JPH0226259U - - Google Patents

Info

Publication number
JPH0226259U
JPH0226259U JP10505688U JP10505688U JPH0226259U JP H0226259 U JPH0226259 U JP H0226259U JP 10505688 U JP10505688 U JP 10505688U JP 10505688 U JP10505688 U JP 10505688U JP H0226259 U JPH0226259 U JP H0226259U
Authority
JP
Japan
Prior art keywords
semiconductor element
element pellet
lid
pair
main electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10505688U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0617316Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988105056U priority Critical patent/JPH0617316Y2/ja
Publication of JPH0226259U publication Critical patent/JPH0226259U/ja
Application granted granted Critical
Publication of JPH0617316Y2 publication Critical patent/JPH0617316Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1988105056U 1988-08-09 1988-08-09 半導体装置 Expired - Lifetime JPH0617316Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988105056U JPH0617316Y2 (ja) 1988-08-09 1988-08-09 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988105056U JPH0617316Y2 (ja) 1988-08-09 1988-08-09 半導体装置

Publications (2)

Publication Number Publication Date
JPH0226259U true JPH0226259U (fi) 1990-02-21
JPH0617316Y2 JPH0617316Y2 (ja) 1994-05-02

Family

ID=31337331

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988105056U Expired - Lifetime JPH0617316Y2 (ja) 1988-08-09 1988-08-09 半導体装置

Country Status (1)

Country Link
JP (1) JPH0617316Y2 (fi)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6393126A (ja) * 1986-10-08 1988-04-23 Fuji Electric Co Ltd 半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6393126A (ja) * 1986-10-08 1988-04-23 Fuji Electric Co Ltd 半導体装置

Also Published As

Publication number Publication date
JPH0617316Y2 (ja) 1994-05-02

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