave portions at its opposite edge portion. From the four recesses to the front and back surfaces of the insulating substrate 11, the terminal electrodes 12a, 12b,
12c and 12d are provided. 13 is a terminal electrode 12
Membrane dielectric formed between a and 12d, 14 is terminal electrode 1
It is a film resistor formed between 2b and 12c. 15 is a white protective film on the surface of the chip component, 16 is a white protective film 15
A black marking 17 that is locally provided near the edge of the top, 17
Is a black protective film on the back surface.

In the chip component constructed as described above,
As shown in FIG. 2, the photoelectric sensor of the first step is installed at the position where the light reflectance of the central portion of the substrate is measured with respect to the reference guide, and the one having the higher light reflectance is regarded as a non-defective product. If the photoelectric sensor is installed at the position where the light reflectance of the edge of the substrate is measured with respect to the reference guide, and the condition is set so that the one with lower light reflectance is a good product, the black marking on the surface will be localized. Only when the edge of the substrate that is present reaches the reference guide, it is determined as a non-defective product, and the directions can be aligned so that the terminal electrodes 12a are always in the same position.

When only one side of the substrate is covered with a protective film, if the substrate is white, a black protective film and a white marking may be combined, and if the substrate is black, a white protective film is used. The same effect as in the present embodiment can be obtained by combining the above and the black marking. However, since the terminal electrode is considered to be the same as the white marking in terms of light reflectance, when providing the white marking on the black protective film, make the distance of the white marking from the edge of the substrate larger than that of the terminal electrode. There is a need.

[0013]

As described above, according to the present invention, the position of each terminal electrode of a rectangular chip component having a plurality of terminal electrodes at the edge of the substrate and forming an asymmetrical electric circuit is determined by the optical position. It is possible to easily align the circuits in the same direction by using only the conventional method.

[Brief description of drawings]

FIG. 1A is a front side top view of a chip part according to an embodiment of the present invention. FIG. 1B is a back side top view of a chip part according to the embodiment. FIG. 1C is an equivalent circuit diagram of the chip part according to the embodiment.

FIG. 2 is a schematic diagram showing an example of a method for aligning the circuit directions of chip components according to an embodiment of the present invention.

3A is a front side top view of a conventional chip part, FIG. 3B is a front side top view of a conventional chip part, and FIG. 3C is an equivalent circuit diagram of the conventional chip part.

FIG. 4 is a schematic diagram showing an example of a conventional method for aligning the directions of chip components.

[Explanation of symbols]

 11 Insulating Substrate 12a, 12b, 12c, 12d Terminal Electrode 13 Membrane Dielectric 14 Membrane Resistor 15 White Protective Film 16 Black Marking 17 Black Protective Film

 ─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Koji Nishida 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Harukakazu Nakano, 1006 Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd.

Claims (3)

[Claims] 1. A rectangular insulating substrate having a plurality of terminal electrodes on an edge thereof, and one or a plurality of film circuit elements asymmetrically formed between the plurality of terminal electrodes in terms of an electric circuit. A white protective film that covers the surface of the insulating substrate excluding the edge portions, a black protective film that covers the back surface of the insulating substrate excluding the edge portions, and a portion of the white protective film near the edge. A chip part provided with a black marking locally provided on the. 2. A rectangular white insulating substrate having a plurality of terminal electrodes at its edges, and one or a plurality of film circuit elements electrically asymmetrically formed between the plurality of terminal electrodes. A chip component comprising: a black protective film that covers the surface of the insulating substrate excluding the edge portion; and a white marking locally provided near the one edge of the black protective film. 3. A rectangular black insulating substrate having a plurality of terminal electrodes at its edges, and one or a plurality of film circuit elements electrically asymmetrically formed between the plurality of terminal electrodes. A chip component comprising: a white protective film that covers the surface of the insulating substrate excluding the edge portion; and a black marking locally provided near the one edge of the white protective film.